KR20010078795A - 액티브제진장치 및 노광장치 - Google Patents
액티브제진장치 및 노광장치 Download PDFInfo
- Publication number
- KR20010078795A KR20010078795A KR1020010006294A KR20010006294A KR20010078795A KR 20010078795 A KR20010078795 A KR 20010078795A KR 1020010006294 A KR1020010006294 A KR 1020010006294A KR 20010006294 A KR20010006294 A KR 20010006294A KR 20010078795 A KR20010078795 A KR 20010078795A
- Authority
- KR
- South Korea
- Prior art keywords
- stage
- compensating
- compensator
- signal
- driving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000013016 damping Methods 0.000 claims abstract description 78
- 230000001629 suppression Effects 0.000 claims abstract description 43
- 238000000034 method Methods 0.000 claims description 38
- 238000012937 correction Methods 0.000 claims description 28
- 230000001133 acceleration Effects 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 239000012530 fluid Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000009826 distribution Methods 0.000 abstract description 13
- 239000004065 semiconductor Substances 0.000 description 11
- 230000005484 gravity Effects 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 230000008859 change Effects 0.000 description 7
- 238000000605 extraction Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000011965 cell line development Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000001770 laser ionisation spectroscopy Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
- F16F15/023—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using fluid means
- F16F15/027—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using fluid means comprising control arrangements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Acoustics & Sound (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Environmental & Geological Engineering (AREA)
- Toxicology (AREA)
- Atmospheric Sciences (AREA)
- Aviation & Aerospace Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Vibration Prevention Devices (AREA)
- Electron Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000-031342 | 2000-02-09 | ||
| JP2000031342A JP4416250B2 (ja) | 2000-02-09 | 2000-02-09 | アクティブ除振装置及び露光装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20010078795A true KR20010078795A (ko) | 2001-08-21 |
Family
ID=18556109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020010006294A Ceased KR20010078795A (ko) | 2000-02-09 | 2001-02-09 | 액티브제진장치 및 노광장치 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6684132B2 (enExample) |
| EP (1) | EP1124078B1 (enExample) |
| JP (1) | JP4416250B2 (enExample) |
| KR (1) | KR20010078795A (enExample) |
| DE (1) | DE60114260T2 (enExample) |
| TW (1) | TW535227B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100844973B1 (ko) * | 2006-03-30 | 2008-07-09 | 캐논 가부시끼가이샤 | 전달 특성 산출 장치, 전달 특성 산출 방법 및 노광 장치 |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3670575B2 (ja) * | 2000-01-12 | 2005-07-13 | Tdk株式会社 | コイル封入圧粉コアの製造方法およびコイル封入圧粉コア |
| JP2003202051A (ja) * | 2002-01-04 | 2003-07-18 | Canon Inc | 除振装置 |
| US7108497B2 (en) * | 2004-01-12 | 2006-09-19 | Omnimold, Llc | Interchangeable blow mold parison closing apparatus |
| JP2005282696A (ja) * | 2004-03-29 | 2005-10-13 | Canon Inc | 除振マウント装置、露光装置及びデバイス製造方法 |
| JP4906416B2 (ja) * | 2006-07-11 | 2012-03-28 | 日本碍子株式会社 | 物体の通過検出装置 |
| JP4970904B2 (ja) * | 2006-11-06 | 2012-07-11 | 倉敷化工株式会社 | アクティブ除振装置 |
| EP2119938A1 (en) * | 2008-05-15 | 2009-11-18 | Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO | A vibration sensor and a system to isolate vibrations. |
| US20140293251A1 (en) * | 2008-08-18 | 2014-10-02 | Asml Netherlands B.V. | Projection System, Lithographic Apparatus, Method of Projecting a Beam of Radiation onto a Target and Device Manufacturing Method |
| TWI391703B (zh) * | 2008-12-03 | 2013-04-01 | Asia Optical Co Inc | 光學防手震系統之增益調整裝置及其方法 |
| JP6151927B2 (ja) * | 2012-02-17 | 2017-06-21 | キヤノン株式会社 | アクティブ除振装置 |
| DE112013003048B4 (de) | 2012-06-26 | 2019-05-09 | Hitachi High-Technologies Corp. | Tischvorrichtung und Probenbetrachtungsvorrichtung |
| JP6152001B2 (ja) * | 2012-08-03 | 2017-06-21 | キヤノン株式会社 | アクティブ除振装置、除振方法、加工装置、検査装置、露光装置及びワークの製造方法 |
| EP2846062B1 (de) * | 2013-09-10 | 2017-05-31 | Integrated Dynamics Engineering GmbH | Schwingungsisolationssystem mit in Teilbereiche unterteilter Auflage sowie Verfahren zu dessen Regelung |
| JP6681982B2 (ja) * | 2015-11-23 | 2020-04-15 | エーエスエムエル ネザーランズ ビー.ブイ. | 位置決めデバイス、リソグラフィ装置、及びデバイス製造方法 |
| WO2017108284A1 (en) * | 2015-12-21 | 2017-06-29 | Asml Netherlands B.V. | Lithographic apparatus having an active base frame support |
| JP6556196B2 (ja) | 2017-07-27 | 2019-08-07 | 倉敷化工株式会社 | アクティブ除振装置 |
| WO2019206517A1 (en) * | 2018-04-25 | 2019-10-31 | Asml Netherlands B.V. | Pneumatic support device and lithographic apparatus with pneumatic support device |
| CN111692265B (zh) * | 2019-09-20 | 2021-09-21 | 胡小青 | 一种基于振动补偿的大型机器用共振消除装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10103403A (ja) * | 1996-09-27 | 1998-04-21 | Canon Inc | 除振装置及びその制御方法 |
| JPH10141428A (ja) * | 1996-11-08 | 1998-05-29 | Canon Inc | 能動除振装置 |
| JPH10261561A (ja) * | 1997-03-18 | 1998-09-29 | Toshiba Corp | 露光制御方法及びその装置 |
| JPH10311364A (ja) * | 1997-05-09 | 1998-11-24 | Canon Inc | 能動的除振制振装置 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3217522B2 (ja) | 1992-03-02 | 2001-10-09 | キヤノン株式会社 | 精密位置決め装置 |
| JP3184044B2 (ja) | 1994-05-24 | 2001-07-09 | キヤノン株式会社 | 微動位置決め制御装置 |
| JP3224489B2 (ja) | 1995-03-28 | 2001-10-29 | キヤノン株式会社 | 空気バネ式除振装置 |
| US5812420A (en) | 1995-09-05 | 1998-09-22 | Nikon Corporation | Vibration-preventive apparatus and exposure apparatus |
| JP3807516B2 (ja) | 1995-09-05 | 2006-08-09 | 株式会社ニコン | 除振装置、除振方法及び露光装置 |
| JPH09326362A (ja) | 1996-04-05 | 1997-12-16 | Nikon Corp | 除振装置及び露光装置 |
| JP3733174B2 (ja) | 1996-06-19 | 2006-01-11 | キヤノン株式会社 | 走査型投影露光装置 |
| US6128552A (en) * | 1996-11-08 | 2000-10-03 | Canon Kabushiki Kaisha | Anti-vibration apparatus and method |
| JP3286201B2 (ja) | 1997-03-07 | 2002-05-27 | キヤノン株式会社 | 能動的除振装置 |
| US6170622B1 (en) | 1997-03-07 | 2001-01-09 | Canon Kabushiki Kaisha | Anti-vibration apparatus and anti-vibration method thereof |
| JP2002505596A (ja) | 1997-05-23 | 2002-02-19 | トランサージカル,インコーポレイテッド | Mri誘導治療装置及び方法 |
| JP4313865B2 (ja) | 1998-01-14 | 2009-08-12 | キヤノン株式会社 | 除振装置 |
| JP4109747B2 (ja) | 1998-05-07 | 2008-07-02 | キヤノン株式会社 | アクティブ除振装置および露光装置 |
-
2000
- 2000-02-09 JP JP2000031342A patent/JP4416250B2/ja not_active Expired - Fee Related
-
2001
- 2001-02-07 TW TW090102620A patent/TW535227B/zh not_active IP Right Cessation
- 2001-02-07 US US09/777,955 patent/US6684132B2/en not_active Expired - Lifetime
- 2001-02-07 EP EP01301082A patent/EP1124078B1/en not_active Expired - Lifetime
- 2001-02-07 DE DE60114260T patent/DE60114260T2/de not_active Expired - Fee Related
- 2001-02-09 KR KR1020010006294A patent/KR20010078795A/ko not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10103403A (ja) * | 1996-09-27 | 1998-04-21 | Canon Inc | 除振装置及びその制御方法 |
| JPH10141428A (ja) * | 1996-11-08 | 1998-05-29 | Canon Inc | 能動除振装置 |
| JPH10261561A (ja) * | 1997-03-18 | 1998-09-29 | Toshiba Corp | 露光制御方法及びその装置 |
| JPH10311364A (ja) * | 1997-05-09 | 1998-11-24 | Canon Inc | 能動的除振制振装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100844973B1 (ko) * | 2006-03-30 | 2008-07-09 | 캐논 가부시끼가이샤 | 전달 특성 산출 장치, 전달 특성 산출 방법 및 노광 장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW535227B (en) | 2003-06-01 |
| DE60114260D1 (de) | 2005-12-01 |
| JP2001221278A (ja) | 2001-08-17 |
| EP1124078A2 (en) | 2001-08-16 |
| US6684132B2 (en) | 2004-01-27 |
| EP1124078B1 (en) | 2005-10-26 |
| EP1124078A3 (en) | 2003-06-18 |
| US20010011697A1 (en) | 2001-08-09 |
| JP4416250B2 (ja) | 2010-02-17 |
| DE60114260T2 (de) | 2006-07-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20010209 |
|
| PA0201 | Request for examination | ||
| PG1501 | Laying open of application | ||
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20021024 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20030609 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20021024 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |