JP2002511809A - 高分子フィルム上の多層金属化複合製品及び方法 - Google Patents
高分子フィルム上の多層金属化複合製品及び方法Info
- Publication number
- JP2002511809A JP2002511809A JP54826299A JP54826299A JP2002511809A JP 2002511809 A JP2002511809 A JP 2002511809A JP 54826299 A JP54826299 A JP 54826299A JP 54826299 A JP54826299 A JP 54826299A JP 2002511809 A JP2002511809 A JP 2002511809A
- Authority
- JP
- Japan
- Prior art keywords
- nitride
- metal
- film
- layer
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 43
- 229920006254 polymer film Polymers 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims description 75
- 229910052751 metal Inorganic materials 0.000 claims abstract description 132
- 239000002184 metal Substances 0.000 claims abstract description 132
- 150000004767 nitrides Chemical class 0.000 claims abstract description 91
- 238000001020 plasma etching Methods 0.000 claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 claims abstract description 14
- 239000010949 copper Substances 0.000 claims description 107
- 229910052802 copper Inorganic materials 0.000 claims description 104
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 77
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 58
- -1 copper nitride Chemical class 0.000 claims description 42
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 39
- 229910052759 nickel Inorganic materials 0.000 claims description 39
- 239000000203 mixture Substances 0.000 claims description 38
- 229920001721 polyimide Polymers 0.000 claims description 35
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical group [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 26
- 229910052757 nitrogen Inorganic materials 0.000 claims description 20
- 238000004544 sputter deposition Methods 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 13
- 238000000151 deposition Methods 0.000 claims description 8
- 229910052720 vanadium Inorganic materials 0.000 claims description 7
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 6
- 229920002313 fluoropolymer Polymers 0.000 claims description 5
- 239000004811 fluoropolymer Substances 0.000 claims description 5
- 229920006267 polyester film Polymers 0.000 claims description 2
- CXOWYMLTGOFURZ-UHFFFAOYSA-N azanylidynechromium Chemical compound [Cr]#N CXOWYMLTGOFURZ-UHFFFAOYSA-N 0.000 claims 11
- ZVWKZXLXHLZXLS-UHFFFAOYSA-N zirconium nitride Chemical compound [Zr]#N ZVWKZXLXHLZXLS-UHFFFAOYSA-N 0.000 claims 11
- SKKMWRVAJNPLFY-UHFFFAOYSA-N azanylidynevanadium Chemical compound [V]#N SKKMWRVAJNPLFY-UHFFFAOYSA-N 0.000 claims 7
- 239000004697 Polyetherimide Substances 0.000 claims 2
- 230000000149 penetrating effect Effects 0.000 claims 2
- 229920001601 polyetherimide Polymers 0.000 claims 2
- 230000008020 evaporation Effects 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 22
- 239000000463 material Substances 0.000 abstract description 21
- 239000010410 layer Substances 0.000 description 140
- 230000004888 barrier function Effects 0.000 description 60
- 239000010408 film Substances 0.000 description 49
- 239000007789 gas Substances 0.000 description 49
- 239000000523 sample Substances 0.000 description 47
- 238000012360 testing method Methods 0.000 description 47
- 239000010936 titanium Substances 0.000 description 31
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- 238000005530 etching Methods 0.000 description 22
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- 239000011651 chromium Substances 0.000 description 21
- 229910052786 argon Inorganic materials 0.000 description 20
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 19
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 18
- 229910052782 aluminium Inorganic materials 0.000 description 18
- 230000014759 maintenance of location Effects 0.000 description 14
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 13
- 150000002739 metals Chemical group 0.000 description 13
- 229920000642 polymer Polymers 0.000 description 13
- 239000000126 substance Substances 0.000 description 13
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- 239000003795 chemical substances by application Substances 0.000 description 8
- 238000001465 metallisation Methods 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 7
- 239000001301 oxygen Substances 0.000 description 7
- 229910052760 oxygen Inorganic materials 0.000 description 7
- 101100008044 Caenorhabditis elegans cut-1 gene Proteins 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 238000004458 analytical method Methods 0.000 description 6
- 238000005382 thermal cycling Methods 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 5
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- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 239000011104 metalized film Substances 0.000 description 4
- 230000000717 retained effect Effects 0.000 description 4
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 4
- 229910052726 zirconium Inorganic materials 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 3
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
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- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 229910052754 neon Inorganic materials 0.000 description 3
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 3
- 229910052756 noble gas Inorganic materials 0.000 description 3
- 150000002978 peroxides Chemical class 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 229920000307 polymer substrate Polymers 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- VVTSZOCINPYFDP-UHFFFAOYSA-N [O].[Ar] Chemical compound [O].[Ar] VVTSZOCINPYFDP-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
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- 125000004429 atom Chemical group 0.000 description 2
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- 230000008859 change Effects 0.000 description 2
- 238000012993 chemical processing Methods 0.000 description 2
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- 229960003280 cupric chloride Drugs 0.000 description 2
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- 150000003949 imides Chemical class 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
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- 229910052743 krypton Inorganic materials 0.000 description 2
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
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- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
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- 229910052724 xenon Inorganic materials 0.000 description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
- C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
- Y10T428/24545—Containing metal or metal compound
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31786—Of polyester [e.g., alkyd, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Physical Vapour Deposition (AREA)
- Woven Fabrics (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/053,859 US6042929A (en) | 1998-03-26 | 1998-03-26 | Multilayer metalized composite on polymer film product and process |
| US09/053,859 | 1998-03-26 | ||
| PCT/US1999/002961 WO1999048620A1 (en) | 1998-03-26 | 1999-02-08 | Multilayer metalized composite on polymer film product and process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002511809A true JP2002511809A (ja) | 2002-04-16 |
| JP2002511809A5 JP2002511809A5 (enExample) | 2006-06-22 |
Family
ID=21987036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP54826299A Ceased JP2002511809A (ja) | 1998-03-26 | 1999-02-08 | 高分子フィルム上の多層金属化複合製品及び方法 |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US6042929A (enExample) |
| EP (1) | EP0989914B1 (enExample) |
| JP (1) | JP2002511809A (enExample) |
| KR (1) | KR20010013051A (enExample) |
| CN (1) | CN1198692C (enExample) |
| AT (1) | ATE401766T1 (enExample) |
| BR (1) | BR9904886A (enExample) |
| CA (1) | CA2306786C (enExample) |
| DE (1) | DE69939087D1 (enExample) |
| IL (1) | IL133147A (enExample) |
| WO (1) | WO1999048620A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006514129A (ja) | 2003-01-30 | 2006-04-27 | ユーロプラズマ | 開放気泡構造を有する製品の表面にその構造全体にわたってコーティングを提供する方法およびその方法の使用方法 |
| JP2018533191A (ja) * | 2016-05-13 | 2018-11-08 | 蘇州衛鵬機電科技有限公司 | 超薄金属層プリント回路基板の製造方法 |
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| US6083628A (en) * | 1994-11-04 | 2000-07-04 | Sigma Laboratories Of Arizona, Inc. | Hybrid polymer film |
| JP3606095B2 (ja) * | 1998-10-06 | 2005-01-05 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
| JP2000294922A (ja) * | 1999-04-01 | 2000-10-20 | Victor Co Of Japan Ltd | 多層プリント配線板用の絶縁樹脂組成物 |
| US6734455B2 (en) * | 2001-03-15 | 2004-05-11 | Micron Technology, Inc. | Agglomeration elimination for metal sputter deposition of chalcogenides |
| US6835412B2 (en) * | 2001-05-04 | 2004-12-28 | Micrometal Technologies, Inc. | Metalized dielectric substrates for EAS tags |
| JP3578116B2 (ja) * | 2001-06-25 | 2004-10-20 | Ｔｄｋ株式会社 | スピンバルブ巨大磁気抵抗効果センサの製造方法及び薄膜磁気ヘッドの製造方法 |
| CN1264391C (zh) * | 2001-06-27 | 2006-07-12 | 日本特殊陶业株式会社 | 布线基板的制造方法 |
| CA2452656C (en) * | 2001-07-18 | 2010-04-13 | The Regents Of The University Of Colorado | A method of depositing an inorganic film on an organic polymer |
| US6872652B2 (en) * | 2001-08-28 | 2005-03-29 | Infineon Technologies Ag | Method of cleaning an inter-level dielectric interconnect |
| JP2003221456A (ja) * | 2002-01-29 | 2003-08-05 | Japan Gore Tex Inc | 高接着性液晶ポリマーフィルム |
| US7113131B2 (en) * | 2002-05-02 | 2006-09-26 | Micrometal Technologies, Inc. | Metalized dielectric substrates for EAS tags |
| JP4517564B2 (ja) * | 2002-05-23 | 2010-08-04 | 住友金属鉱山株式会社 | ２層銅ポリイミド基板 |
| WO2006007437A1 (en) * | 2004-06-16 | 2006-01-19 | Ppg Industries Ohio, Inc. | Methods for removal of polymeric coating layers from coated substrates |
| KR100807796B1 (ko) * | 2005-05-19 | 2008-03-06 | 한덕수 | 미세 패턴용 연성다층인쇄회로기판 |
| KR20070049278A (ko) * | 2005-11-08 | 2007-05-11 | 삼성전자주식회사 | 배선, 이를 포함하는 박막 트랜지스터 기판과 그 제조 방법 |
| KR100850212B1 (ko) * | 2007-04-20 | 2008-08-04 | 삼성전자주식회사 | 균일한 무전해 도금 두께를 얻을 수 있는 반도체 소자의제조방법 |
| US20100098960A1 (en) * | 2007-06-18 | 2010-04-22 | Dominguez Juan E | Magnetic insulator nanolaminate device for integrated silicon voltage regulators |
| US10021789B2 (en) * | 2007-07-02 | 2018-07-10 | Ebara-Udylite Co., Ltd. | Metal-laminated polyimide substrate, and method for production thereof |
| KR100906308B1 (ko) | 2007-10-24 | 2009-07-07 | 성균관대학교산학협력단 | 미세 배선이 형성된 연성 전도성 폴리이미드 기판 및 이의제조방법 |
| JP5487473B2 (ja) * | 2008-07-22 | 2014-05-07 | 国立大学法人東北大学 | 配線基板及びその製造方法 |
| CN102782531B (zh) * | 2009-12-15 | 2014-12-17 | 卡尔蔡司Smt有限责任公司 | 用于极紫外光刻的反射光学元件 |
| JP5781428B2 (ja) * | 2011-12-20 | 2015-09-24 | 日東電工株式会社 | 導電性フィルムおよび導電性フィルムロール |
| CN102978570B (zh) * | 2012-11-26 | 2014-10-08 | 蔡莳铨 | 金属蒸镀薄膜及其制作中间体和相关制作方法 |
| US9614045B2 (en) * | 2014-09-17 | 2017-04-04 | Infineon Technologies Ag | Method of processing a semiconductor device and chip package |
| CN104451955B (zh) * | 2014-11-25 | 2017-02-22 | 中国科学院电子学研究所 | 一种具有分级结构的金属或金属氧化物及其制备方法 |
| US10879177B2 (en) * | 2015-06-19 | 2020-12-29 | Applied Materials, Inc. | PVD deposition and anneal of multi-layer metal-dielectric film |
| CN106413266B (zh) | 2015-07-29 | 2018-11-23 | 苏州卫鹏机电科技有限公司 | 一种聚酰亚胺无胶柔性印刷线路板的制备方法 |
| DE102016215709A1 (de) * | 2015-08-28 | 2017-03-02 | Tsubakimoto Chain Co. | Kettenkomponente und Kette |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4226932A (en) * | 1979-07-05 | 1980-10-07 | Gte Automatic Electric Laboratories Incorporated | Titanium nitride as one layer of a multi-layered coating intended to be etched |
| DE3039821A1 (de) * | 1980-10-22 | 1982-06-03 | Robert Bosch Gmbh, 7000 Stuttgart | Mehrschichtsystem fuer waermeschutzanwendung |
| US4337279A (en) * | 1981-01-23 | 1982-06-29 | Uop Inc. | Method for increasing the peel strength of metal-clad polymers |
| US4382101A (en) * | 1981-01-23 | 1983-05-03 | Uop Inc. | Method for increasing the peel strength of metal-clad polymers |
| US4597828A (en) * | 1985-03-25 | 1986-07-01 | Firan Corporation | Method of manufacturing printed circuit boards |
| US4868071A (en) * | 1987-02-24 | 1989-09-19 | Polyonics Corporation | Thermally stable dual metal coated laminate products made from textured polyimide film |
| US4725504A (en) * | 1987-02-24 | 1988-02-16 | Polyonics Corporation | Metal coated laminate products made from textured polyimide film |
| US4806395A (en) * | 1987-02-24 | 1989-02-21 | Polyonics Corporation | Textured polyimide film |
| JP2788779B2 (ja) * | 1990-03-09 | 1998-08-20 | 古河電気工業株式会社 | 回路基板用素材板 |
| US5137791A (en) * | 1990-09-13 | 1992-08-11 | Sheldahl Inc. | Metal-film laminate resistant to delamination |
| US5413687A (en) * | 1991-11-27 | 1995-05-09 | Rogers Corporation | Method for metallizing fluoropolymer substrates |
| US5372848A (en) * | 1992-12-24 | 1994-12-13 | International Business Machines Corporation | Process for creating organic polymeric substrate with copper |
| US5589280A (en) * | 1993-02-05 | 1996-12-31 | Southwall Technologies Inc. | Metal on plastic films with adhesion-promoting layer |
| US5675310A (en) * | 1994-12-05 | 1997-10-07 | General Electric Company | Thin film resistors on organic surfaces |
| JPH0971859A (ja) * | 1995-09-06 | 1997-03-18 | Nissin Electric Co Ltd | 貴金属膜被覆高分子基体及びその製造方法 |
| US5874770A (en) * | 1996-10-10 | 1999-02-23 | General Electric Company | Flexible interconnect film including resistor and capacitor layers |
-
1998
- 1998-03-26 US US09/053,859 patent/US6042929A/en not_active Expired - Lifetime
-
1999
- 1999-02-08 JP JP54826299A patent/JP2002511809A/ja not_active Ceased
- 1999-02-08 KR KR1019997011027A patent/KR20010013051A/ko not_active Abandoned
- 1999-02-08 AT AT99906923T patent/ATE401766T1/de not_active IP Right Cessation
- 1999-02-08 EP EP99906923A patent/EP0989914B1/en not_active Expired - Lifetime
- 1999-02-08 BR BR9904886-8A patent/BR9904886A/pt not_active IP Right Cessation
- 1999-02-08 CA CA002306786A patent/CA2306786C/en not_active Expired - Fee Related
- 1999-02-08 DE DE69939087T patent/DE69939087D1/de not_active Expired - Fee Related
- 1999-02-08 IL IL13314799A patent/IL133147A/en active IP Right Grant
- 1999-02-08 WO PCT/US1999/002961 patent/WO1999048620A1/en not_active Ceased
- 1999-02-08 CN CNB998007781A patent/CN1198692C/zh not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006514129A (ja) | 2003-01-30 | 2006-04-27 | ユーロプラズマ | 開放気泡構造を有する製品の表面にその構造全体にわたってコーティングを提供する方法およびその方法の使用方法 |
| JP2018533191A (ja) * | 2016-05-13 | 2018-11-08 | 蘇州衛鵬機電科技有限公司 | 超薄金属層プリント回路基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| IL133147A (en) | 2004-02-08 |
| ATE401766T1 (de) | 2008-08-15 |
| CN1198692C (zh) | 2005-04-27 |
| WO1999048620A1 (en) | 1999-09-30 |
| CN1272072A (zh) | 2000-11-01 |
| EP0989914A4 (en) | 2005-05-25 |
| CA2306786C (en) | 2005-01-11 |
| KR20010013051A (ko) | 2001-02-26 |
| DE69939087D1 (de) | 2008-08-28 |
| IL133147A0 (en) | 2001-03-19 |
| US6042929A (en) | 2000-03-28 |
| EP0989914A1 (en) | 2000-04-05 |
| EP0989914B1 (en) | 2008-07-16 |
| CA2306786A1 (en) | 1999-09-30 |
| BR9904886A (pt) | 2002-01-15 |
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