AU2003234184A1 - Electrical contacts for flexible displays - Google Patents

Electrical contacts for flexible displays

Info

Publication number
AU2003234184A1
AU2003234184A1 AU2003234184A AU2003234184A AU2003234184A1 AU 2003234184 A1 AU2003234184 A1 AU 2003234184A1 AU 2003234184 A AU2003234184 A AU 2003234184A AU 2003234184 A AU2003234184 A AU 2003234184A AU 2003234184 A1 AU2003234184 A1 AU 2003234184A1
Authority
AU
Australia
Prior art keywords
electrical contacts
flexible displays
displays
flexible
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003234184A
Other languages
English (en)
Inventor
Randolph W. Eisenhardt
Glenn W. Gengel
Anno Hermanns
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alien Technology LLC
Original Assignee
Alien Technology LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alien Technology LLC filed Critical Alien Technology LLC
Publication of AU2003234184A1 publication Critical patent/AU2003234184A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387Flexible insulating substrates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/131Interconnections, e.g. wiring lines or terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12044OLED
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0017Etching of the substrate by chemical or physical means
    • H05K3/0026Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/19Segment displays

Landscapes

  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Structure Of Printed Boards (AREA)
AU2003234184A 2002-04-23 2003-04-22 Electrical contacts for flexible displays Abandoned AU2003234184A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/131,517 US6864435B2 (en) 2001-04-25 2002-04-23 Electrical contacts for flexible displays
US10/131,517 2002-04-23
PCT/US2003/012540 WO2003092073A2 (en) 2002-04-23 2003-04-22 Electrical contacts for flexible displays

Publications (1)

Publication Number Publication Date
AU2003234184A1 true AU2003234184A1 (en) 2003-11-10

Family

ID=29268732

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003234184A Abandoned AU2003234184A1 (en) 2002-04-23 2003-04-22 Electrical contacts for flexible displays

Country Status (7)

Country Link
US (2) US6864435B2 (enExample)
EP (1) EP1497865A2 (enExample)
JP (1) JP2005524109A (enExample)
KR (1) KR20040102168A (enExample)
CN (1) CN1322587C (enExample)
AU (1) AU2003234184A1 (enExample)
WO (1) WO2003092073A2 (enExample)

Families Citing this family (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10053334B4 (de) * 2000-10-27 2018-08-02 Robert Bosch Gmbh Verfahren und Vorrichtung zur Steuerung eines Stellelements in einem Fahrzeug
KR20050086839A (ko) * 2002-11-26 2005-08-30 이 잉크 코포레이션 가요성 전자 회로 및 디스플레이
US7236151B2 (en) * 2004-01-28 2007-06-26 Kent Displays Incorporated Liquid crystal display
WO2005072447A2 (en) * 2004-01-28 2005-08-11 Kent Displays Incorporated Liquid crystal display films
US7737928B2 (en) * 2003-07-02 2010-06-15 Kent Displays Incorporated Stacked display with shared electrode addressing
US8199086B2 (en) 2004-01-28 2012-06-12 Kent Displays Incorporated Stacked color photodisplay
CN1975521A (zh) * 2004-01-28 2007-06-06 肯特显示器公司 一种液晶显示器
WO2005073705A1 (de) * 2004-01-29 2005-08-11 Siemens Aktiengesellschaft Elektrochemisches transducer-array und dessen verwendung
US20080055581A1 (en) * 2004-04-27 2008-03-06 Rogers John A Devices and methods for pattern generation by ink lithography
KR101185613B1 (ko) * 2004-04-27 2012-09-24 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 소프트 리소그래피용 복합 패터닝 장치
US7521292B2 (en) 2004-06-04 2009-04-21 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
US8217381B2 (en) 2004-06-04 2012-07-10 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
US7557367B2 (en) 2004-06-04 2009-07-07 The Board Of Trustees Of The University Of Illinois Stretchable semiconductor elements and stretchable electrical circuits
US7943491B2 (en) 2004-06-04 2011-05-17 The Board Of Trustees Of The University Of Illinois Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp
US7799699B2 (en) 2004-06-04 2010-09-21 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
US7251882B2 (en) 2004-09-03 2007-08-07 Eastman Kodak Company Method for assembling micro-components to binding sites
US7629026B2 (en) * 2004-09-03 2009-12-08 Eastman Kodak Company Thermally controlled fluidic self-assembly
US20060051517A1 (en) * 2004-09-03 2006-03-09 Eastman Kodak Company Thermally controlled fluidic self-assembly method and support
US20060202925A1 (en) * 2004-12-07 2006-09-14 William Manning Remote cholesteric display
US7687277B2 (en) * 2004-12-22 2010-03-30 Eastman Kodak Company Thermally controlled fluidic self-assembly
CA2592055A1 (en) 2004-12-27 2006-07-06 Quantum Paper, Inc. Addressable and printable emissive display
US7301458B2 (en) * 2005-05-11 2007-11-27 Alien Technology Corporation Method and apparatus for testing RFID devices
US7329942B2 (en) * 2005-05-18 2008-02-12 Ching-Fu Tsou Array-type modularized light-emitting diode structure and a method for packaging the structure
US7829147B2 (en) 2005-08-18 2010-11-09 Corning Incorporated Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device
US7722929B2 (en) 2005-08-18 2010-05-25 Corning Incorporated Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device
US20070040501A1 (en) 2005-08-18 2007-02-22 Aitken Bruce G Method for inhibiting oxygen and moisture degradation of a device and the resulting device
US7791700B2 (en) * 2005-09-16 2010-09-07 Kent Displays Incorporated Liquid crystal display on a printed circuit board
EP1991723A2 (en) 2006-03-03 2008-11-19 The Board Of Trustees Of The University Of Illinois Methods of making spatially aligned nanotubes and nanotube arrays
KR100829392B1 (ko) * 2006-08-24 2008-05-13 동부일렉트로닉스 주식회사 SoC 및 그 제조 방법
US8017220B2 (en) * 2006-10-04 2011-09-13 Corning Incorporated Electronic device and method of making
US8115326B2 (en) 2006-11-30 2012-02-14 Corning Incorporated Flexible substrates having a thin-film barrier
JP5700750B2 (ja) 2007-01-17 2015-04-15 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ 印刷ベースの組立により製作される光学システム
US8846457B2 (en) 2007-05-31 2014-09-30 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US9343593B2 (en) 2007-05-31 2016-05-17 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US8133768B2 (en) * 2007-05-31 2012-03-13 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system
US8852467B2 (en) 2007-05-31 2014-10-07 Nthdegree Technologies Worldwide Inc Method of manufacturing a printable composition of a liquid or gel suspension of diodes
US8456393B2 (en) 2007-05-31 2013-06-04 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system
US8674593B2 (en) 2007-05-31 2014-03-18 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US8877101B2 (en) 2007-05-31 2014-11-04 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, power generating or other electronic apparatus
US9425357B2 (en) 2007-05-31 2016-08-23 Nthdegree Technologies Worldwide Inc. Diode for a printable composition
US9534772B2 (en) 2007-05-31 2017-01-03 Nthdegree Technologies Worldwide Inc Apparatus with light emitting diodes
US9419179B2 (en) 2007-05-31 2016-08-16 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US9018833B2 (en) 2007-05-31 2015-04-28 Nthdegree Technologies Worldwide Inc Apparatus with light emitting or absorbing diodes
US8415879B2 (en) 2007-05-31 2013-04-09 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US8889216B2 (en) 2007-05-31 2014-11-18 Nthdegree Technologies Worldwide Inc Method of manufacturing addressable and static electronic displays
US8809126B2 (en) 2007-05-31 2014-08-19 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
KR100974816B1 (ko) * 2008-02-27 2010-08-10 주식회사 비즈모델라인 전자부품에 알에프아이디 태그 내장 방법 및 시스템과 이를위한 기록매체
WO2009111641A1 (en) 2008-03-05 2009-09-11 The Board Of Trustees Of The University Of Illinois Stretchable and foldable electronic devices
DE102008013031B4 (de) 2008-03-07 2019-07-25 Osram Oled Gmbh Optoelektronisches Bauelement
US8470701B2 (en) * 2008-04-03 2013-06-25 Advanced Diamond Technologies, Inc. Printable, flexible and stretchable diamond for thermal management
US7992332B2 (en) 2008-05-13 2011-08-09 Nthdegree Technologies Worldwide Inc. Apparatuses for providing power for illumination of a display object
US8127477B2 (en) 2008-05-13 2012-03-06 Nthdegree Technologies Worldwide Inc Illuminating display systems
US8946683B2 (en) * 2008-06-16 2015-02-03 The Board Of Trustees Of The University Of Illinois Medium scale carbon nanotube thin film integrated circuits on flexible plastic substrates
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8886334B2 (en) * 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
WO2010042653A1 (en) * 2008-10-07 2010-04-15 Mc10, Inc. Catheter balloon having stretchable integrated circuitry and sensor array
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US8372726B2 (en) * 2008-10-07 2013-02-12 Mc10, Inc. Methods and applications of non-planar imaging arrays
US8049327B2 (en) * 2009-01-05 2011-11-01 Taiwan Semiconductor Manufacturing Company, Ltd. Through-silicon via with scalloped sidewalls
TWI671811B (zh) 2009-05-12 2019-09-11 美國伊利諾大學理事會 用於可變形及半透明顯示器之超薄微刻度無機發光二極體之印刷總成
WO2011041727A1 (en) 2009-10-01 2011-04-07 Mc10, Inc. Protective cases with integrated electronics
US20110218756A1 (en) * 2009-10-01 2011-09-08 Mc10, Inc. Methods and apparatus for conformal sensing of force and/or acceleration at a person's head
JP6046491B2 (ja) 2009-12-16 2016-12-21 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ コンフォーマル電子機器を使用した生体内での電気生理学
US9936574B2 (en) 2009-12-16 2018-04-03 The Board Of Trustees Of The University Of Illinois Waterproof stretchable optoelectronics
US10441185B2 (en) 2009-12-16 2019-10-15 The Board Of Trustees Of The University Of Illinois Flexible and stretchable electronic systems for epidermal electronics
CN105496423A (zh) * 2010-03-17 2016-04-20 伊利诺伊大学评议会 基于生物可吸收基质的可植入生物医学装置
US9442285B2 (en) 2011-01-14 2016-09-13 The Board Of Trustees Of The University Of Illinois Optical component array having adjustable curvature
WO2012158709A1 (en) 2011-05-16 2012-11-22 The Board Of Trustees Of The University Of Illinois Thermally managed led arrays assembled by printing
JP2014523633A (ja) 2011-05-27 2014-09-11 エムシー10 インコーポレイテッド 電子的、光学的、且つ/又は機械的装置及びシステム並びにこれらの装置及びシステムを製造する方法
US8934965B2 (en) 2011-06-03 2015-01-13 The Board Of Trustees Of The University Of Illinois Conformable actively multiplexed high-density surface electrode array for brain interfacing
JP6231489B2 (ja) 2011-12-01 2017-11-15 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ プログラム可能な変化を被るように設計された遷移デバイス
KR20150004819A (ko) 2012-03-30 2015-01-13 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 표면에 상응하는 부속체 장착가능한 전자 장치
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
US9075199B2 (en) 2012-10-30 2015-07-07 Apple Inc. Displays with polarizer layers for electronic devices
BR112017025609A2 (pt) 2015-06-01 2018-08-07 The Board Of Trustees Of The University Of Illinois sistemas eletrônicos miniaturizados com potência sem fio e capacidades de comunicação de campo próximo
JP2018524566A (ja) 2015-06-01 2018-08-30 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ 代替的uvセンシング手法
US11532259B2 (en) * 2015-09-25 2022-12-20 Apple Inc. Row driver configuration
US10925543B2 (en) 2015-11-11 2021-02-23 The Board Of Trustees Of The University Of Illinois Bioresorbable silicon electronics for transient implants
DE102016112104A1 (de) 2016-07-01 2018-01-04 Osram Opto Semiconductors Gmbh Modulares modul
CN108682305B (zh) * 2018-05-21 2021-04-27 京东方科技集团股份有限公司 柔性基板及其制备方法、和柔性显示装置

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5065227A (en) * 1990-06-04 1991-11-12 International Business Machines Corporation Integrated circuit packaging using flexible substrate
US5111278A (en) * 1991-03-27 1992-05-05 Eichelberger Charles W Three-dimensional multichip module systems
JP3246927B2 (ja) * 1991-09-17 2002-01-15 電気化学工業株式会社 フレキシブルマトリックス回路基板及び表示板
FR2708170B1 (fr) * 1993-07-19 1995-09-08 Innovation Dev Cie Gle Circuits électroniques à très haute conductibilité et de grande finesse, leurs procédés de fabrication, et dispositifs les comprenant.
US5545291A (en) * 1993-12-17 1996-08-13 The Regents Of The University Of California Method for fabricating self-assembling microstructures
US5824186A (en) * 1993-12-17 1998-10-20 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US5783360A (en) * 1994-04-13 1998-07-21 Flex Products, Inc. Flexible optical medium with dielectric protective overcoat
JP2863094B2 (ja) * 1994-08-05 1999-03-03 矢崎総業株式会社 配線板の接続方法
DE19527359A1 (de) * 1995-07-26 1997-02-13 Giesecke & Devrient Gmbh Schaltungseinheit und Verfahren zur Herstellung einer Schaltungseinheit
ATE297573T1 (de) * 1995-08-01 2005-06-15 Austria Card Datenträger mit einem einen bauteil aufweisenden modul und mit einer spule und verfahren zum herstellen eines solchen datenträgers
JP3387714B2 (ja) * 1995-12-11 2003-03-17 キヤノン株式会社 電子源とその製造装置及び製造方法及び画像形成装置
JP3900630B2 (ja) * 1997-12-03 2007-04-04 株式会社デンソー リモートidタグ
TW407364B (en) * 1998-03-26 2000-10-01 Toshiba Corp Memory apparatus, card type memory apparatus, and electronic apparatus
JP2000105548A (ja) * 1998-07-31 2000-04-11 Denso Corp 表示パネル用電極基板及びその製造方法
DE19840220A1 (de) * 1998-09-03 2000-04-20 Fraunhofer Ges Forschung Transpondermodul und Verfahren zur Herstellung desselben
DE19846237A1 (de) * 1998-10-07 2000-04-13 Fraunhofer Ges Forschung Verfahren zur Herstellung eines Mikrotransponders
US6404643B1 (en) * 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
JP2000132657A (ja) * 1998-10-28 2000-05-12 Dainippon Printing Co Ltd Icカードおよびその製造方法
JP2000286549A (ja) 1999-03-24 2000-10-13 Fujitsu Ltd バイアコネクションを備えた基板の製造方法
WO2001026180A1 (en) 1999-10-04 2001-04-12 Amerasia International Technology, Inc. Tamper-resistant wireless article including an antenna
JP2001242476A (ja) * 2000-02-29 2001-09-07 Seiko Epson Corp 液晶装置及びその製造方法、並びに電子機器
JP4444435B2 (ja) * 2000-03-06 2010-03-31 ソニーケミカル&インフォメーションデバイス株式会社 プリント配線基板及びプリント配線基板の製造方法
JP4489899B2 (ja) * 2000-03-08 2010-06-23 イビデン株式会社 多層プリント配線板用両面回路基板の製造方法
JP2001313181A (ja) * 2000-05-01 2001-11-09 Sony Corp 表示装置及びその製造方法
JP3597769B2 (ja) * 2000-09-18 2004-12-08 シャープ株式会社 電子部品の製造方法
JP2002108252A (ja) * 2000-09-29 2002-04-10 Sanyo Electric Co Ltd エレクトロルミネセンス表示パネル
ATE430377T1 (de) 2001-02-16 2009-05-15 Ignis Innovation Inc Flexible anzeigevorrichtung
US6693384B1 (en) * 2002-02-01 2004-02-17 Alien Technology Corporation Interconnect structure for electronic devices

Also Published As

Publication number Publication date
US6864435B2 (en) 2005-03-08
US20030155151A1 (en) 2003-08-21
CN1322587C (zh) 2007-06-20
KR20040102168A (ko) 2004-12-03
US20050181641A1 (en) 2005-08-18
EP1497865A2 (en) 2005-01-19
WO2003092073A2 (en) 2003-11-06
WO2003092073A3 (en) 2004-05-27
CN1659702A (zh) 2005-08-24
JP2005524109A (ja) 2005-08-11

Similar Documents

Publication Publication Date Title
AU2003234184A1 (en) Electrical contacts for flexible displays
AU2003278386A1 (en) Machanically operable electrical device
AU2002360719A1 (en) Electrical connector
AU2003252010A1 (en) Electrical connector apparatus
AU2003295888A1 (en) Panel mounted electrical connector
AU2003281742A1 (en) Electrical terminal
AU2003285825A1 (en) Electrical contact
AU2003235190A1 (en) Conductive contact
AU2003248593A1 (en) An electrical connector
AU2003302829A1 (en) Electric contact member
AU2003260600A1 (en) Connection device for flexible circuit
AU2003232050A1 (en) Electrical connector
AU2003222608A1 (en) Electrical connectors
AU2003211215A1 (en) Electrical connection device
AU2003290795A1 (en) Flexible cable electrical connector
AU2003209144A1 (en) Electrical connector
AU2003219898A1 (en) Electrical connector assembly
AU2003244448A1 (en) Microengineered electrical connectors
AU2003292026A1 (en) Electrical contact element
AU2003293837A1 (en) Electrical connector
AU2003241031A1 (en) An electrical connector
AU2003267332A1 (en) Electrical circuit arrangement
AU2003227874A1 (en) An electrical connector
AU2003900291A0 (en) Electrical connection device
AU2003272742A1 (en) Electrical connector assembly

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase