KR19990044151A - 견고하게 접착된 변형가능한 전자장치용 기판조립장치 - Google Patents

견고하게 접착된 변형가능한 전자장치용 기판조립장치 Download PDF

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Publication number
KR19990044151A
KR19990044151A KR1019980701384A KR19980701384A KR19990044151A KR 19990044151 A KR19990044151 A KR 19990044151A KR 1019980701384 A KR1019980701384 A KR 1019980701384A KR 19980701384 A KR19980701384 A KR 19980701384A KR 19990044151 A KR19990044151 A KR 19990044151A
Authority
KR
South Korea
Prior art keywords
adhesive
substrate
circuit
poly
trace
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019980701384A
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English (en)
Korean (ko)
Inventor
비. 호저튼 피터
이. 카를슨 케네스
Original Assignee
스프레이그 로버트 월터
미네소타마이닝 앤드 매뉴팩춰링 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스프레이그 로버트 월터, 미네소타마이닝 앤드 매뉴팩춰링 캄파니 filed Critical 스프레이그 로버트 월터
Publication of KR19990044151A publication Critical patent/KR19990044151A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/44—Conductive materials thereof
    • H10W20/4473—Conductive organic materials, e.g. conductive adhesives or conductive inks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2804—Next to metal

Landscapes

  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1019980701384A 1995-08-29 1996-08-01 견고하게 접착된 변형가능한 전자장치용 기판조립장치 Withdrawn KR19990044151A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US52113495A 1995-08-29 1995-08-29
US8/521134 1995-08-29

Publications (1)

Publication Number Publication Date
KR19990044151A true KR19990044151A (ko) 1999-06-25

Family

ID=24075503

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019980701384A Withdrawn KR19990044151A (ko) 1995-08-29 1996-08-01 견고하게 접착된 변형가능한 전자장치용 기판조립장치

Country Status (8)

Country Link
US (1) US5714252A (https=)
EP (1) EP0847594B1 (https=)
JP (1) JPH11510649A (https=)
KR (1) KR19990044151A (https=)
CN (1) CN1194059A (https=)
DE (1) DE69622412T2 (https=)
TW (1) TW349269B (https=)
WO (1) WO1997008749A1 (https=)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5700398A (en) * 1994-12-14 1997-12-23 International Business Machines Corporation Composition containing a polymer and conductive filler and use thereof
JPH1041694A (ja) * 1996-07-25 1998-02-13 Sharp Corp 半導体素子の基板実装構造及びその実装方法
JP3928753B2 (ja) 1996-08-06 2007-06-13 日立化成工業株式会社 マルチチップ実装法、および接着剤付チップの製造方法
AU4810197A (en) * 1996-10-08 1998-05-05 Fibercote Industries, Inc. Sheet material for core support
JPH10270496A (ja) 1997-03-27 1998-10-09 Hitachi Ltd 電子装置、情報処理装置、半導体装置並びに半導体チップの実装方法
DE69835747T2 (de) * 1997-06-26 2007-09-13 Hitachi Chemical Co., Ltd. Substrat zur montage von halbleiterchips
US6297559B1 (en) 1997-07-10 2001-10-02 International Business Machines Corporation Structure, materials, and applications of ball grid array interconnections
US6120885A (en) 1997-07-10 2000-09-19 International Business Machines Corporation Structure, materials, and methods for socketable ball grid
US6337522B1 (en) * 1997-07-10 2002-01-08 International Business Machines Corporation Structure employing electrically conductive adhesives
JP3625646B2 (ja) 1998-03-23 2005-03-02 東レエンジニアリング株式会社 フリップチップ実装方法
JP3535746B2 (ja) * 1998-08-20 2004-06-07 ソニーケミカル株式会社 フレキシブル基板製造方法
US6840430B2 (en) * 1998-07-30 2005-01-11 Sony Chemicals, Corp. Board pieces, flexible wiring boards and processes for manufacturing flexible wiring boards
US6596947B1 (en) * 2000-01-28 2003-07-22 Sony Chemicals Corp. Board pieces, flexible wiring boards, and processes for manufacturing flexible wiring boards
US6100114A (en) * 1998-08-10 2000-08-08 International Business Machines Corporation Encapsulation of solder bumps and solder connections
US6189208B1 (en) 1998-09-11 2001-02-20 Polymer Flip Chip Corp. Flip chip mounting technique
US6535393B2 (en) * 1998-12-04 2003-03-18 Micron Technology, Inc. Electrical device allowing for increased device densities
US6274224B1 (en) 1999-02-01 2001-08-14 3M Innovative Properties Company Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article
US6410415B1 (en) 1999-03-23 2002-06-25 Polymer Flip Chip Corporation Flip chip mounting technique
JP2001031929A (ja) * 1999-07-21 2001-02-06 Sony Chem Corp 接続構造体
TW511122B (en) * 1999-12-10 2002-11-21 Ebara Corp Method for mounting semiconductor device and structure thereof
US20030009876A1 (en) * 2000-01-14 2003-01-16 Akira Yamauchi Method and device for chip mounting
US6584670B2 (en) * 2000-02-21 2003-07-01 Larry J. Costa Electrical terminal implementation device
ATE459099T1 (de) 2000-03-10 2010-03-15 Chippac Inc Flipchip-verbindungsstruktur und dessen herstellungsverfahren
US10388626B2 (en) * 2000-03-10 2019-08-20 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming flipchip interconnect structure
DE10014300A1 (de) * 2000-03-23 2001-10-04 Infineon Technologies Ag Halbleiterbauelement und Verfahren zu dessen Herstellung
US6423905B1 (en) * 2000-05-01 2002-07-23 International Business Machines Corporation Printed wiring board with improved plated through hole fatigue life
US6512183B2 (en) * 2000-10-10 2003-01-28 Matsushita Electric Industrial Co., Ltd. Electronic component mounted member and repair method thereof
WO2002065541A2 (de) * 2001-02-13 2002-08-22 Pac Tech - Packaging Technologies Gmbh Presskontaktierung von mikrochips
WO2002093637A2 (en) * 2001-05-17 2002-11-21 Koninklijke Philips Electronics N.V. Product comprising a substrate and a chip attached to the substrate
DE10124770C1 (de) * 2001-05-21 2002-10-17 Infineon Technologies Ag Verfahren zur Kontaktierung eines elektrischen Bauelementes mit einem eine Leiterstruktur aufweisenden Substrat
US6871395B2 (en) * 2001-08-06 2005-03-29 Siemens Technology-To-Business Center, Llc. Methods for manufacturing a tactile sensor using an electrically conductive elastomer
JP4159778B2 (ja) * 2001-12-27 2008-10-01 三菱電機株式会社 Ｉｃパッケージ、光送信器及び光受信器
JP4045838B2 (ja) * 2002-04-12 2008-02-13 松下電器産業株式会社 部品装着管理方法
JP2004119430A (ja) * 2002-09-24 2004-04-15 Tadatomo Suga 接合装置および方法
US7176044B2 (en) * 2002-11-25 2007-02-13 Henkel Corporation B-stageable die attach adhesives
TWI228286B (en) * 2003-11-24 2005-02-21 Ind Tech Res Inst Bonding structure with buffer layer and method of forming the same
FR2875995B1 (fr) * 2004-09-24 2014-10-24 Oberthur Card Syst Sa Procede de montage d'un composant electronique sur un support, de preference mou, et entite electronique ainsi obtenue, telle q'un passeport
KR100757910B1 (ko) * 2006-07-06 2007-09-11 삼성전기주식회사 매립패턴기판 및 그 제조방법
US8201325B2 (en) * 2007-11-22 2012-06-19 International Business Machines Corporation Method for producing an integrated device
JP5528169B2 (ja) * 2010-03-26 2014-06-25 東洋ゴム工業株式会社 研磨パッドおよびその製造方法、ならびに半導体デバイスの製造方法
US9472131B2 (en) * 2012-11-02 2016-10-18 Apple Inc. Testing of integrated circuit to substrate joints
JP6380069B2 (ja) * 2014-12-11 2018-08-29 住友電気工業株式会社 光送信モジュール
TWI696300B (zh) 2016-03-15 2020-06-11 晶元光電股份有限公司 半導體裝置及其製造方法
TWI581417B (zh) * 2016-04-11 2017-05-01 友達光電股份有限公司 發光裝置及其製造方法
TW202541302A (zh) * 2019-02-04 2025-10-16 日商索尼半導體解決方案公司 電子裝置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2610539A1 (de) * 1976-03-12 1977-09-22 Siemens Ag Halbleiterbauelement mit elektrischen kontakten und verfahren zur herstellung solcher kontakte
JPS59195837A (ja) * 1983-04-21 1984-11-07 Sharp Corp Ｌｓｉチツプボンデイング方法
US4643935A (en) * 1986-01-21 1987-02-17 Burroughs Corporation Epoxy-glass integrated circuit package having bonding pads in a stepped cavity
US4749120A (en) * 1986-12-18 1988-06-07 Matsushita Electric Industrial Co., Ltd. Method of connecting a semiconductor device to a wiring board
KR900015914A (ko) * 1988-04-13 1990-11-10 미다 가쓰시게 유기재료와 무기재료와의 적층구조체
US5001542A (en) * 1988-12-05 1991-03-19 Hitachi Chemical Company Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
US5074947A (en) * 1989-12-18 1991-12-24 Epoxy Technology, Inc. Flip chip technology using electrically conductive polymers and dielectrics
US5121190A (en) * 1990-03-14 1992-06-09 International Business Machines Corp. Solder interconnection structure on organic substrates
US5270260A (en) * 1990-08-23 1993-12-14 Siemens Aktiengesellschaft Method and apparatus for connecting a semiconductor chip to a carrier system
US5261156A (en) * 1991-02-28 1993-11-16 Semiconductor Energy Laboratory Co., Ltd. Method of electrically connecting an integrated circuit to an electric device
US5258577A (en) * 1991-11-22 1993-11-02 Clements James R Die mounting with uniaxial conductive adhesive

Also Published As

Publication number Publication date
US5714252A (en) 1998-02-03
DE69622412D1 (de) 2002-08-22
EP0847594B1 (en) 2002-07-17
EP0847594A1 (en) 1998-06-17
JPH11510649A (ja) 1999-09-14
CN1194059A (zh) 1998-09-23
DE69622412T2 (de) 2003-03-20
HK1012521A1 (en) 1999-08-06
WO1997008749A1 (en) 1997-03-06
TW349269B (en) 1999-01-01

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