JPWO2021221175A1 - - Google Patents
Info
- Publication number
- JPWO2021221175A1 JPWO2021221175A1 JP2022518162A JP2022518162A JPWO2021221175A1 JP WO2021221175 A1 JPWO2021221175 A1 JP WO2021221175A1 JP 2022518162 A JP2022518162 A JP 2022518162A JP 2022518162 A JP2022518162 A JP 2022518162A JP WO2021221175 A1 JPWO2021221175 A1 JP WO2021221175A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component
- H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component composed of oxides
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
- C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/16—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Geochemistry & Mineralogy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Electromagnetism (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Non-Adjustable Resistors (AREA)
- Conductive Materials (AREA)
- Glass Compositions (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020081116 | 2020-05-01 | ||
| JP2020081116 | 2020-05-01 | ||
| PCT/JP2021/017301 WO2021221175A1 (ja) | 2020-05-01 | 2021-04-30 | 厚膜抵抗ペースト、厚膜抵抗体、及び電子部品 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021221175A1 true JPWO2021221175A1 (https=) | 2021-11-04 |
| JPWO2021221175A5 JPWO2021221175A5 (https=) | 2023-12-18 |
| JP7622739B2 JP7622739B2 (ja) | 2025-01-28 |
Family
ID=78332009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022518162A Active JP7622739B2 (ja) | 2020-05-01 | 2021-04-30 | 厚膜抵抗ペースト、厚膜抵抗体、及び電子部品 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12249447B2 (https=) |
| JP (1) | JP7622739B2 (https=) |
| KR (1) | KR102820137B1 (https=) |
| CN (1) | CN115516579A (https=) |
| TW (1) | TW202200514A (https=) |
| WO (1) | WO2021221175A1 (https=) |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5254195A (en) * | 1975-10-29 | 1977-05-02 | Hitachi Ltd | Resistor |
| JPS53100496A (en) * | 1977-02-15 | 1978-09-01 | Sumitomo Metal Mining Co | Method of manufacturing paste for resistance body |
| JPS6324601A (ja) * | 1986-07-17 | 1988-02-02 | 松下電器産業株式会社 | 描画用抵抗体組成物 |
| JPH04320003A (ja) | 1991-04-18 | 1992-11-10 | Tdk Corp | 厚膜抵抗体 |
| JPH06140214A (ja) * | 1992-10-23 | 1994-05-20 | Sumitomo Metal Mining Co Ltd | 厚膜抵抗体ペーストの製造方法および厚膜抵抗体の形成方法 |
| JPH06163202A (ja) | 1992-11-19 | 1994-06-10 | Tdk Corp | 厚膜抵抗体用ペーストならびに厚膜抵抗体およびその製造方法 |
| US5379016A (en) * | 1993-06-03 | 1995-01-03 | E. I. Du Pont De Nemours And Company | Chip resistor |
| JP2004320003A (ja) | 2003-03-31 | 2004-11-11 | Seiko Epson Corp | 液滴吐出装置によるパターン形成方法および液滴吐出装置 |
| JP2006163202A (ja) | 2004-12-09 | 2006-06-22 | Agilent Technol Inc | アレイ基板の検査方法及び検査装置 |
| JP4706703B2 (ja) | 2005-04-25 | 2011-06-22 | 株式会社村田製作所 | 抵抗ペースト、可変抵抗器及びその製造方法 |
| JP5835325B2 (ja) * | 2011-06-21 | 2015-12-24 | 住友金属鉱山株式会社 | 酸化ルテニウム粉末、それを用いた厚膜抵抗体用組成物、厚膜抵抗体ペーストおよび厚膜抵抗体 |
| US8815125B2 (en) * | 2012-06-20 | 2014-08-26 | E. I. Du Pont De Nemours And Company | Method of manufacturing a resistor paste |
| US10115505B2 (en) * | 2017-02-23 | 2018-10-30 | E I Du Pont De Nemours And Company | Chip resistor |
| US12024466B2 (en) * | 2020-05-01 | 2024-07-02 | Sumitomo Metal Mining Co., Ltd. | Thick film resistor paste, thick film resistor, and electronic component |
| JP2023100496A (ja) * | 2022-01-06 | 2023-07-19 | 株式会社三洋物産 | 遊技機 |
| JP2023054195A (ja) * | 2022-07-05 | 2023-04-13 | パイオニア株式会社 | 走行軌跡取得方法 |
-
2021
- 2021-04-30 US US17/921,854 patent/US12249447B2/en active Active
- 2021-04-30 CN CN202180032116.1A patent/CN115516579A/zh active Pending
- 2021-04-30 KR KR1020227035722A patent/KR102820137B1/ko active Active
- 2021-04-30 WO PCT/JP2021/017301 patent/WO2021221175A1/ja not_active Ceased
- 2021-04-30 JP JP2022518162A patent/JP7622739B2/ja active Active
- 2021-05-03 TW TW110115858A patent/TW202200514A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP7622739B2 (ja) | 2025-01-28 |
| KR20230004487A (ko) | 2023-01-06 |
| WO2021221175A1 (ja) | 2021-11-04 |
| TW202200514A (zh) | 2022-01-01 |
| KR102820137B1 (ko) | 2025-06-12 |
| US20230162896A1 (en) | 2023-05-25 |
| US12249447B2 (en) | 2025-03-11 |
| CN115516579A (zh) | 2022-12-23 |
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