KR102669021B1 - 금속 피복 적층판용 불소 함유 폴리머, 금속 피복 적층판용 조성물, 경화성 조성물, 금속 피복 적층판 및 프린트 기판 - Google Patents

금속 피복 적층판용 불소 함유 폴리머, 금속 피복 적층판용 조성물, 경화성 조성물, 금속 피복 적층판 및 프린트 기판 Download PDF

Info

Publication number
KR102669021B1
KR102669021B1 KR1020227005185A KR20227005185A KR102669021B1 KR 102669021 B1 KR102669021 B1 KR 102669021B1 KR 1020227005185 A KR1020227005185 A KR 1020227005185A KR 20227005185 A KR20227005185 A KR 20227005185A KR 102669021 B1 KR102669021 B1 KR 102669021B1
Authority
KR
South Korea
Prior art keywords
fluorine
metal
mol
vinyl
monomer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020227005185A
Other languages
English (en)
Korean (ko)
Other versions
KR20220038391A (ko
Inventor
다쿠지 이시카와
히데노리 오자키
가츠히코 이모토
Original Assignee
다이킨 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이킨 고교 가부시키가이샤 filed Critical 다이킨 고교 가부시키가이샤
Publication of KR20220038391A publication Critical patent/KR20220038391A/ko
Application granted granted Critical
Publication of KR102669021B1 publication Critical patent/KR102669021B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F214/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
    • C08F214/18—Monomers containing fluorine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/034—Organic insulating material consisting of one material containing halogen
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F214/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
    • C08F214/18—Monomers containing fluorine
    • C08F214/26—Tetrafluoroethene
    • C08F214/265—Tetrafluoroethene with non-fluorinated comonomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F216/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
    • C08F216/12—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an ether radical
    • C08F216/14—Monomers containing only one unsaturated aliphatic radical
    • C08F216/1416—Monomers containing oxygen in addition to the ether oxygen, e.g. allyl glycidyl ether
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F218/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid
    • C08F218/02—Esters of monocarboxylic acids
    • C08F218/04—Vinyl esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F218/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid
    • C08F218/02—Esters of monocarboxylic acids
    • C08F218/04—Vinyl esters
    • C08F218/08—Vinyl acetate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F218/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid
    • C08F218/02—Esters of monocarboxylic acids
    • C08F218/04—Vinyl esters
    • C08F218/10—Vinyl esters of monocarboxylic acids containing three or more carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08L27/18—Homopolymers or copolymers or tetrafluoroethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
    • C08L29/10—Homopolymers or copolymers of unsaturated ethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L31/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid; Compositions of derivatives of such polymers
    • C08L31/02—Homopolymers or copolymers of esters of monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L31/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid; Compositions of derivatives of such polymers
    • C08L31/02—Homopolymers or copolymers of esters of monocarboxylic acids
    • C08L31/04—Homopolymers or copolymers of vinyl acetate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • C09D133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C09D133/16—Homopolymers or copolymers of esters containing halogen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C09J133/16—Homopolymers or copolymers of esters containing halogen atoms
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Laminated Bodies (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Compounds (AREA)
KR1020227005185A 2019-08-06 2020-08-06 금속 피복 적층판용 불소 함유 폴리머, 금속 피복 적층판용 조성물, 경화성 조성물, 금속 피복 적층판 및 프린트 기판 Active KR102669021B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019144663 2019-08-06
JPJP-P-2019-144663 2019-08-06
JP2019197865 2019-10-30
JPJP-P-2019-197865 2019-10-30
PCT/JP2020/030199 WO2021025117A1 (ja) 2019-08-06 2020-08-06 金属張積層板用含フッ素ポリマー、金属張積層板用組成物、硬化性組成物、金属張積層板及びプリント基板

Publications (2)

Publication Number Publication Date
KR20220038391A KR20220038391A (ko) 2022-03-28
KR102669021B1 true KR102669021B1 (ko) 2024-05-27

Family

ID=74503626

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227005185A Active KR102669021B1 (ko) 2019-08-06 2020-08-06 금속 피복 적층판용 불소 함유 폴리머, 금속 피복 적층판용 조성물, 경화성 조성물, 금속 피복 적층판 및 프린트 기판

Country Status (8)

Country Link
US (1) US20220153890A1 (https=)
EP (1) EP3998297A4 (https=)
JP (1) JP7236009B2 (https=)
KR (1) KR102669021B1 (https=)
CN (2) CN114206958B (https=)
AU (1) AU2020325957A1 (https=)
TW (2) TW202110626A (https=)
WO (1) WO2021025117A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022141184A (ja) * 2021-03-15 2022-09-29 味の素株式会社 樹脂組成物
WO2023022010A1 (ja) * 2021-08-17 2023-02-23 ダイキン工業株式会社 共重合体、及び樹脂組成物
JP7339576B2 (ja) * 2021-08-17 2023-09-06 ダイキン工業株式会社 共重合体、及び樹脂組成物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015111724A1 (ja) * 2014-01-27 2015-07-30 旭硝子株式会社 蓄電デバイス用バインダー、バインダー組成物、電極合剤、電極および二次電池
JP2015167537A (ja) 2014-03-10 2015-09-28 ダイキン工業株式会社 農業用フィルム及び農業用被覆資材
JP2016510838A (ja) 2013-03-15 2016-04-11 アーケマ・インコーポレイテッド フルオロポリマー

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01123848A (ja) * 1987-11-10 1989-05-16 Asahi Glass Co Ltd 積層材用樹脂組成物及び金属箔張積層板
JPH06256425A (ja) * 1993-03-10 1994-09-13 Asahi Chem Ind Co Ltd フッ素樹脂組成物及びこれを主成分とするフッ素系塗料
JPH07268034A (ja) * 1994-03-31 1995-10-17 Asahi Glass Co Ltd エポキシ基含有含フッ素共重合体
JPH09157616A (ja) * 1995-12-08 1997-06-17 Daikin Ind Ltd 含フッ素接着剤ならびにそれを用いた接着性フィルムおよび積層体
JP3757489B2 (ja) * 1996-09-20 2006-03-22 旭硝子株式会社 リチウム電池
KR101214419B1 (ko) * 2004-12-20 2012-12-21 아사히 가라스 가부시키가이샤 플렉시블 프린트 배선판용 적층체
JP5188008B2 (ja) * 2005-01-07 2013-04-24 ダイキン工業株式会社 硬化型含フッ素塗料用組成物
JP5014587B2 (ja) 2005-04-28 2012-08-29 株式会社カネカ 活性エステル化合物およびその利用
JP4957079B2 (ja) * 2006-05-29 2012-06-20 旭硝子株式会社 プリント回路基板およびその製造方法
JP5307004B2 (ja) * 2007-06-15 2013-10-02 ダウ コーニング コーポレーション 硬化性含フッ素ポリマー組成物
JP5310820B2 (ja) 2010-10-25 2013-10-09 ダイキン工業株式会社 金属張積層板及びその製造方法、並びに、フレキシブルプリント基板
JP2016029163A (ja) * 2014-07-18 2016-03-03 ダイキン工業株式会社 含フッ素共重合体及び溶剤型塗料用組成物
WO2016017801A1 (ja) * 2014-08-01 2016-02-04 旭硝子株式会社 樹脂パウダー、その製造方法、複合体、成形体、セラミックス成形体の製造方法、金属積層板、プリント基板及びプリプレグ
WO2017155022A1 (ja) * 2016-03-10 2017-09-14 ダイキン工業株式会社 重合体、組成物、塗膜、積層体、バックシート及び太陽電池モジュール
CN109314168A (zh) * 2016-05-03 2019-02-05 霍尼韦尔国际公司 具有改善的耐化学品性的光发射器设备和部件及相关方法
AU2018208279A1 (en) * 2017-01-12 2019-07-25 AGC Inc. Powder coating material, method for producing substrate provided with coating film, coated article and fluorinated polymer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016510838A (ja) 2013-03-15 2016-04-11 アーケマ・インコーポレイテッド フルオロポリマー
WO2015111724A1 (ja) * 2014-01-27 2015-07-30 旭硝子株式会社 蓄電デバイス用バインダー、バインダー組成物、電極合剤、電極および二次電池
JP2015167537A (ja) 2014-03-10 2015-09-28 ダイキン工業株式会社 農業用フィルム及び農業用被覆資材

Also Published As

Publication number Publication date
CN119735734A (zh) 2025-04-01
US20220153890A1 (en) 2022-05-19
JP7236009B2 (ja) 2023-03-09
JPWO2021025117A1 (https=) 2021-02-11
TWI839182B (zh) 2024-04-11
TW202330258A (zh) 2023-08-01
CN114206958B (zh) 2025-06-03
EP3998297A4 (en) 2023-12-06
EP3998297A1 (en) 2022-05-18
AU2020325957A1 (en) 2022-03-17
CN114206958A (zh) 2022-03-18
TW202110626A (zh) 2021-03-16
KR20220038391A (ko) 2022-03-28
WO2021025117A1 (ja) 2021-02-11

Similar Documents

Publication Publication Date Title
KR102669021B1 (ko) 금속 피복 적층판용 불소 함유 폴리머, 금속 피복 적층판용 조성물, 경화성 조성물, 금속 피복 적층판 및 프린트 기판
JP3771160B2 (ja) 硬化性ポリフェニレンエーテル樹脂、その組成物、および該樹脂の製造方法
KR101716990B1 (ko) 폴리페닐에테르 수지 조성물 및 이를 이용하여 제조되는 반경화 시트 및 동박 적층판
US20210403620A1 (en) Functionalized poly(2,6-dimethyl phenylene oxide) oligomers containing dicyclopentadiene, method of producing the same and use thereof
KR20090078750A (ko) 저열팽창성 저유전 손실 프리프레그 및 그 응용품
US20190002689A1 (en) Polyphenyl ether resin composition and prepreg, laminated board and printed circuit board containing same
KR20190004131A (ko) 다관능성 라디칼 경화형 폴리 페닐렌 에테르 수지 및 이의 제조 방법
CN113614140A (zh) 萘酚树脂、环氧树脂、环氧树脂组合物及其固化物
JP7254972B2 (ja) 末端が不飽和基でキャッピングされたリン含有樹脂、その製造方法、及び該末端が不飽和基でキャッピングされたリン含有樹脂を含む樹脂組成物
KR20260012191A (ko) 수지 조성물, 프리프레그, 수지 필름, 금속 피복 적층판, 프린트 배선판 및 반도체 패키지
WO2022172923A1 (ja) 含フッ素熱硬化性樹脂、その製造方法、及び含フッ素熱硬化性樹脂組成物
JP5039615B2 (ja) 新規な脂環式ビニルエーテル重合体
JP7832499B2 (ja) 含フッ素熱硬化性樹脂、その製造方法、及び含フッ素熱硬化性樹脂組成物
US12528896B2 (en) Fluorine-containing polymer and method of producing same
TW202323323A (zh) 共聚物、及樹脂組成物
KR101399258B1 (ko) 노볼락 에폭시 수지, 그 제조방법 및 노볼락 에폭시 수지를 포함하는 에폭시 수지 조성물
CN117897416A (zh) 共聚物和树脂组合物
JP7339576B2 (ja) 共重合体、及び樹脂組成物
KR102600976B1 (ko) 인계 화합물
KR20230147002A (ko) 탄화수소 수지 중합체, 이의 제조 방법, 및 이를 포함하는 조성물 및 기판
KR20250042120A (ko) 다관능 비닐 수지, 그 제조 방법, 다관능 비닐 수지 조성물 및 그 경화물
TW202446823A (zh) 乙烯基樹脂的製造方法、乙烯基樹脂及其組合物、硬化物、預浸料、樹脂片及積層板
JP2024001372A (ja) 含フッ素重合体組成物、硬化物および硬化物の製造方法
CN114479013A (zh) 一种氰基改性的活性酯及其制备方法和应用
CN114479012A (zh) 一种双端氰基活性酯、热固性树脂组合物及其制备方法和应用

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20220216

Patent event code: PA01051R01D

Comment text: International Patent Application

PA0201 Request for examination
PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20231018

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20240405

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20240521

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20240522

End annual number: 3

Start annual number: 1

PG1601 Publication of registration