DE69939087D1 - Mehrschichtiger metallisierter verbund auf polymerfilmprodukt und verfahren - Google Patents

Mehrschichtiger metallisierter verbund auf polymerfilmprodukt und verfahren

Info

Publication number
DE69939087D1
DE69939087D1 DE69939087T DE69939087T DE69939087D1 DE 69939087 D1 DE69939087 D1 DE 69939087D1 DE 69939087 T DE69939087 T DE 69939087T DE 69939087 T DE69939087 T DE 69939087T DE 69939087 D1 DE69939087 D1 DE 69939087D1
Authority
DE
Germany
Prior art keywords
polymeric film
film product
metallized compound
multilayer metallized
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69939087T
Other languages
German (de)
English (en)
Inventor
Merwin F Hoover
John H Bradshaw
Thomas F Burke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micrometal Technologies Inc
Original Assignee
Micrometal Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micrometal Technologies Inc filed Critical Micrometal Technologies Inc
Application granted granted Critical
Publication of DE69939087D1 publication Critical patent/DE69939087D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641—Nitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
    • Y10T428/24545—Containing metal or metal compound
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31786—Of polyester [e.g., alkyd, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Physical Vapour Deposition (AREA)
  • Woven Fabrics (AREA)
DE69939087T 1998-03-26 1999-02-08 Mehrschichtiger metallisierter verbund auf polymerfilmprodukt und verfahren Expired - Fee Related DE69939087D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/053,859 US6042929A (en) 1998-03-26 1998-03-26 Multilayer metalized composite on polymer film product and process
PCT/US1999/002961 WO1999048620A1 (en) 1998-03-26 1999-02-08 Multilayer metalized composite on polymer film product and process

Publications (1)

Publication Number Publication Date
DE69939087D1 true DE69939087D1 (de) 2008-08-28

Family

ID=21987036

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69939087T Expired - Fee Related DE69939087D1 (de) 1998-03-26 1999-02-08 Mehrschichtiger metallisierter verbund auf polymerfilmprodukt und verfahren

Country Status (11)

Country Link
US (1) US6042929A (enExample)
EP (1) EP0989914B1 (enExample)
JP (1) JP2002511809A (enExample)
KR (1) KR20010013051A (enExample)
CN (1) CN1198692C (enExample)
AT (1) ATE401766T1 (enExample)
BR (1) BR9904886A (enExample)
CA (1) CA2306786C (enExample)
DE (1) DE69939087D1 (enExample)
IL (1) IL133147A (enExample)
WO (1) WO1999048620A1 (enExample)

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JP3606095B2 (ja) * 1998-10-06 2005-01-05 セイコーエプソン株式会社 半導体装置の製造方法
JP2000294922A (ja) * 1999-04-01 2000-10-20 Victor Co Of Japan Ltd 多層プリント配線板用の絶縁樹脂組成物
US6734455B2 (en) * 2001-03-15 2004-05-11 Micron Technology, Inc. Agglomeration elimination for metal sputter deposition of chalcogenides
WO2002091322A2 (en) * 2001-05-04 2002-11-14 Micrometal Technologies Inc. Metalized dielectric substrates for eas tags
JP3578116B2 (ja) * 2001-06-25 2004-10-20 Ｔｄｋ株式会社 スピンバルブ巨大磁気抵抗効果センサの製造方法及び薄膜磁気ヘッドの製造方法
CN1264391C (zh) * 2001-06-27 2006-07-12 日本特殊陶业株式会社 布线基板的制造方法
CA2452656C (en) * 2001-07-18 2010-04-13 The Regents Of The University Of Colorado A method of depositing an inorganic film on an organic polymer
US6872652B2 (en) * 2001-08-28 2005-03-29 Infineon Technologies Ag Method of cleaning an inter-level dielectric interconnect
JP2003221456A (ja) * 2002-01-29 2003-08-05 Japan Gore Tex Inc 高接着性液晶ポリマーフィルム
US7113131B2 (en) * 2002-05-02 2006-09-26 Micrometal Technologies, Inc. Metalized dielectric substrates for EAS tags
JP4517564B2 (ja) * 2002-05-23 2010-08-04 住友金属鉱山株式会社 ２層銅ポリイミド基板
BR0318063B1 (pt) 2003-01-30 2013-05-07 mÉtodo para fornecer um revestimento sobre as superfÍcies de um produto com uma estrutura de cÉlulas abertas em toda a sua estrutura e uso de tal mÉtodo.
WO2006007437A1 (en) * 2004-06-16 2006-01-19 Ppg Industries Ohio, Inc. Methods for removal of polymeric coating layers from coated substrates
KR100807796B1 (ko) * 2005-05-19 2008-03-06 한덕수 미세 패턴용 연성다층인쇄회로기판
KR20070049278A (ko) * 2005-11-08 2007-05-11 삼성전자주식회사 배선, 이를 포함하는 박막 트랜지스터 기판과 그 제조 방법
KR100850212B1 (ko) * 2007-04-20 2008-08-04 삼성전자주식회사 균일한 무전해 도금 두께를 얻을 수 있는 반도체 소자의제조방법
US20100098960A1 (en) * 2007-06-18 2010-04-22 Dominguez Juan E Magnetic insulator nanolaminate device for integrated silicon voltage regulators
KR20100027228A (ko) * 2007-07-02 2010-03-10 파나소닉 주식회사 금속 적층 폴리이미드 기판 및 그 제조 방법
KR100906308B1 (ko) 2007-10-24 2009-07-07 성균관대학교산학협력단 미세 배선이 형성된 연성 전도성 폴리이미드 기판 및 이의제조방법
WO2010010753A1 (ja) * 2008-07-22 2010-01-28 国立大学法人東北大学 配線基板及びその製造方法
WO2011073157A1 (en) * 2009-12-15 2011-06-23 Carl Zeiss Smt Gmbh Reflective optical element for euv lithography
JP5781428B2 (ja) * 2011-12-20 2015-09-24 日東電工株式会社 導電性フィルムおよび導電性フィルムロール
CN102978570B (zh) * 2012-11-26 2014-10-08 蔡莳铨 金属蒸镀薄膜及其制作中间体和相关制作方法
US9614045B2 (en) * 2014-09-17 2017-04-04 Infineon Technologies Ag Method of processing a semiconductor device and chip package
CN104451955B (zh) * 2014-11-25 2017-02-22 中国科学院电子学研究所 一种具有分级结构的金属或金属氧化物及其制备方法
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Also Published As

Publication number Publication date
IL133147A0 (en) 2001-03-19
WO1999048620A1 (en) 1999-09-30
CN1198692C (zh) 2005-04-27
EP0989914B1 (en) 2008-07-16
CA2306786A1 (en) 1999-09-30
EP0989914A1 (en) 2000-04-05
ATE401766T1 (de) 2008-08-15
JP2002511809A (ja) 2002-04-16
BR9904886A (pt) 2002-01-15
CA2306786C (en) 2005-01-11
CN1272072A (zh) 2000-11-01
EP0989914A4 (en) 2005-05-25
KR20010013051A (ko) 2001-02-26
IL133147A (en) 2004-02-08
US6042929A (en) 2000-03-28

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