KR102640712B1 - 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트 - Google Patents
베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트 Download PDFInfo
- Publication number
- KR102640712B1 KR102640712B1 KR1020217024168A KR20217024168A KR102640712B1 KR 102640712 B1 KR102640712 B1 KR 102640712B1 KR 1020217024168 A KR1020217024168 A KR 1020217024168A KR 20217024168 A KR20217024168 A KR 20217024168A KR 102640712 B1 KR102640712 B1 KR 102640712B1
- Authority
- KR
- South Korea
- Prior art keywords
- flow path
- sheet
- liquid
- vapor chamber
- vapor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910052719 titanium Inorganic materials 0.000 claims description 9
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- 239000011733 molybdenum Substances 0.000 claims description 7
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Signal Processing (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Push-Button Switches (AREA)
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020247005733A KR102763334B1 (ko) | 2019-03-11 | 2020-03-11 | 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트 |
Applications Claiming Priority (13)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019043928 | 2019-03-11 | ||
| JPJP-P-2019-043928 | 2019-03-11 | ||
| JP2019045167 | 2019-03-12 | ||
| JP2019045156 | 2019-03-12 | ||
| JPJP-P-2019-045156 | 2019-03-12 | ||
| JPJP-P-2019-045167 | 2019-03-12 | ||
| JPJP-P-2019-046509 | 2019-03-13 | ||
| JP2019046509 | 2019-03-13 | ||
| JPJP-P-2019-046510 | 2019-03-13 | ||
| JP2019046510 | 2019-03-13 | ||
| JP2019054517 | 2019-03-22 | ||
| JPJP-P-2019-054517 | 2019-03-22 | ||
| PCT/JP2020/010587 WO2020184620A1 (ja) | 2019-03-11 | 2020-03-11 | ベーパーチャンバ、電子機器、及び、ベーパーチャンバ用シート |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247005733A Division KR102763334B1 (ko) | 2019-03-11 | 2020-03-11 | 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20210135220A KR20210135220A (ko) | 2021-11-12 |
| KR102640712B1 true KR102640712B1 (ko) | 2024-02-27 |
Family
ID=72426635
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020217024168A Active KR102640712B1 (ko) | 2019-03-11 | 2020-03-11 | 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트 |
| KR1020247005733A Active KR102763334B1 (ko) | 2019-03-11 | 2020-03-11 | 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트 |
| KR1020257003234A Pending KR20250020736A (ko) | 2019-03-11 | 2020-03-11 | 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247005733A Active KR102763334B1 (ko) | 2019-03-11 | 2020-03-11 | 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트 |
| KR1020257003234A Pending KR20250020736A (ko) | 2019-03-11 | 2020-03-11 | 베이퍼 챔버, 전자 기기 및 베이퍼 챔버용 시트 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20220120509A1 (enExample) |
| JP (4) | JP6888751B2 (enExample) |
| KR (3) | KR102640712B1 (enExample) |
| CN (2) | CN113366631B (enExample) |
| TW (2) | TWI897457B (enExample) |
| WO (1) | WO2020184620A1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7243457B2 (ja) * | 2019-05-31 | 2023-03-22 | 大日本印刷株式会社 | ベーパーチャンバ、電子機器、及び、ベーパーチャンバ用金属シート |
| WO2021045211A1 (ja) * | 2019-09-06 | 2021-03-11 | 大日本印刷株式会社 | ベーパーチャンバ、電子機器、ベーパーチャンバ用シート、ベーパーチャンバ用の中間体が多面付けされたシート、ベーパーチャンバ用の中間体が多面付けされたシートが巻かれたロール、ベーパーチャンバ用の中間体 |
| CN112956286B (zh) * | 2019-10-09 | 2025-06-27 | 大日本印刷株式会社 | 蒸发室用的芯部片、蒸发室以及电子设备 |
| WO2022097417A1 (ja) * | 2020-11-04 | 2022-05-12 | 株式会社村田製作所 | 熱拡散デバイス |
| JP7769918B2 (ja) * | 2021-02-03 | 2025-11-14 | 大日本印刷株式会社 | ベーパーチャンバ、ベーパーチャンバ用のウィックシート及び電子機器 |
| KR102800262B1 (ko) * | 2021-02-18 | 2025-04-28 | 다이니폰 인사츠 가부시키가이샤 | 베이퍼 챔버용의 본체 시트, 베이퍼 챔버 및 전자 기기 |
| JPWO2022191240A1 (enExample) * | 2021-03-10 | 2022-09-15 | ||
| JP2022142665A (ja) * | 2021-03-16 | 2022-09-30 | 富士通株式会社 | 冷却装置 |
| WO2022201918A1 (ja) * | 2021-03-23 | 2022-09-29 | 株式会社村田製作所 | 熱拡散デバイスおよび電子機器 |
| CN116182608A (zh) * | 2021-11-26 | 2023-05-30 | 华为技术有限公司 | 具有微细结构层的均温板 |
| KR20240122797A (ko) * | 2021-12-06 | 2024-08-13 | 다이니폰 인사츠 가부시키가이샤 | 베이퍼 챔버 및 전자 기기 |
| KR102698446B1 (ko) * | 2022-10-12 | 2024-09-02 | 주세현 | 기체 확산로를 형성하는 다공 필러부를 갖는 베이퍼 챔버 |
| US20240240874A1 (en) * | 2023-01-18 | 2024-07-18 | Cisco Technology, Inc. | Multiple wick section heatpipe for effective heat transfer |
| WO2025005440A1 (ko) * | 2023-06-30 | 2025-01-02 | 삼성전자주식회사 | 방열 구조 및 이를 포함하는 전자 장치 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002039693A (ja) | 2000-07-21 | 2002-02-06 | Toufuji Denki Kk | フラット型ヒートパイプ |
| JP2004028557A (ja) | 2002-05-08 | 2004-01-29 | Furukawa Electric Co Ltd:The | 薄型シート状ヒートパイプ |
| US20180156545A1 (en) | 2016-12-05 | 2018-06-07 | Microsoft Technology Licensing, Llc | Vapor chamber with three-dimensional printed spanning structure |
| JP2018096669A (ja) | 2016-12-14 | 2018-06-21 | 新光電気工業株式会社 | ヒートパイプ及びその製造方法 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5729318Y2 (enExample) * | 1977-04-19 | 1982-06-26 | ||
| JPH11304381A (ja) * | 1998-04-23 | 1999-11-05 | Fujikura Ltd | ヒートパイプ |
| JP3552553B2 (ja) * | 1998-10-08 | 2004-08-11 | 日立電線株式会社 | 平面状ヒートパイプ及びその製造方法 |
| WO2002058879A1 (en) * | 2001-01-25 | 2002-08-01 | Toyo Kohan Co., Ltd. | Plate stacked body, hollow stacked body using plate stacked body, and plate heat pipe using hollow stacked body |
| CN1192202C (zh) * | 2001-09-06 | 2005-03-09 | 李嘉豪 | 平板式环路型热管(一) |
| US6981543B2 (en) * | 2001-09-20 | 2006-01-03 | Intel Corporation | Modular capillary pumped loop cooling system |
| JP4305068B2 (ja) * | 2003-06-19 | 2009-07-29 | 富士電機ホールディングス株式会社 | 偏平型ヒートパイプ |
| JP2007113864A (ja) * | 2005-10-21 | 2007-05-10 | Sony Corp | 熱輸送装置及び電子機器 |
| JP4874664B2 (ja) | 2006-02-08 | 2012-02-15 | 株式会社フジクラ | ヒートパイプ |
| WO2008012960A1 (fr) * | 2006-07-28 | 2008-01-31 | Molex Kiire Co., Ltd. | tuyau chauffant et son procédé de fabrication |
| JP5449801B2 (ja) * | 2008-09-04 | 2014-03-19 | 日本モレックス株式会社 | 熱輸送ユニットおよび電子機器 |
| TWI459889B (zh) * | 2008-09-18 | 2014-11-01 | Pegatron Corp | 均溫板 |
| JP5413735B2 (ja) | 2010-01-18 | 2014-02-12 | 日本モレックス株式会社 | 熱輸送ユニット、電子機器 |
| CN102095323A (zh) * | 2010-11-04 | 2011-06-15 | 华中科技大学 | 一种平板均热板 |
| JP5180385B1 (ja) * | 2012-03-08 | 2013-04-10 | 株式会社Ｗｅｌｃｏｎ | ベーパチャンバ |
| JP2014142143A (ja) | 2013-01-24 | 2014-08-07 | Ntec Co Ltd | ヒートパイプ |
| JP6121854B2 (ja) | 2013-09-18 | 2017-04-26 | 東芝ホームテクノ株式会社 | シート型ヒートパイプまたは携帯情報端末 |
| JP6509680B2 (ja) | 2015-08-24 | 2019-05-08 | 東芝ホームテクノ株式会社 | シート状ヒートパイプ |
| TWI870768B (zh) * | 2017-02-24 | 2025-01-21 | 日商大日本印刷股份有限公司 | 蒸氣腔、電子機器、蒸氣腔用金屬片材及蒸氣腔之製造方法 |
| JP7123527B2 (ja) | 2017-04-11 | 2022-08-23 | 大日本印刷株式会社 | ベーパーチャンバおよびベーパーチャンバ用金属シート |
| US10820454B2 (en) * | 2018-01-31 | 2020-10-27 | Toyota Motor Engineering & Manufacturing North America, Inc. | Vapor chamber heat spreaders with engineered vapor and liquid flow paths |
| TWI856760B (zh) * | 2018-05-30 | 2024-09-21 | 日商大日本印刷股份有限公司 | 蒸氣腔及電子機器 |
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2020
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- 2020-03-11 CN CN202411936865.9A patent/CN119812143A/zh active Pending
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002039693A (ja) | 2000-07-21 | 2002-02-06 | Toufuji Denki Kk | フラット型ヒートパイプ |
| JP2004028557A (ja) | 2002-05-08 | 2004-01-29 | Furukawa Electric Co Ltd:The | 薄型シート状ヒートパイプ |
| US20180156545A1 (en) | 2016-12-05 | 2018-06-07 | Microsoft Technology Licensing, Llc | Vapor chamber with three-dimensional printed spanning structure |
| JP2018096669A (ja) | 2016-12-14 | 2018-06-21 | 新光電気工業株式会社 | ヒートパイプ及びその製造方法 |
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| TWI846840B (zh) | 2024-07-01 |
| TWI897457B (zh) | 2025-09-11 |
| KR20240028552A (ko) | 2024-03-05 |
| CN113366631A (zh) | 2021-09-07 |
| KR102763334B1 (ko) | 2025-02-07 |
| JP2021119328A (ja) | 2021-08-12 |
| KR20250020736A (ko) | 2025-02-11 |
| US20220120509A1 (en) | 2022-04-21 |
| TW202040085A (zh) | 2020-11-01 |
| WO2020184620A1 (ja) | 2020-09-17 |
| CN113366631B (zh) | 2025-01-14 |
| CN119812143A (zh) | 2025-04-11 |
| JP7700945B2 (ja) | 2025-07-01 |
| TW202436821A (zh) | 2024-09-16 |
| JPWO2020184620A1 (ja) | 2021-04-30 |
| JP2025129173A (ja) | 2025-09-04 |
| KR20210135220A (ko) | 2021-11-12 |
| JP2024177386A (ja) | 2024-12-19 |
| JP6888751B2 (ja) | 2021-06-16 |
| JP7567653B2 (ja) | 2024-10-16 |
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