KR20010013051A - 폴리머 필름 생성물상의 다층 금속화 복합체 및 방법 - Google Patents
폴리머 필름 생성물상의 다층 금속화 복합체 및 방법 Download PDFInfo
- Publication number
- KR20010013051A KR20010013051A KR1019997011027A KR19997011027A KR20010013051A KR 20010013051 A KR20010013051 A KR 20010013051A KR 1019997011027 A KR1019997011027 A KR 1019997011027A KR 19997011027 A KR19997011027 A KR 19997011027A KR 20010013051 A KR20010013051 A KR 20010013051A
- Authority
- KR
- South Korea
- Prior art keywords
- nitride
- composite
- metal
- film
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 84
- 238000000034 method Methods 0.000 title claims description 80
- 229920006254 polymer film Polymers 0.000 title claims description 43
- 230000008569 process Effects 0.000 title description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 155
- 239000002184 metal Substances 0.000 claims abstract description 155
- 150000004767 nitrides Chemical class 0.000 claims abstract description 98
- 238000001020 plasma etching Methods 0.000 claims abstract description 12
- 239000010949 copper Substances 0.000 claims description 111
- 229910052802 copper Inorganic materials 0.000 claims description 103
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 88
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 54
- -1 chromium nitride, nickel nitride Chemical class 0.000 claims description 41
- 229920001721 polyimide Polymers 0.000 claims description 37
- 229910052759 nickel Inorganic materials 0.000 claims description 35
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 24
- 238000004544 sputter deposition Methods 0.000 claims description 15
- 238000000151 deposition Methods 0.000 claims description 10
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 7
- 229920002313 fluoropolymer Polymers 0.000 claims description 3
- 239000004811 fluoropolymer Substances 0.000 claims description 3
- 229920006267 polyester film Polymers 0.000 claims description 3
- 238000005868 electrolysis reaction Methods 0.000 claims description 2
- 238000001704 evaporation Methods 0.000 claims description 2
- 230000008020 evaporation Effects 0.000 claims description 2
- SKKMWRVAJNPLFY-UHFFFAOYSA-N azanylidynevanadium Chemical compound [V]#N SKKMWRVAJNPLFY-UHFFFAOYSA-N 0.000 claims 11
- ZVWKZXLXHLZXLS-UHFFFAOYSA-N zirconium nitride Chemical compound [Zr]#N ZVWKZXLXHLZXLS-UHFFFAOYSA-N 0.000 claims 11
- 239000004697 Polyetherimide Substances 0.000 claims 2
- 229920001601 polyetherimide Polymers 0.000 claims 2
- 239000000758 substrate Substances 0.000 abstract description 33
- 239000000463 material Substances 0.000 abstract description 24
- 239000010410 layer Substances 0.000 description 149
- 210000002381 plasma Anatomy 0.000 description 76
- 230000004888 barrier function Effects 0.000 description 58
- 239000010408 film Substances 0.000 description 56
- 239000007789 gas Substances 0.000 description 51
- 238000012360 testing method Methods 0.000 description 42
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 40
- 239000000203 mixture Substances 0.000 description 38
- 229910052757 nitrogen Inorganic materials 0.000 description 24
- 238000005530 etching Methods 0.000 description 22
- 239000010936 titanium Substances 0.000 description 22
- 229910052786 argon Inorganic materials 0.000 description 21
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 20
- 229910052719 titanium Inorganic materials 0.000 description 20
- 229920000642 polymer Polymers 0.000 description 19
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 17
- 229910052804 chromium Inorganic materials 0.000 description 17
- 239000011651 chromium Substances 0.000 description 17
- 230000014759 maintenance of location Effects 0.000 description 16
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 16
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 15
- 150000002739 metals Chemical class 0.000 description 15
- 239000000126 substance Substances 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 13
- 150000001875 compounds Chemical class 0.000 description 12
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 11
- 101100008044 Caenorhabditis elegans cut-1 gene Proteins 0.000 description 10
- 230000000694 effects Effects 0.000 description 10
- 238000005382 thermal cycling Methods 0.000 description 9
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 8
- 238000009713 electroplating Methods 0.000 description 8
- 238000007689 inspection Methods 0.000 description 8
- 239000001301 oxygen Substances 0.000 description 8
- 229910052760 oxygen Inorganic materials 0.000 description 8
- 239000004642 Polyimide Substances 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 7
- 238000001465 metallisation Methods 0.000 description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 238000013461 design Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 229910021529 ammonia Inorganic materials 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 5
- 230000007774 longterm Effects 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 229910052720 vanadium Inorganic materials 0.000 description 5
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229960003280 cupric chloride Drugs 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 239000011104 metalized film Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 230000000717 retained effect Effects 0.000 description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229910000990 Ni alloy Inorganic materials 0.000 description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 239000013043 chemical agent Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 229910052754 neon Inorganic materials 0.000 description 3
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 229910052726 zirconium Inorganic materials 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- VVTSZOCINPYFDP-UHFFFAOYSA-N [O].[Ar] Chemical compound [O].[Ar] VVTSZOCINPYFDP-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000001351 cycling effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000004299 exfoliation Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 229910052743 krypton Inorganic materials 0.000 description 2
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002905 metal composite material Substances 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- GXIWMALOYDSQMW-UHFFFAOYSA-N ClCl(=O)=O Chemical compound ClCl(=O)=O GXIWMALOYDSQMW-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229920002614 Polyether block amide Polymers 0.000 description 1
- 229920004738 ULTEM® Polymers 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000002848 electrochemical method Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 230000002068 genetic effect Effects 0.000 description 1
- MXZVHYUSLJAVOE-UHFFFAOYSA-N gold(3+);tricyanide Chemical compound [Au+3].N#[C-].N#[C-].N#[C-] MXZVHYUSLJAVOE-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 229910052756 noble gas Inorganic materials 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229920001059 synthetic polymer Polymers 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
- C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
- Y10T428/24545—Containing metal or metal compound
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31786—Of polyester [e.g., alkyd, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Physical Vapour Deposition (AREA)
- Woven Fabrics (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/053,859 US6042929A (en) | 1998-03-26 | 1998-03-26 | Multilayer metalized composite on polymer film product and process |
| US09/053,859 | 1998-03-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20010013051A true KR20010013051A (ko) | 2001-02-26 |
Family
ID=21987036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019997011027A Abandoned KR20010013051A (ko) | 1998-03-26 | 1999-02-08 | 폴리머 필름 생성물상의 다층 금속화 복합체 및 방법 |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US6042929A (enExample) |
| EP (1) | EP0989914B1 (enExample) |
| JP (1) | JP2002511809A (enExample) |
| KR (1) | KR20010013051A (enExample) |
| CN (1) | CN1198692C (enExample) |
| AT (1) | ATE401766T1 (enExample) |
| BR (1) | BR9904886A (enExample) |
| CA (1) | CA2306786C (enExample) |
| DE (1) | DE69939087D1 (enExample) |
| IL (1) | IL133147A (enExample) |
| WO (1) | WO1999048620A1 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100807796B1 (ko) * | 2005-05-19 | 2008-03-06 | 한덕수 | 미세 패턴용 연성다층인쇄회로기판 |
| KR100906308B1 (ko) | 2007-10-24 | 2009-07-07 | 성균관대학교산학협력단 | 미세 배선이 형성된 연성 전도성 폴리이미드 기판 및 이의제조방법 |
| KR20160033050A (ko) * | 2014-09-17 | 2016-03-25 | 인피니언 테크놀로지스 아게 | 반도체 디바이스를 처리하는 방법 및 칩 패키지 |
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| US6083628A (en) * | 1994-11-04 | 2000-07-04 | Sigma Laboratories Of Arizona, Inc. | Hybrid polymer film |
| JP3606095B2 (ja) * | 1998-10-06 | 2005-01-05 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
| JP2000294922A (ja) * | 1999-04-01 | 2000-10-20 | Victor Co Of Japan Ltd | 多層プリント配線板用の絶縁樹脂組成物 |
| US6734455B2 (en) * | 2001-03-15 | 2004-05-11 | Micron Technology, Inc. | Agglomeration elimination for metal sputter deposition of chalcogenides |
| US6835412B2 (en) * | 2001-05-04 | 2004-12-28 | Micrometal Technologies, Inc. | Metalized dielectric substrates for EAS tags |
| JP3578116B2 (ja) * | 2001-06-25 | 2004-10-20 | Ｔｄｋ株式会社 | スピンバルブ巨大磁気抵抗効果センサの製造方法及び薄膜磁気ヘッドの製造方法 |
| CN1264391C (zh) * | 2001-06-27 | 2006-07-12 | 日本特殊陶业株式会社 | 布线基板的制造方法 |
| CA2452656C (en) * | 2001-07-18 | 2010-04-13 | The Regents Of The University Of Colorado | A method of depositing an inorganic film on an organic polymer |
| US6872652B2 (en) * | 2001-08-28 | 2005-03-29 | Infineon Technologies Ag | Method of cleaning an inter-level dielectric interconnect |
| JP2003221456A (ja) * | 2002-01-29 | 2003-08-05 | Japan Gore Tex Inc | 高接着性液晶ポリマーフィルム |
| US7113131B2 (en) * | 2002-05-02 | 2006-09-26 | Micrometal Technologies, Inc. | Metalized dielectric substrates for EAS tags |
| JP4517564B2 (ja) * | 2002-05-23 | 2010-08-04 | 住友金属鉱山株式会社 | ２層銅ポリイミド基板 |
| JP4150001B2 (ja) | 2003-01-30 | 2008-09-17 | ユーロプラズマ | 開放気泡構造を有する製品の表面にその構造全体にわたってコーティングを提供する方法およびその方法の使用方法 |
| WO2006007437A1 (en) * | 2004-06-16 | 2006-01-19 | Ppg Industries Ohio, Inc. | Methods for removal of polymeric coating layers from coated substrates |
| KR20070049278A (ko) * | 2005-11-08 | 2007-05-11 | 삼성전자주식회사 | 배선, 이를 포함하는 박막 트랜지스터 기판과 그 제조 방법 |
| KR100850212B1 (ko) * | 2007-04-20 | 2008-08-04 | 삼성전자주식회사 | 균일한 무전해 도금 두께를 얻을 수 있는 반도체 소자의제조방법 |
| US20100098960A1 (en) * | 2007-06-18 | 2010-04-22 | Dominguez Juan E | Magnetic insulator nanolaminate device for integrated silicon voltage regulators |
| US10021789B2 (en) * | 2007-07-02 | 2018-07-10 | Ebara-Udylite Co., Ltd. | Metal-laminated polyimide substrate, and method for production thereof |
| JP5487473B2 (ja) * | 2008-07-22 | 2014-05-07 | 国立大学法人東北大学 | 配線基板及びその製造方法 |
| CN102782531B (zh) * | 2009-12-15 | 2014-12-17 | 卡尔蔡司Smt有限责任公司 | 用于极紫外光刻的反射光学元件 |
| JP5781428B2 (ja) * | 2011-12-20 | 2015-09-24 | 日東電工株式会社 | 導電性フィルムおよび導電性フィルムロール |
| CN102978570B (zh) * | 2012-11-26 | 2014-10-08 | 蔡莳铨 | 金属蒸镀薄膜及其制作中间体和相关制作方法 |
| CN104451955B (zh) * | 2014-11-25 | 2017-02-22 | 中国科学院电子学研究所 | 一种具有分级结构的金属或金属氧化物及其制备方法 |
| US10879177B2 (en) * | 2015-06-19 | 2020-12-29 | Applied Materials, Inc. | PVD deposition and anneal of multi-layer metal-dielectric film |
| CN106413266B (zh) | 2015-07-29 | 2018-11-23 | 苏州卫鹏机电科技有限公司 | 一种聚酰亚胺无胶柔性印刷线路板的制备方法 |
| DE102016215709A1 (de) * | 2015-08-28 | 2017-03-02 | Tsubakimoto Chain Co. | Kettenkomponente und Kette |
| CN107371338B (zh) * | 2016-05-13 | 2019-08-20 | 苏州卫鹏机电科技有限公司 | 一种超薄金属层的印刷线路板的制备方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4226932A (en) * | 1979-07-05 | 1980-10-07 | Gte Automatic Electric Laboratories Incorporated | Titanium nitride as one layer of a multi-layered coating intended to be etched |
| DE3039821A1 (de) * | 1980-10-22 | 1982-06-03 | Robert Bosch Gmbh, 7000 Stuttgart | Mehrschichtsystem fuer waermeschutzanwendung |
| US4337279A (en) * | 1981-01-23 | 1982-06-29 | Uop Inc. | Method for increasing the peel strength of metal-clad polymers |
| US4382101A (en) * | 1981-01-23 | 1983-05-03 | Uop Inc. | Method for increasing the peel strength of metal-clad polymers |
| US4597828A (en) * | 1985-03-25 | 1986-07-01 | Firan Corporation | Method of manufacturing printed circuit boards |
| US4868071A (en) * | 1987-02-24 | 1989-09-19 | Polyonics Corporation | Thermally stable dual metal coated laminate products made from textured polyimide film |
| US4725504A (en) * | 1987-02-24 | 1988-02-16 | Polyonics Corporation | Metal coated laminate products made from textured polyimide film |
| US4806395A (en) * | 1987-02-24 | 1989-02-21 | Polyonics Corporation | Textured polyimide film |
| JP2788779B2 (ja) * | 1990-03-09 | 1998-08-20 | 古河電気工業株式会社 | 回路基板用素材板 |
| US5137791A (en) * | 1990-09-13 | 1992-08-11 | Sheldahl Inc. | Metal-film laminate resistant to delamination |
| US5413687A (en) * | 1991-11-27 | 1995-05-09 | Rogers Corporation | Method for metallizing fluoropolymer substrates |
| US5372848A (en) * | 1992-12-24 | 1994-12-13 | International Business Machines Corporation | Process for creating organic polymeric substrate with copper |
| US5589280A (en) * | 1993-02-05 | 1996-12-31 | Southwall Technologies Inc. | Metal on plastic films with adhesion-promoting layer |
| US5675310A (en) * | 1994-12-05 | 1997-10-07 | General Electric Company | Thin film resistors on organic surfaces |
| JPH0971859A (ja) * | 1995-09-06 | 1997-03-18 | Nissin Electric Co Ltd | 貴金属膜被覆高分子基体及びその製造方法 |
| US5874770A (en) * | 1996-10-10 | 1999-02-23 | General Electric Company | Flexible interconnect film including resistor and capacitor layers |
-
1998
- 1998-03-26 US US09/053,859 patent/US6042929A/en not_active Expired - Lifetime
-
1999
- 1999-02-08 JP JP54826299A patent/JP2002511809A/ja not_active Ceased
- 1999-02-08 KR KR1019997011027A patent/KR20010013051A/ko not_active Abandoned
- 1999-02-08 AT AT99906923T patent/ATE401766T1/de not_active IP Right Cessation
- 1999-02-08 EP EP99906923A patent/EP0989914B1/en not_active Expired - Lifetime
- 1999-02-08 BR BR9904886-8A patent/BR9904886A/pt not_active IP Right Cessation
- 1999-02-08 CA CA002306786A patent/CA2306786C/en not_active Expired - Fee Related
- 1999-02-08 DE DE69939087T patent/DE69939087D1/de not_active Expired - Fee Related
- 1999-02-08 IL IL13314799A patent/IL133147A/en active IP Right Grant
- 1999-02-08 WO PCT/US1999/002961 patent/WO1999048620A1/en not_active Ceased
- 1999-02-08 CN CNB998007781A patent/CN1198692C/zh not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100807796B1 (ko) * | 2005-05-19 | 2008-03-06 | 한덕수 | 미세 패턴용 연성다층인쇄회로기판 |
| KR100906308B1 (ko) | 2007-10-24 | 2009-07-07 | 성균관대학교산학협력단 | 미세 배선이 형성된 연성 전도성 폴리이미드 기판 및 이의제조방법 |
| KR20160033050A (ko) * | 2014-09-17 | 2016-03-25 | 인피니언 테크놀로지스 아게 | 반도체 디바이스를 처리하는 방법 및 칩 패키지 |
Also Published As
| Publication number | Publication date |
|---|---|
| IL133147A (en) | 2004-02-08 |
| ATE401766T1 (de) | 2008-08-15 |
| JP2002511809A (ja) | 2002-04-16 |
| CN1198692C (zh) | 2005-04-27 |
| WO1999048620A1 (en) | 1999-09-30 |
| CN1272072A (zh) | 2000-11-01 |
| EP0989914A4 (en) | 2005-05-25 |
| CA2306786C (en) | 2005-01-11 |
| DE69939087D1 (de) | 2008-08-28 |
| IL133147A0 (en) | 2001-03-19 |
| US6042929A (en) | 2000-03-28 |
| EP0989914A1 (en) | 2000-04-05 |
| EP0989914B1 (en) | 2008-07-16 |
| CA2306786A1 (en) | 1999-09-30 |
| BR9904886A (pt) | 2002-01-15 |
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