KR102805717B1 - 저항체 페이스트, 소성체 및 전기 제품 - Google Patents
저항체 페이스트, 소성체 및 전기 제품 Download PDFInfo
- Publication number
- KR102805717B1 KR102805717B1 KR1020227025740A KR20227025740A KR102805717B1 KR 102805717 B1 KR102805717 B1 KR 102805717B1 KR 1020227025740 A KR1020227025740 A KR 1020227025740A KR 20227025740 A KR20227025740 A KR 20227025740A KR 102805717 B1 KR102805717 B1 KR 102805717B1
- Authority
- KR
- South Korea
- Prior art keywords
- resistor
- resistor paste
- metal powder
- rhodium
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Non-Adjustable Resistors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020001563 | 2020-01-08 | ||
| JPJP-P-2020-001563 | 2020-01-08 | ||
| PCT/JP2021/000083 WO2021141021A1 (ja) | 2020-01-08 | 2021-01-05 | 抵抗体ペースト、焼成体及び電気製品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20220119705A KR20220119705A (ko) | 2022-08-30 |
| KR102805717B1 true KR102805717B1 (ko) | 2025-05-13 |
Family
ID=76788068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020227025740A Active KR102805717B1 (ko) | 2020-01-08 | 2021-01-05 | 저항체 페이스트, 소성체 및 전기 제품 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7687686B2 (https=) |
| KR (1) | KR102805717B1 (https=) |
| CN (1) | CN114902355B (https=) |
| TW (1) | TWI874550B (https=) |
| WO (1) | WO2021141021A1 (https=) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005244119A (ja) * | 2004-02-27 | 2005-09-08 | Tdk Corp | 抵抗体ペースト及びこれを用いた抵抗体 |
| JP2013161770A (ja) * | 2012-02-09 | 2013-08-19 | Kyoto Elex Kk | セラミック基板ヒータ用抵抗体ペーストおよびセラミック基板ヒータ |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL7809553A (nl) * | 1978-09-20 | 1980-03-24 | Philips Nv | Weerstandsmateriaal. |
| NL8102809A (nl) * | 1981-06-11 | 1983-01-03 | Philips Nv | Weerstandspasta voor een weerstandslichaam. |
| US5162062A (en) * | 1991-06-17 | 1992-11-10 | E. I. Du Pont De Nemours And Company | Method for making multilayer electronic circuits |
| GB0108888D0 (en) * | 2001-04-09 | 2001-05-30 | Du Pont | Conductor composition IV |
| JP2002367804A (ja) * | 2001-06-11 | 2002-12-20 | K-Tech Devices Corp | 抵抗器 |
| JP4050593B2 (ja) * | 2002-11-01 | 2008-02-20 | 日本特殊陶業株式会社 | ガスセンサ素子及びこれを用いたガスセンサ |
| JP4035555B2 (ja) * | 2006-11-10 | 2008-01-23 | 日本特殊陶業株式会社 | ガスセンサ素子及びこれを用いたガスセンサ |
| JP5896142B2 (ja) | 2012-03-23 | 2016-03-30 | 東芝ライテック株式会社 | セラミックヒータおよび定着装置 |
| JP6354947B2 (ja) * | 2013-08-30 | 2018-07-11 | 三菱マテリアル株式会社 | サーミスタ用金属窒化物材料及びその製造方法並びにフィルム型サーミスタセンサ |
| US10115505B2 (en) * | 2017-02-23 | 2018-10-30 | E I Du Pont De Nemours And Company | Chip resistor |
-
2021
- 2021-01-05 JP JP2021570050A patent/JP7687686B2/ja active Active
- 2021-01-05 KR KR1020227025740A patent/KR102805717B1/ko active Active
- 2021-01-05 CN CN202180007997.1A patent/CN114902355B/zh active Active
- 2021-01-05 WO PCT/JP2021/000083 patent/WO2021141021A1/ja not_active Ceased
- 2021-01-06 TW TW110100433A patent/TWI874550B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005244119A (ja) * | 2004-02-27 | 2005-09-08 | Tdk Corp | 抵抗体ペースト及びこれを用いた抵抗体 |
| JP2013161770A (ja) * | 2012-02-09 | 2013-08-19 | Kyoto Elex Kk | セラミック基板ヒータ用抵抗体ペーストおよびセラミック基板ヒータ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2021141021A1 (https=) | 2021-07-15 |
| JP7687686B2 (ja) | 2025-06-03 |
| KR20220119705A (ko) | 2022-08-30 |
| CN114902355B (zh) | 2024-10-29 |
| TW202135100A (zh) | 2021-09-16 |
| CN114902355A (zh) | 2022-08-12 |
| WO2021141021A1 (ja) | 2021-07-15 |
| TWI874550B (zh) | 2025-03-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20220725 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20241010 Patent event code: PE09021S01D |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20250422 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20250507 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20250508 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration |