KR20010089274A - 반도체장치 및 반도체실장구조체 - Google Patents
반도체장치 및 반도체실장구조체 Download PDFInfo
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- KR20010089274A KR20010089274A KR1020017003563A KR20017003563A KR20010089274A KR 20010089274 A KR20010089274 A KR 20010089274A KR 1020017003563 A KR1020017003563 A KR 1020017003563A KR 20017003563 A KR20017003563 A KR 20017003563A KR 20010089274 A KR20010089274 A KR 20010089274A
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- external terminal
- semiconductor device
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- protective film
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 300
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 13
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Classifications
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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Abstract
Description
외부단자에 발생하는최대 일그러짐(%) | |
돌기 있음(b = 0.02 mm) | 2.7 |
돌기 없음 | 3.4 |
돌기 | 접합패드의 직경 e /반도체장치측 접속부(돌기부)의 직경 d | 프린트배선기판측의일그러짐/반도체장치측의 일그러짐 |
없음 | 1 | 0.72 |
있음(b = 0.02 mm) | 1 | 1.11 |
있음(b = 0.02 mm) | 1.14 | 1.02 |
Claims (12)
- 패드가 형성된 반도체기판과,이 도체기판의 패드형성면측에 형성된 패시베이션막과,상기 패시베이션막의 상기 반도체기판측과는 반대측에 절연성보호막을 통해서 형성된 외부단자접속용 랜드를 구비하고,상기 패드와 상기 랜드는 도전성배선에 의해 접속되어 있고,상기 랜드의 외부단자가 접속되는 부분에는 돌기가 형성되어 잇는 것을 특지으로 하는 반도체장치.
- 패드가 형성된 실리콘기판과,이 실리콘기판의 패드형성면측에 형성된 패시베이션막과,상기 실리콘기판의 패드형성면측에 형성된 외부단자접속용 랜드와,상기 패드와 상기 랜드를 접속하는 배선을 구비한 반도체장치에서,상기 패시베이션막과 상기 랜드 사이에는 절연막이 개재하고 있고,상기 랜드의 상기 실리콘기판측과는 반대측의 면에는 돌기가 형성되어 있고,상기 돌기에는 상기 외부단자가 접속되어 있는 것을 특징으로 하는 반도체장치.
- 패드가 형성된 반도체기판과,이 반도체기판의 패드형성면측에 형성된 패시베이션막과,상기 반도체기판의 패드형성면측에 형성된 외부단자접속용 랜드와,상기 패드와 상기 랜드를 접속하는 배선를 구비한 반도체장치에서,상기 배선은 상기 패드와 접하는 제 1 배선과 상기 랜드에 이어지는 제 2 배선을 가지고 있는 것을 특징으로 하는 반도체장치.
- 패드가 형성된 실리콘기판과,이 실리콘기판의 패드형성면측에 형성된 패시베이션막과,상기 실리콘기판의 패드형성면측에 형성된 외부단자접속용 랜드와,상기 패드와 상기 랜드를 접속하는 배선을 구비한 반도체장치에서,상기 배선은 상기 패드와 접하는 제 1 배선과 상기 랜드에 이어지는 제 2 배선을 가지고 있고,상기 패시베이션막과 상기 랜드 사이에는 절연성 막이 형성되어 있고,상기 랜드의 상기 실리콘기판측과는 반대측의 면에는 돌기가 형성되어 있고,상기 돌기에는 상기 외부단자가 접속되어 있는 것을 특징으로 하는 반도체장치.
- 패드가 형성된 반도체기판과,이 반도체기판의 패드형성면측에 형성된 패시베이션막과,상기 반도체기판의 패드형성면측에 형성된 외부단자접속용 랜드와,상기 랜드에 접속된 외부단자와,상기 패드와 상기 랜드를 접속하는 배선을 구비한 반도체장치에서,상기 반도체기판의 패드형성면측에는, 상기 외부단자이외의 영역에 절연성의보호막이 형성되어 있는 것을 특징으로 하는 반도체장치.
- 패드가 형성된 반도체기판과,이 반도체기판의 패드형성면측에 형성된 패시베이션막과,상기 반도체기판의 패드에 접속하는 도전성 배선과,이 도전성 배선에 이어지는 랜드와,상기 랜드 위에 형성한 돌기와,상기 돌기에 접합된 외부단자와,상기 반도체기판과 상기 랜드 사이에 있으며 상기 랜드에 접하는 제 1 보호막과,상기 외부단자형성면측에 노출면을 가지는 제 2 보호막을 구비한 것을 특징으로 하는 반도체장치.
- 패드가 형성된 실리콘기판과,이 실리콘기판의 패드형성면측에 형성된 패시베이션막과,상기 실리콘기판의 패드형성면측에 형성된 외부단자접속용 랜드와,상기 패드와 상기 랜드를 접속하는 배선을 구비한 반도체장치에서,상기 배선은 상기 패드와 접하는 제 1 배선과 상기 랜드에 이어지는 제 2 배선을 가지고 있고,상기 제 1 배선과 상기 패시베이션막 사이에는 제 1 절연성막이 형성된 영역이 있고,상기 패시베이션막과 상기 랜드 사이에는 제 2 절연성막이 형성되어 있고,상기 랜드의 상기 실리콘기판측과는 반대측의 면에는 돌기가 형성되어 있고,상기 돌기에는 상기 외부단자가 접속되어 있는 것을 특징으로 하는 반도체장치.
- 청구항 6에 있어서,상기 제 2 보호막을 상기 제 1 보호막보다 탄성계수가 큰 재료로 형성한 것을 특징으로 하는 반도체장치.
- 청구항 1, 2, 4, 6, 7, 8항 중 어느 한 항에 있어서,상기 돌기는 상기 랜드의 투영면내에 있고, 상기 랜드의 끝부분은 돌기의 끝부분보다 외측에 위치하는 것을 특징으로 하는 반도체장치.
- 청구항 1, 2, 4, 6, 7, 8항 중 어느 한 항에 있어서,상기 외부단자와 상기 돌기는, 상기 돌기표면에 설치된 금속박막을 통해서접합되어 있는 것을 특징으로 하는 반도체장치.
- 청구항 1 내지 10항 중 어느 한 항에 있어서,외부단자를 통해서 프린트회로기판에 실장한 반도체실장구조체에서,프린트배선기판의 접합패드와 상기 외부단자의 외부단자배열방향의 접합면적을, 상기 돌기와 외부단자의 외부단자배열방향의 접합면적보다 크게 한 것을 특징으로 하는 반도체실장구조체.
- 청구항 1 항 내지 청구항 10항 중 어느 한 항에 있어서,외부단자를 통해서 프린트회로기판에 실장한 반도체실장구조체에서,프린트배선기판의 접합패드와 상기 외부단자의 접합부 주위를 수지로 덮은 것을 특징으로 하는 반도체실장구조체.
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Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP06783999A JP4024958B2 (ja) | 1999-03-15 | 1999-03-15 | 半導体装置および半導体実装構造体 |
JP99-67839 | 1999-03-15 |
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KR20010089274A true KR20010089274A (ko) | 2001-09-29 |
KR100373693B1 KR100373693B1 (ko) | 2003-02-26 |
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US (1) | US6927489B1 (ko) |
JP (1) | JP4024958B2 (ko) |
KR (1) | KR100373693B1 (ko) |
WO (1) | WO2000055910A1 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100667011B1 (ko) * | 2004-12-10 | 2007-01-10 | 이대형 | 생활 환경오염물을 자원으로 재생하는 장치 |
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-
1999
- 1999-03-15 JP JP06783999A patent/JP4024958B2/ja not_active Expired - Lifetime
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2000
- 2000-03-14 KR KR10-2001-7003563A patent/KR100373693B1/ko active IP Right Grant
- 2000-03-14 US US09/787,526 patent/US6927489B1/en not_active Expired - Lifetime
- 2000-03-14 WO PCT/JP2000/001550 patent/WO2000055910A1/ja active IP Right Grant
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100667011B1 (ko) * | 2004-12-10 | 2007-01-10 | 이대형 | 생활 환경오염물을 자원으로 재생하는 장치 |
KR101026425B1 (ko) * | 2009-01-12 | 2011-04-07 | 삼성전기주식회사 | 웨이퍼 레벨 패키지 및 그 제조방법 |
KR101026427B1 (ko) * | 2009-01-12 | 2011-04-07 | 삼성전기주식회사 | 웨이퍼 레벨 패키지 및 그 제조방법 |
Also Published As
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KR100373693B1 (ko) | 2003-02-26 |
WO2000055910A1 (en) | 2000-09-21 |
JP2000269371A (ja) | 2000-09-29 |
JP4024958B2 (ja) | 2007-12-19 |
US6927489B1 (en) | 2005-08-09 |
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