MY128174A - Thin film capacitor and thin film electronic component and method for manufacturing the same. - Google Patents

Thin film capacitor and thin film electronic component and method for manufacturing the same.

Info

Publication number
MY128174A
MY128174A MYPI20020666A MY128174A MY 128174 A MY128174 A MY 128174A MY PI20020666 A MYPI20020666 A MY PI20020666A MY 128174 A MY128174 A MY 128174A
Authority
MY
Malaysia
Prior art keywords
thin film
manufacturing
electronic component
same
film capacitor
Prior art date
Application number
Inventor
Toshihide Nabatame
Masahiko Ogino
Shigehisa Motowaki
Seiji Watahiki
Toshiya Satoh
Hitoshi Akamine
Hideshi Fukumoto
Yoko Furukawa
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of MY128174A publication Critical patent/MY128174A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

A THIN FILM CAPACITOR COMPRISING AN INSULATING SUBSTRATE (1), AND A PLURALITY OF LAMINATED STRUCTURES FORMED ON SAID SUBSTRATE, EACH STRUCTURE COMPRISING A DIELECTRIC LAYER AND ELECTRODES (2,5a,5b) ON BOTH SIDES THEREOF, WHEREIN SAID PLURALITY OF STRUCTURES COMPRISE AN INORGANIC DIELECTRIC LAYER (3) AND AN ORGANIC DIELECTRIC LAYER (4).(FIG 1)
MYPI20020666 2001-03-16 2002-02-26 Thin film capacitor and thin film electronic component and method for manufacturing the same. MY128174A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001076998A JP4177560B2 (en) 2001-03-16 2001-03-16 Thin film capacitors, electronic components with built-in passive elements, and high frequency compatible modules

Publications (1)

Publication Number Publication Date
MY128174A true MY128174A (en) 2007-01-31

Family

ID=18933819

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20020666 MY128174A (en) 2001-03-16 2002-02-26 Thin film capacitor and thin film electronic component and method for manufacturing the same.

Country Status (4)

Country Link
JP (1) JP4177560B2 (en)
MY (1) MY128174A (en)
TW (1) TW594812B (en)
WO (1) WO2002078024A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004010751A1 (en) 2002-07-18 2004-01-29 Hitachi Chemical Co., Ltd. Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device
US7161793B2 (en) 2002-11-14 2007-01-09 Fujitsu Limited Layer capacitor element and production process as well as electronic device
US7224040B2 (en) 2003-11-28 2007-05-29 Gennum Corporation Multi-level thin film capacitor on a ceramic substrate
US8569142B2 (en) 2003-11-28 2013-10-29 Blackberry Limited Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same
US20060217102A1 (en) * 2005-03-22 2006-09-28 Yinon Degani Cellular/Wi-Fi combination devices
US8296943B2 (en) * 2008-05-15 2012-10-30 Kovio, Inc. Method for making surveillance devices with multiple capacitors
EP2519089B1 (en) * 2009-12-24 2017-09-13 Murata Manufacturing Co., Ltd. Circuit module
CN102468052B (en) * 2010-11-08 2016-01-20 佛山市南海区欣源电子有限公司 High-voltage film capacitor with inductive series structure and manufacture method
CN103489640A (en) * 2012-06-11 2014-01-01 佛山市南海区欣源电子有限公司 Manufacturing process of subminiature-structure capacitor
US8912890B2 (en) 2012-10-01 2014-12-16 Thin Film Electronics Asa Surveillance devices with multiple capacitors
KR20160000613A (en) * 2014-06-25 2016-01-05 삼성전기주식회사 Thin film capacitor
JP6557468B2 (en) * 2014-12-25 2019-08-07 ローム株式会社 Chip parts
JPWO2018003445A1 (en) * 2016-06-28 2019-03-07 株式会社村田製作所 Capacitors
JP6857329B2 (en) * 2016-10-24 2021-04-14 大日本印刷株式会社 High frequency parts and their manufacturing methods

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6386413A (en) * 1986-09-29 1988-04-16 ユニチカ株式会社 Manufacture of thin film dielectric material for capacitor
JPH0376151A (en) * 1989-08-18 1991-04-02 Nec Corp Capacitive element
JPH08273978A (en) * 1995-03-29 1996-10-18 Kyocera Corp Thin film capacitor

Also Published As

Publication number Publication date
JP4177560B2 (en) 2008-11-05
JP2002280261A (en) 2002-09-27
WO2002078024A1 (en) 2002-10-03
TW594812B (en) 2004-06-21

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