CN115516579A - 厚膜电阻糊、厚膜电阻体和电子部件 - Google Patents

厚膜电阻糊、厚膜电阻体和电子部件 Download PDF

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Publication number
CN115516579A
CN115516579A CN202180032116.1A CN202180032116A CN115516579A CN 115516579 A CN115516579 A CN 115516579A CN 202180032116 A CN202180032116 A CN 202180032116A CN 115516579 A CN115516579 A CN 115516579A
Authority
CN
China
Prior art keywords
mass
film resistor
oxide
thick film
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180032116.1A
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English (en)
Chinese (zh)
Inventor
安藤真规
永野崇仁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Publication of CN115516579A publication Critical patent/CN115516579A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component
    • H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component composed of oxides
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/10—Frit compositions, i.e. in a powdered or comminuted form containing lead
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/16—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electromagnetism (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Adjustable Resistors (AREA)
  • Conductive Materials (AREA)
  • Glass Compositions (AREA)
CN202180032116.1A 2020-05-01 2021-04-30 厚膜电阻糊、厚膜电阻体和电子部件 Pending CN115516579A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-081116 2020-05-01
JP2020081116 2020-05-01
PCT/JP2021/017301 WO2021221175A1 (ja) 2020-05-01 2021-04-30 厚膜抵抗ペースト、厚膜抵抗体、及び電子部品

Publications (1)

Publication Number Publication Date
CN115516579A true CN115516579A (zh) 2022-12-23

Family

ID=78332009

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180032116.1A Pending CN115516579A (zh) 2020-05-01 2021-04-30 厚膜电阻糊、厚膜电阻体和电子部件

Country Status (6)

Country Link
US (1) US12249447B2 (https=)
JP (1) JP7622739B2 (https=)
KR (1) KR102820137B1 (https=)
CN (1) CN115516579A (https=)
TW (1) TW202200514A (https=)
WO (1) WO2021221175A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5254195A (en) * 1975-10-29 1977-05-02 Hitachi Ltd Resistor
JPS53100496A (en) * 1977-02-15 1978-09-01 Sumitomo Metal Mining Co Method of manufacturing paste for resistance body
CN103429537A (zh) * 2011-06-21 2013-12-04 住友金属矿山株式会社 氧化钌粉末、使用它的厚膜电阻体用组合物及厚膜电阻体

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6324601A (ja) * 1986-07-17 1988-02-02 松下電器産業株式会社 描画用抵抗体組成物
JPH04320003A (ja) 1991-04-18 1992-11-10 Tdk Corp 厚膜抵抗体
JPH06140214A (ja) * 1992-10-23 1994-05-20 Sumitomo Metal Mining Co Ltd 厚膜抵抗体ペーストの製造方法および厚膜抵抗体の形成方法
JPH06163202A (ja) 1992-11-19 1994-06-10 Tdk Corp 厚膜抵抗体用ペーストならびに厚膜抵抗体およびその製造方法
US5379016A (en) * 1993-06-03 1995-01-03 E. I. Du Pont De Nemours And Company Chip resistor
JP2004320003A (ja) 2003-03-31 2004-11-11 Seiko Epson Corp 液滴吐出装置によるパターン形成方法および液滴吐出装置
JP2006163202A (ja) 2004-12-09 2006-06-22 Agilent Technol Inc アレイ基板の検査方法及び検査装置
JP4706703B2 (ja) 2005-04-25 2011-06-22 株式会社村田製作所 抵抗ペースト、可変抵抗器及びその製造方法
US8815125B2 (en) * 2012-06-20 2014-08-26 E. I. Du Pont De Nemours And Company Method of manufacturing a resistor paste
US10115505B2 (en) * 2017-02-23 2018-10-30 E I Du Pont De Nemours And Company Chip resistor
US12024466B2 (en) * 2020-05-01 2024-07-02 Sumitomo Metal Mining Co., Ltd. Thick film resistor paste, thick film resistor, and electronic component
JP2023100496A (ja) * 2022-01-06 2023-07-19 株式会社三洋物産 遊技機
JP2023054195A (ja) * 2022-07-05 2023-04-13 パイオニア株式会社 走行軌跡取得方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5254195A (en) * 1975-10-29 1977-05-02 Hitachi Ltd Resistor
JPS53100496A (en) * 1977-02-15 1978-09-01 Sumitomo Metal Mining Co Method of manufacturing paste for resistance body
CN103429537A (zh) * 2011-06-21 2013-12-04 住友金属矿山株式会社 氧化钌粉末、使用它的厚膜电阻体用组合物及厚膜电阻体

Also Published As

Publication number Publication date
JPWO2021221175A1 (https=) 2021-11-04
JP7622739B2 (ja) 2025-01-28
KR20230004487A (ko) 2023-01-06
WO2021221175A1 (ja) 2021-11-04
TW202200514A (zh) 2022-01-01
KR102820137B1 (ko) 2025-06-12
US20230162896A1 (en) 2023-05-25
US12249447B2 (en) 2025-03-11

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