KR19980019226A - 집적 회로의 마이크로전자 회로를 스크린하기 위한 장치(arrangement for screening a microelectronic circuit in an integrated circuit) - Google Patents

집적 회로의 마이크로전자 회로를 스크린하기 위한 장치(arrangement for screening a microelectronic circuit in an integrated circuit) Download PDF

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KR19980019226A
KR19980019226A KR1019970046033A KR19970046033A KR19980019226A KR 19980019226 A KR19980019226 A KR 19980019226A KR 1019970046033 A KR1019970046033 A KR 1019970046033A KR 19970046033 A KR19970046033 A KR 19970046033A KR 19980019226 A KR19980019226 A KR 19980019226A
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circuit
carrier
microelectronic
integrated circuit
screen
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KR1019970046033A
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베르너 폴러스벡크
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한스-위르겐 마우테
테믹 텔레풍켄 마이크로엘렉트로닉 게엠베하
게오르크 콜프
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Publication of KR19980019226A publication Critical patent/KR19980019226A/ko

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Abstract

캐리어상에 배열된 집적 회로의 마이크로전자 회로를 스크린하고 상기 마이크로전자 회로는 기판 및 캐리어에 면하는 기판의 측면에 배열된 장치.

Description

집적 회로의 마이크로전자 회로를 스크린하기 위한 장치
본 발명은 캐리어상에 배열된 집적 회로의 마이크로전자 회로를 스크린하기 위한 장치에 관한 것이고 상기 마이크로전자 회로는 기판 및 캐리어에 면하는 기판의 측면에 배열된다.
전자기 간섭 및 전자기 호환성은 크게 문제가 된다. 마이크로프로세서, 메모리, 논리 IC등 같은 디지털 회로는 한편으로 동작 성능을 개선하기 위하여, 매우 높은 클럭 주파수로 동작되고, 보다 빠른 스위칭 비율은 필수적으로 보다 가파른 스위칭 가장자리를 요구한다. 전자기 방사선 형태의 방사(간섭) 에너지는 4개의 전력에 의해 클럭 사이클 비율과 관련하여 증가한다.
게다가, GPS(글로벌 배치 시스템), 이동 전송 및 무선 장치같은 무선파를 포함하는 장치는 낮은 에너지 레벨을 가진 간섭 방사선이 네가티브 효과를 가지는 경우 매우 높은 정도의 감도를 가진다.
도 2는 금속 시트 또는 그와 동종의 특정 추가 스크린 장치없는 최첨단 장치를 도시한다. 상부에 마이크로전자 회로(7)를 가진 기판(6)은 집적 회로(3)내에 배열된다. 집적 회로(3)가 동작할 때, 마이크로전자 회로(7)은 화살표(10a)에 의해 지시된 바와같이 주로 상부 방향으로 고주파 전자기 간섭 방사선을 방사한다. 4개의 전력에 의해 클럭 펄스 주파수에 대해 증가하는 에너지를 가진 고주파 간섭 방사선은 이웃 데이터 라인 또는 마이크로전자 회로에 상당한 손상을 유발하고 결과적으로 스크린되어야 한다. 화살표(10b)에 의해 지시된 방향으로 방사된 간섭 에너지는 기판(6)에 의해 많이 흡수되고, 일반적으로 회로의 기준 전위를 나타내고 결국 간섭을 유발하지 않는다. 이런 환경은 간섭 방사선을 스크린하기 위하여 본 발명에 사용된다.
모든 제어 장치 또는 고주파 밀봉 하우징, 부분 스크린 또는 접지되고 접혀진 금속 시트를 가진 부분을 제공하고 캐패시터 및 인덕터에 의해 전기 입력 및 출력 전도체의 고주파 간섭을 필터링함으로서 간섭 방사선과 관련된 문제를 해결하는 것은 최첨단 기술이다.
예를들어, 챔버를 형성하기 위한 스크린판은 전기 및 특히 프린팅 회로를 수용하기에 적당한 DE-OS 39 15 651에서 공지된다. 여기서, 완전한 제어 장치는 스크린 챔버에 의해 둘러싸진다.
이런 종류의 최첨단 스크린 측정은 그것들이 추가의 작업 단계 및 재료를 요구하거나 예를 들어 금속 하우징이 사용될 때 많은 추가 중량을 나타내는 단점을 가진다.
본 발명의 목적은 상기된 단점을 방지하는 장치를 제공하는 것이다.
도1은 본 발명에 따른 간섭 방사선을 스크린하기 위한 장치
도2는 종래 상태에 따른 장치
* 도면의 주요 부분에 대한 보호의 설명
1 : 프린팅 회로 보드2 : 프린팅 전도체
3 : 집적 회로4 : 접속 엘리먼트
5 : 하우징6 : 기판
7 : 마이크로전자 회로8 : 본딩 와이어
9 : 스크린 프린팅 전도체
본 발명에 따라 캐리어상에 배열된 집적 회로의 마이크로전자 회로를 스크린하기 위한 장치가 제공되고 그것의 전자 회로는 기판 및 캐리어에 면하는 기판측면에 배열된다.
본 발명의 추가 장점은 종속항에 기술된다.
본 발명의 장점은 전자기 간섭 방사선의 효과적인 스크린이 추가의 중량 또는 추가의 작업 단계를 요구하지 않고 이루어진다는 것이다.
본 발명의 실시예는 도면을 참조하여 상세히 기술된다.
도 1 및 도 2는 집적 회로(3)가 접속 엘리먼트(4)에 의해 납땜되는 프린팅 전도체(2)를 가진 프린팅 회로 보드(1) 형태의 캐리어를 포함하는 장치를 도시한다. 집적 회로(3)는 마이크로전자 회로(7)와 함께 기판(6)이 배치되는 열가소성 하우징(5)을 포함한다. 프린팅 전도체(2) 및 마이크로전자 회로(7)는 알루미늄 또는 금 합금으로 만들어진 본딩 와이어(8)에 의해 함께 접속된다.
최첨단 기술과 비교하여, 도 1에 도시된 본 발명에 따른 장치는 두개의 특징을 가진다. 첫째, 마이크로전자 회로(7)는 기판의 하부측에 배열되고, 둘째로, 스크린 프린팅 전도체 형태의 광역 스크린(9)은 집적 회로(3) 아래 프린팅 회로 보드(1)상에 추가로 배열된다. 집적 회로(3)가 동작할 때, 화살표(10b) 방향의 위쪽으로 방사된 간섭 방사선은 기판(6)에 의해 거의 흡수되고 그러므로 어떤 이웃 회로 또는 데이터 라인과 간섭하지 않는다. 화살표(10a)의 방향으로 아래로 방사된 간섭 방사선은 스크린 프린팅 전도체(9)에 의해 흡수되고 그래서 해롭다. 스크린 프린팅 회로(9)는 바람직하게 집적 회로(3)의 대응 크기에 대응하는 길이 및 폭을 가진 프린팅 회로 보드(1)상에 적층된 구리로 이루어진 트랙이다. 만약 스크린 프린팅 전도체(9)가 기준 전위, 공급 전압 또는 다른 적당한 전위에 연결되며, 간섭 방사선에 의해 유도된 전압은 어떤 추가의 간섭을 유발하지 않고 전환된다.
고주파 전자기 간섭 방사선을 스크린하기 위한 본 발명에 따른 장치는 고주파 전위에서 구동되는 마이크로전자 회로에서 주로 사용되고 그것의 이웃에서 데이터 라인을 간섭 또는 감지하는데 민감한 다른 회로가 배열된다. 스크린판, 금속 하우징 또는 스크린 측정의 사용은 더 이상 필요하지 않다.
본 발명의 효과는 추가의 작업 단계 및 재료를 요구하거나 예를 들어 금속 하우징이 사용될 때 많은 추가 중량을 나타내는 단점을 방지한다.

Claims (7)

  1. 캐리어상에 배열된 집적 회로의 마이크로전자 회로를 스크린하고 상기 마이크로전자 회로가 기판상에 배열되는 장치에 있어서, 상기 마이크로전자 회로는 캐리어에 면하는 기판의 측면상에 배열되는 것을 특징으로 하는 장치.
  2. 제1항에 있어서, 스크린은 집적 회로 및 캐리어 사이에 부가적으로 배열되는 것을 특징으로 하는 장치.
  3. 제2항에 있어서, 스크린은 캐리어상에 배열된 스크린 프린팅 전도체를 포함하는 것을 특징으로 하는 장치.
  4. 제3항에 있어서, 상기 스크린 프린팅 전도체는 기준 전위, 공급 전압 또는 회로의 다른 적당한 전위에 접속되는 것을 특징으로 하는 장치.
  5. 제3항에 있어서, 상기 스크린 프린팅 전도체는 캐리어상에 적층된 구리로 만들어진 프린팅 전도체를 포함하는 것을 특징으로 하는 장치.
  6. 제3항에 있어서, 상기 스크린 프린팅 전자 회로는 집적 회로의 대응 크기에 대응하는 길이 및 폭을 가지는 것을 특징으로 하는 장치.
  7. 제1항에 있어서, 상기 캐리어는 프린팅 회로 보드인 것을 특징으로 하는 장치.
KR1019970046033A 1996-08-30 1997-08-27 집적 회로의 마이크로전자 회로를 스크린하기 위한 장치(arrangement for screening a microelectronic circuit in an integrated circuit) KR19980019226A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19635071.9 1996-08-30
DE19635071A DE19635071C1 (de) 1996-08-30 1996-08-30 Anordnung zur Abschirmung einer mikroelektronischen Schaltung eines integrierten Schaltkreises

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KR19980019226A true KR19980019226A (ko) 1998-06-05

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EP (1) EP0827200A1 (ko)
JP (1) JPH1093291A (ko)
KR (1) KR19980019226A (ko)
DE (1) DE19635071C1 (ko)

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Publication number Priority date Publication date Assignee Title
DE10157547C1 (de) * 2001-11-23 2003-04-24 Siemens Ag Abschirmvorrichtung
JP2019165197A (ja) * 2017-12-13 2019-09-26 株式会社村田製作所 半導体部品のemc保護

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Publication number Priority date Publication date Assignee Title
JPS57155754A (en) * 1981-03-23 1982-09-25 Hitachi Ltd Mounting structure of resin mold-type high-frequency transistor
JPS6132451A (ja) * 1984-07-25 1986-02-15 Hitachi Ltd 樹脂封止型半導体装置
JPH01128452A (ja) * 1987-11-12 1989-05-22 New Japan Radio Co Ltd 半導体装置
JPH0263195A (ja) * 1988-08-29 1990-03-02 Mitsubishi Electric Corp 電子機器
DE3915651A1 (de) * 1989-05-12 1990-11-15 Bosch Gmbh Robert Abschirmblech
JPH03120746A (ja) * 1989-10-03 1991-05-22 Matsushita Electric Ind Co Ltd 半導体素子パッケージおよび半導体素子パッケージ搭載配線回路基板
JPH06169047A (ja) * 1992-11-30 1994-06-14 Mitsubishi Electric Corp 半導体装置
US5294826A (en) * 1993-04-16 1994-03-15 Northern Telecom Limited Integrated circuit package and assembly thereof for thermal and EMI management
JPH07263871A (ja) * 1994-03-18 1995-10-13 Fujitsu Ltd プリント配線板

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JPH1093291A (ja) 1998-04-10
EP0827200A1 (de) 1998-03-04
DE19635071C1 (de) 1997-08-28

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