KR102767042B1 - 고형상비 전기도금 구조 및 이방성 전기도금 프로세스 - Google Patents

고형상비 전기도금 구조 및 이방성 전기도금 프로세스 Download PDF

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Publication number
KR102767042B1
KR102767042B1 KR1020237028302A KR20237028302A KR102767042B1 KR 102767042 B1 KR102767042 B1 KR 102767042B1 KR 1020237028302 A KR1020237028302 A KR 1020237028302A KR 20237028302 A KR20237028302 A KR 20237028302A KR 102767042 B1 KR102767042 B1 KR 102767042B1
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solid
state
trace
electroplated
illustrates
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KR20230128394A (ko
Inventor
더글라스 피. 리머
쿠르트 씨. 스완슨
피터 에프. 래드윅
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허친슨 테크놀로지 인코포레이티드
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
  • Coils Of Transformers For General Uses (AREA)
  • Coils Or Transformers For Communication (AREA)
KR1020237028302A 2016-11-18 2017-11-17 고형상비 전기도금 구조 및 이방성 전기도금 프로세스 Active KR102767042B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201662423995P 2016-11-18 2016-11-18
US62/423,995 2016-11-18
PCT/US2017/062416 WO2018094280A1 (en) 2016-11-18 2017-11-17 High aspect ratio electroplated structures and anisotropic electroplating processes
US15/817,049 2017-11-17
KR1020197016946A KR20190082295A (ko) 2016-11-18 2017-11-17 고형상비 전기도금 구조 및 이방성 전기도금 프로세스
US15/817,049 US10640879B2 (en) 2016-11-18 2017-11-17 High aspect ratio electroplated structures and anisotropic electroplating processes

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020197016946A Division KR20190082295A (ko) 2016-11-18 2017-11-17 고형상비 전기도금 구조 및 이방성 전기도금 프로세스

Publications (2)

Publication Number Publication Date
KR20230128394A KR20230128394A (ko) 2023-09-04
KR102767042B1 true KR102767042B1 (ko) 2025-02-14

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Application Number Title Priority Date Filing Date
KR1020237028302A Active KR102767042B1 (ko) 2016-11-18 2017-11-17 고형상비 전기도금 구조 및 이방성 전기도금 프로세스
KR1020197016946A Ceased KR20190082295A (ko) 2016-11-18 2017-11-17 고형상비 전기도금 구조 및 이방성 전기도금 프로세스

Family Applications After (1)

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Country Status (5)

Country Link
US (2) US10640879B2 (https=)
JP (2) JP7657546B2 (https=)
KR (2) KR102767042B1 (https=)
CN (1) CN110140203A (https=)
WO (1) WO2018094280A1 (https=)

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US11387033B2 (en) 2016-11-18 2022-07-12 Hutchinson Technology Incorporated High-aspect ratio electroplated structures and anisotropic electroplating processes
US11521785B2 (en) 2016-11-18 2022-12-06 Hutchinson Technology Incorporated High density coil design and process
KR101963287B1 (ko) * 2017-06-28 2019-03-28 삼성전기주식회사 코일 부품 및 그의 제조방법
CN113396246B (zh) * 2018-11-26 2025-08-26 哈钦森技术股份有限公司 电气装置和线圈
WO2020112569A1 (en) * 2018-11-30 2020-06-04 Hutchinson Technology Incorporated High density coil design and process
CN112389269B (zh) * 2019-08-15 2022-04-15 比亚迪股份有限公司 一种汽车、能量转换装置及能量转换方法
CN112389231B (zh) * 2019-08-15 2022-04-15 比亚迪股份有限公司 能量转换装置及车辆
US20220213610A1 (en) * 2021-01-06 2022-07-07 Rohm And Haas Electronic Materials Llc Photoresist resolution capabilities by copper electroplating anisotropically
TWI793891B (zh) * 2021-12-03 2023-02-21 和碩聯合科技股份有限公司 熱傳導模組與電子裝置

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