TW202200514A - 厚膜電阻糊、厚膜電阻體、及電子元件 - Google Patents

厚膜電阻糊、厚膜電阻體、及電子元件 Download PDF

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Publication number
TW202200514A
TW202200514A TW110115858A TW110115858A TW202200514A TW 202200514 A TW202200514 A TW 202200514A TW 110115858 A TW110115858 A TW 110115858A TW 110115858 A TW110115858 A TW 110115858A TW 202200514 A TW202200514 A TW 202200514A
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TW
Taiwan
Prior art keywords
mass
thick film
film resistor
oxide
glass
Prior art date
Application number
TW110115858A
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English (en)
Chinese (zh)
Inventor
安藤真規
永野崇仁
Original Assignee
日商住友金屬鑛山股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商住友金屬鑛山股份有限公司 filed Critical 日商住友金屬鑛山股份有限公司
Publication of TW202200514A publication Critical patent/TW202200514A/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component
    • H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component composed of oxides
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/16—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electromagnetism (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Adjustable Resistors (AREA)
  • Conductive Materials (AREA)
  • Glass Compositions (AREA)
TW110115858A 2020-05-01 2021-05-03 厚膜電阻糊、厚膜電阻體、及電子元件 TW202200514A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020081116 2020-05-01
JP2020-081116 2020-05-01

Publications (1)

Publication Number Publication Date
TW202200514A true TW202200514A (zh) 2022-01-01

Family

ID=78332009

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110115858A TW202200514A (zh) 2020-05-01 2021-05-03 厚膜電阻糊、厚膜電阻體、及電子元件

Country Status (6)

Country Link
US (1) US12249447B2 (https=)
JP (1) JP7622739B2 (https=)
KR (1) KR102820137B1 (https=)
CN (1) CN115516579A (https=)
TW (1) TW202200514A (https=)
WO (1) WO2021221175A1 (https=)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5254195A (en) * 1975-10-29 1977-05-02 Hitachi Ltd Resistor
JPS53100496A (en) * 1977-02-15 1978-09-01 Sumitomo Metal Mining Co Method of manufacturing paste for resistance body
JPS6324601A (ja) * 1986-07-17 1988-02-02 松下電器産業株式会社 描画用抵抗体組成物
JPH04320003A (ja) 1991-04-18 1992-11-10 Tdk Corp 厚膜抵抗体
JPH06140214A (ja) * 1992-10-23 1994-05-20 Sumitomo Metal Mining Co Ltd 厚膜抵抗体ペーストの製造方法および厚膜抵抗体の形成方法
JPH06163202A (ja) 1992-11-19 1994-06-10 Tdk Corp 厚膜抵抗体用ペーストならびに厚膜抵抗体およびその製造方法
US5379016A (en) * 1993-06-03 1995-01-03 E. I. Du Pont De Nemours And Company Chip resistor
JP2004320003A (ja) 2003-03-31 2004-11-11 Seiko Epson Corp 液滴吐出装置によるパターン形成方法および液滴吐出装置
JP2006163202A (ja) 2004-12-09 2006-06-22 Agilent Technol Inc アレイ基板の検査方法及び検査装置
JP4706703B2 (ja) 2005-04-25 2011-06-22 株式会社村田製作所 抵抗ペースト、可変抵抗器及びその製造方法
JP5835325B2 (ja) * 2011-06-21 2015-12-24 住友金属鉱山株式会社 酸化ルテニウム粉末、それを用いた厚膜抵抗体用組成物、厚膜抵抗体ペーストおよび厚膜抵抗体
US8815125B2 (en) * 2012-06-20 2014-08-26 E. I. Du Pont De Nemours And Company Method of manufacturing a resistor paste
US10115505B2 (en) * 2017-02-23 2018-10-30 E I Du Pont De Nemours And Company Chip resistor
CN115443513B (zh) * 2020-05-01 2026-02-10 住友金属矿山株式会社 厚膜电阻糊、厚膜电阻体和电子部件
JP2023100496A (ja) * 2022-01-06 2023-07-19 株式会社三洋物産 遊技機
JP2023054195A (ja) * 2022-07-05 2023-04-13 パイオニア株式会社 走行軌跡取得方法

Also Published As

Publication number Publication date
WO2021221175A1 (ja) 2021-11-04
CN115516579A (zh) 2022-12-23
US12249447B2 (en) 2025-03-11
KR20230004487A (ko) 2023-01-06
KR102820137B1 (ko) 2025-06-12
JPWO2021221175A1 (https=) 2021-11-04
JP7622739B2 (ja) 2025-01-28
US20230162896A1 (en) 2023-05-25

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