KR20030064830A - 상호 연결체 - Google Patents
상호 연결체 Download PDFInfo
- Publication number
- KR20030064830A KR20030064830A KR10-2003-7008112A KR20037008112A KR20030064830A KR 20030064830 A KR20030064830 A KR 20030064830A KR 20037008112 A KR20037008112 A KR 20037008112A KR 20030064830 A KR20030064830 A KR 20030064830A
- Authority
- KR
- South Korea
- Prior art keywords
- pad
- vias
- interconnect
- substrate
- circuit board
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/114—Pad being close to via, but not surrounding the via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
Landscapes
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Semiconductor Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Structure Of Printed Boards (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
Claims (20)
- 패드와,상기 패드에 연결된 적어도 2개의 바이어를 포함하는 것을 특징으로 하는 상호 연결체.
- 제1항에 있어서, 상기 적어도 2개의 바이어 중 적어도 하나는 패드의 대체로 하부에 형성되는 것을 특징으로 하는 상호 연결체.
- 제2항에 있어서, 상기 적어도 2개의 바이어 중 적어도 하나는 제1 폭을 갖는 제1 단부와 제2 폭을 갖는 제2 단부를 구비한 도전성 세그먼트에 의해 패드에 연결되고, 상기 제1 단부는 적어도 2개의 바이어 중 적어도 하나에 접속되고, 상기 제2 단부는 패드에 접속되며, 상기 제1 폭은 제2 폭보다 작은 것을 특징으로 하는 상호 연결체.
- 제2항에 있어서, 상기 패드는 적어도 5개의 대체로 직선인 에지를 갖고, 적어도 2개의 바이어는 3개의 바이어를 포함하며, 상기 3개의 바이어 중 2개만이 대체로 직선인 에지에 연결되는 것을 특징으로 하는 상호 연결체.
- 제4항에 있어서, 상기 3개의 바이어 중 대체로 직선인 에지에 연결된 2개의바이어 중 적어도 하나는 테이퍼진 도전성 세그먼트를 통해 대체로 직선인 에지 중 하나에 연결되는 것을 특징으로 하는 상호 연결체.
- 기판과,상기 기판 상에 형성되고 제1 전위면에 연결된 제1 패드와,상기 기판 상에 형성되고 적어도 3개의 바이어에 의해 제2 전위면에 연결된 제2 패드와,상기 제1 패드를 제2 패드에 연결하는 커패시터를 포함하는 것을 특징으로 하는 회로 기판.
- 제6항에 있어서, 상기 적어도 3개의 바이어 중 적어도 하나는 대체로 제2 패드의 하부에 형성되는 것을 특징으로 하는 회로 기판.
- 제6항에 있어서, 상기 적어도 3개의 바이어의 각각은 대체로 제2 패드의 하부에 형성되는 것을 특징으로 하는 회로 기판.
- 제8항에 있어서, 캐패시터는 고주파수 캐패시터를 포함하는 것을 특징으로 하는 회로 기판.
- 제9항에 있어서, 캐패시터는 세라믹 캐패시터를 포함하는 것을 특징으로 하는 회로 기판.
- 기판과,상기 기판에 형성되며, 상기 기판과 접촉하는 바닥 표면을 갖는 패드와,상기 바닥 표면에 연결되는 적어도 3개의 바이어를 포함하는 것을 특징으로 하는 회로 기판.
- 제11항에 있어서, 패드는 4개의 에지를 갖는 대체로 정방형인 코어 패드와 3개의 비정방형 패드를 포함하며, 상기 3개의 비정방형 패드 각각은 상기 4개의 에지 중 하나에 인접하여 위치되며 4개의 에지 중 하나와 접촉하는 것을 특징으로 하는 회로 기판.
- 제12항에 있어서, 3개의 비정방형 패드 중 적어도 하나는 대체로 삼각형인 패드를 포함하는 것을 특징으로 하는 회로 기판.
- 제13항에 있어서, 대체로 삼각형인 패드는 적어도 3개의 바이어 중 하나에 연결되는 것을 특징으로 하는 회로 기판.
- 제12항에 있어서, 3개의 비정방형 패드 각각은 적어도 3개의 바이어 중 하나에 연결되는 것을 특징으로 하는 회로 기판.
- 상호 연결체를 형성하는 방법이며,기판 내에 적어도 2개의 바이어를 형성하는 단계와,상기 적어도 2개의 바이어 각각을 패드에 연결하는 단계를 포함하는 것을 특징으로 하는 방법.
- 제16항에 있어서, 패드와 적어도 2개의 바이어 각각을 연결시키는 단계는 패드를 적어도 2개의 바이어 중 적어도 하나에 직접 연결시키는 단계를 포함하는 것을 특징으로 하는 방법.
- 제17항에 있어서, 적어도 2개의 바이어 중 적어도 하나를 패드에 연결하기 위해 기판 상에 테이퍼진 도전성 세그먼트를 형성하는 단계를 더 포함하는 것을 특징으로 하는 방법.
- 제18항에 있어서, 집적 회로를 패드에 전기적으로 연결시키는 단계를 더 포함하는 것을 특징으로 하는 방법.
- 제19항에 있어서, 집적 회로를 패드에 전기적으로 연결시키는 단계는 집적 회로와 패드 사이에 땜납 요소를 삽입하는 단계를 포함하는 것을 특징으로 하는 방법.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/740,103 | 2000-12-18 | ||
US09/740,103 US7088002B2 (en) | 2000-12-18 | 2000-12-18 | Interconnect |
PCT/US2001/044651 WO2002063934A1 (en) | 2000-12-18 | 2001-11-20 | Interconnect |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030064830A true KR20030064830A (ko) | 2003-08-02 |
KR100560571B1 KR100560571B1 (ko) | 2006-03-14 |
Family
ID=24975046
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020037008112A KR100560571B1 (ko) | 2000-12-18 | 2001-11-20 | 상호 연결체 |
Country Status (7)
Country | Link |
---|---|
US (3) | US7088002B2 (ko) |
EP (1) | EP1344433A1 (ko) |
JP (1) | JP4027802B2 (ko) |
KR (1) | KR100560571B1 (ko) |
CN (1) | CN1290386C (ko) |
MY (1) | MY137665A (ko) |
WO (1) | WO2002063934A1 (ko) |
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US7902654B2 (en) * | 2006-05-10 | 2011-03-08 | Qualcomm Incorporated | System and method of silicon switched power delivery using a package |
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US20130320522A1 (en) * | 2012-05-30 | 2013-12-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Re-distribution Layer Via Structure and Method of Making Same |
US9338627B1 (en) | 2015-01-28 | 2016-05-10 | Arati P Singh | Portable device for indicating emergency events |
US10993325B2 (en) | 2019-07-31 | 2021-04-27 | Abb Power Electronics Inc. | Interposer printed circuit boards for power modules |
US11490517B2 (en) * | 2019-07-31 | 2022-11-01 | ABB Power Electronics, Inc. | Interposer printed circuit boards for power modules |
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US6246107B1 (en) * | 1999-07-07 | 2001-06-12 | Philips Semiconductors, Inc. | Semiconductor device arrangement having configuration via adjacent bond pad coding |
US6187418B1 (en) * | 1999-07-19 | 2001-02-13 | International Business Machines Corporation | Multilayer ceramic substrate with anchored pad |
US6337805B1 (en) * | 1999-08-30 | 2002-01-08 | Micron Technology, Inc. | Discrete devices including EAPROM transistor and NVRAM memory cell with edge defined ferroelectric capacitance, methods for operating same, and apparatuses including same |
US6414248B1 (en) * | 2000-10-04 | 2002-07-02 | Honeywell International Inc. | Compliant attachment interface |
US7088002B2 (en) | 2000-12-18 | 2006-08-08 | Intel Corporation | Interconnect |
-
2000
- 2000-12-18 US US09/740,103 patent/US7088002B2/en not_active Expired - Lifetime
-
2001
- 2001-11-20 KR KR1020037008112A patent/KR100560571B1/ko active IP Right Grant
- 2001-11-20 CN CNB018227139A patent/CN1290386C/zh not_active Expired - Fee Related
- 2001-11-20 JP JP2002563748A patent/JP4027802B2/ja not_active Expired - Fee Related
- 2001-11-20 WO PCT/US2001/044651 patent/WO2002063934A1/en active IP Right Grant
- 2001-11-20 EP EP01998012A patent/EP1344433A1/en not_active Withdrawn
- 2001-12-03 MY MYPI20015492A patent/MY137665A/en unknown
-
2006
- 2006-05-09 US US11/382,450 patent/US7375432B2/en not_active Expired - Lifetime
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2007
- 2007-11-30 US US11/948,748 patent/US7638419B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20080090406A1 (en) | 2008-04-17 |
WO2002063934A1 (en) | 2002-08-15 |
EP1344433A1 (en) | 2003-09-17 |
JP4027802B2 (ja) | 2007-12-26 |
MY137665A (en) | 2009-02-27 |
CN1504068A (zh) | 2004-06-09 |
JP2005506679A (ja) | 2005-03-03 |
US20060191712A1 (en) | 2006-08-31 |
US7375432B2 (en) | 2008-05-20 |
CN1290386C (zh) | 2006-12-13 |
US7088002B2 (en) | 2006-08-08 |
KR100560571B1 (ko) | 2006-03-14 |
US20020074161A1 (en) | 2002-06-20 |
US7638419B2 (en) | 2009-12-29 |
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