KR102820137B1 - 후막 저항 페이스트, 후막 저항체, 및 전자 부품 - Google Patents

후막 저항 페이스트, 후막 저항체, 및 전자 부품 Download PDF

Info

Publication number
KR102820137B1
KR102820137B1 KR1020227035722A KR20227035722A KR102820137B1 KR 102820137 B1 KR102820137 B1 KR 102820137B1 KR 1020227035722 A KR1020227035722 A KR 1020227035722A KR 20227035722 A KR20227035722 A KR 20227035722A KR 102820137 B1 KR102820137 B1 KR 102820137B1
Authority
KR
South Korea
Prior art keywords
mass
film resistor
thick
glass
oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020227035722A
Other languages
English (en)
Korean (ko)
Other versions
KR20230004487A (ko
Inventor
마사키 안도
다카히토 나가노
Original Assignee
스미토모 긴조쿠 고잔 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미토모 긴조쿠 고잔 가부시키가이샤 filed Critical 스미토모 긴조쿠 고잔 가부시키가이샤
Publication of KR20230004487A publication Critical patent/KR20230004487A/ko
Application granted granted Critical
Publication of KR102820137B1 publication Critical patent/KR102820137B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/16—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component
    • H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component composed of oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electromagnetism (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Adjustable Resistors (AREA)
  • Conductive Materials (AREA)
  • Glass Compositions (AREA)
KR1020227035722A 2020-05-01 2021-04-30 후막 저항 페이스트, 후막 저항체, 및 전자 부품 Active KR102820137B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020081116 2020-05-01
JPJP-P-2020-081116 2020-05-01
PCT/JP2021/017301 WO2021221175A1 (ja) 2020-05-01 2021-04-30 厚膜抵抗ペースト、厚膜抵抗体、及び電子部品

Publications (2)

Publication Number Publication Date
KR20230004487A KR20230004487A (ko) 2023-01-06
KR102820137B1 true KR102820137B1 (ko) 2025-06-12

Family

ID=78332009

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227035722A Active KR102820137B1 (ko) 2020-05-01 2021-04-30 후막 저항 페이스트, 후막 저항체, 및 전자 부품

Country Status (6)

Country Link
US (1) US12249447B2 (https=)
JP (1) JP7622739B2 (https=)
KR (1) KR102820137B1 (https=)
CN (1) CN115516579A (https=)
TW (1) TW202200514A (https=)
WO (1) WO2021221175A1 (https=)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5254195A (en) * 1975-10-29 1977-05-02 Hitachi Ltd Resistor
JPS53100496A (en) * 1977-02-15 1978-09-01 Sumitomo Metal Mining Co Method of manufacturing paste for resistance body
JPS6324601A (ja) * 1986-07-17 1988-02-02 松下電器産業株式会社 描画用抵抗体組成物
JPH04320003A (ja) 1991-04-18 1992-11-10 Tdk Corp 厚膜抵抗体
JPH06140214A (ja) * 1992-10-23 1994-05-20 Sumitomo Metal Mining Co Ltd 厚膜抵抗体ペーストの製造方法および厚膜抵抗体の形成方法
JPH06163202A (ja) 1992-11-19 1994-06-10 Tdk Corp 厚膜抵抗体用ペーストならびに厚膜抵抗体およびその製造方法
US5379016A (en) * 1993-06-03 1995-01-03 E. I. Du Pont De Nemours And Company Chip resistor
JP2004320003A (ja) 2003-03-31 2004-11-11 Seiko Epson Corp 液滴吐出装置によるパターン形成方法および液滴吐出装置
JP2006163202A (ja) 2004-12-09 2006-06-22 Agilent Technol Inc アレイ基板の検査方法及び検査装置
JP4706703B2 (ja) 2005-04-25 2011-06-22 株式会社村田製作所 抵抗ペースト、可変抵抗器及びその製造方法
JP5835325B2 (ja) * 2011-06-21 2015-12-24 住友金属鉱山株式会社 酸化ルテニウム粉末、それを用いた厚膜抵抗体用組成物、厚膜抵抗体ペーストおよび厚膜抵抗体
US8815125B2 (en) * 2012-06-20 2014-08-26 E. I. Du Pont De Nemours And Company Method of manufacturing a resistor paste
US10115505B2 (en) * 2017-02-23 2018-10-30 E I Du Pont De Nemours And Company Chip resistor
US12024466B2 (en) * 2020-05-01 2024-07-02 Sumitomo Metal Mining Co., Ltd. Thick film resistor paste, thick film resistor, and electronic component
JP2023100496A (ja) * 2022-01-06 2023-07-19 株式会社三洋物産 遊技機
JP2023054195A (ja) * 2022-07-05 2023-04-13 パイオニア株式会社 走行軌跡取得方法

Also Published As

Publication number Publication date
JPWO2021221175A1 (https=) 2021-11-04
JP7622739B2 (ja) 2025-01-28
KR20230004487A (ko) 2023-01-06
WO2021221175A1 (ja) 2021-11-04
TW202200514A (zh) 2022-01-01
US20230162896A1 (en) 2023-05-25
US12249447B2 (en) 2025-03-11
CN115516579A (zh) 2022-12-23

Similar Documents

Publication Publication Date Title
US10636541B2 (en) Conductive paste and method for forming terminal electrodes of multilayer ceramic component
JP4958904B2 (ja) コンデンサ用の鉛フリー及びカドミウムフリーガラスを含む銅端子インク
KR102820136B1 (ko) 후막 저항 페이스트, 후막 저항체, 및 전자 부품
KR102845029B1 (ko) 후막 저항 페이스트, 후막 저항체, 및 전자 부품
JP2005235754A (ja) 導電性材料及びその製造方法、抵抗体ペースト、抵抗体、電子部品
KR102820137B1 (ko) 후막 저항 페이스트, 후막 저항체, 및 전자 부품
KR102851511B1 (ko) 후막 저항 페이스트, 후막 저항체, 및 전자 부품
JP2005209744A (ja) 厚膜抵抗体ペースト及び厚膜抵抗体、電子部品
JP7794036B2 (ja) 厚膜抵抗ペースト、厚膜抵抗体、及び電子部品
JP2004111599A (ja) ニッケル内部電極を用いた積層チップコンデンサ
JP2005209748A (ja) 抵抗体及びその製造方法、電子部品
JP2006202925A (ja) 厚膜抵抗体及びその製造方法、並びに電子部品
JP2006261243A (ja) 抵抗体ペースト、抵抗体及び電子部品
JP2005244113A (ja) 厚膜構造体、厚膜構造体用ペースト、及び厚膜構造体の製造方法
JP2005209747A (ja) 抵抗体ペースト及びその製造方法、抵抗体、電子部品
JP2006261250A (ja) 抵抗体ペースト、抵抗体及び電子部品
JP2006261251A (ja) 抵抗体ペースト、抵抗体及び電子部品
JP2006236621A (ja) 厚膜抵抗体ペースト及びその製造方法
JP2006165348A (ja) 抵抗体ペースト及び抵抗体、電子部品

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20221013

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20231113

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20241004

Patent event code: PE09021S01D

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

Comment text: Final Notice of Reason for Refusal

Patent event date: 20250123

Patent event code: PE09021S02D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20250326

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20250610

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20250610

End annual number: 3

Start annual number: 1

PG1601 Publication of registration