WO2008012960A1 - tuyau chauffant et son procédé de fabrication - Google Patents

tuyau chauffant et son procédé de fabrication Download PDF

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Publication number
WO2008012960A1
WO2008012960A1 PCT/JP2007/053509 JP2007053509W WO2008012960A1 WO 2008012960 A1 WO2008012960 A1 WO 2008012960A1 JP 2007053509 W JP2007053509 W JP 2007053509W WO 2008012960 A1 WO2008012960 A1 WO 2008012960A1
Authority
WO
WIPO (PCT)
Prior art keywords
refrigerant
injection hole
sealing member
internal space
heat pipe
Prior art date
Application number
PCT/JP2007/053509
Other languages
English (en)
Japanese (ja)
Inventor
Kenji Ohsawa
Katsuya Tsuruta
Shuichi Arimura
Toshiaki Kotani
Original Assignee
Molex Kiire Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Kiire Co., Ltd. filed Critical Molex Kiire Co., Ltd.
Priority to JP2007510405A priority Critical patent/JP4035155B1/ja
Priority to CN2007800136122A priority patent/CN101421577B/zh
Priority to US11/993,939 priority patent/US20210310745A1/en
Priority to EP07714941A priority patent/EP2051032A1/fr
Priority to TW096123746A priority patent/TWI409424B/zh
Publication of WO2008012960A1 publication Critical patent/WO2008012960A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283—Means for filling or sealing heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00

Definitions

  • the present invention relates to a heat pipe and a method for producing the same, and is particularly suitable for application to a thin and flat heat pipe.
  • Such a heat pipe has a cooling unit main body (having a refrigerant circulation space inside by superimposing a plurality of partition plates made of thin plates having refrigerant circulation holes and superposing outer wall members on the top and bottom of the superposed ones ( A refrigerant) such as water is sealed in the refrigerant circulation space in the cooling unit main body.
  • the refrigerant is sealed in the cooling unit main body by, for example, providing a hole on the side surface, top surface, or bottom surface of the heat pipe, injecting the refrigerant into the inside through the hole, and caulking after the injection. It was done by the method of blocking by.
  • the heat pipe is constituted by a thin plate-like member, there is an advantage that a flat and thin flat heat pipe can be provided, and further, each of the refrigerant circulation holes is provided.
  • the overlapping parts form a flow path through which the refrigerant flows, and the refrigerant moves through the part where the refrigerant circulation holes are displaced due to capillary action, resulting in several advantages such as good thermal conductivity.
  • Such a heat type has a heat spread effect several times to several tens of times that of a metal body having the same metal, outer shape, and volume, and has a CPU (central processing unit) and LED (light emitting diode). ) Equal heat dissipation is highly important, and it is optimal for heat dissipation of equipment.
  • Patent Document 1 Japanese Unexamined Patent Application Publication No. 2002-039693
  • Patent Document 2 Japanese Patent Laid-Open No. 2004-077120
  • the melting point of the solder is low, so that the sealing effect may be reduced or disappeared at a high temperature of, for example, about 180 to 220 ° C. However, it is desired to continue to exert the sealing effect reliably.
  • the sealing member is closed in the process of pushing the sealing member into the refrigerant injection hole and closing it.
  • the applied force may cause damage such as crushing of the periphery of the refrigerant injection hole, and it is difficult to improve productivity.
  • the present invention has been made to solve the above problems, and a heat pipe capable of continuously exhibiting a sealing effect even at a high temperature and capable of achieving a longer life than the conventional one, and its An object is to provide a manufacturing method.
  • the purpose is to provide a heat pipe that can further improve the productivity and lower the price, and can achieve a longer life than the conventional one.
  • a heat pipe according to the present invention includes a cooling unit main body made of a metal having a refrigerant circulation path formed in an internal space, and a refrigerant injection formed in the cooling unit main body for injecting the refrigerant into the internal space. And a sealing member that closes the coolant injection hole in order to enclose the coolant in the internal space, and the sealing member is made of the same or similar plastic metal as the cooling body. To do.
  • the heat pipe of the present invention is formed in the cooling unit main body in which a refrigerant circulation path is formed in an internal space by one or a plurality of middle plates provided between the upper plate and the lower plate, and in the cooling unit main body.
  • a cooling medium injection hole that is injected into the internal space of the cooling unit main body and closed by a sealing member, and the intermediate plate is formed in a portion corresponding to a peripheral region of the cooling medium injection hole.
  • a reinforcing portion having a predetermined thickness and a refrigerant hole formed in a portion corresponding to the refrigerant injection hole.
  • the heat pipe of the present invention is formed in the cooling unit main body in which a refrigerant circulation path is formed in an internal space, and formed in the cooling unit main body, and the refrigerant is injected into the internal space of the cooling unit main body and sealed And a refrigerant injection hole closed by a member, and the refrigerant is injected into the internal space from the refrigerant injection hole in the form of fine particles.
  • the heat pipe of the present invention includes a cooling unit main body made of metal in which an internal space has a refrigerant circulation path formed by one or a plurality of middle plates provided between an upper plate and a lower plate, and the cooling unit.
  • a sealing member formed in the main body and configured to inject the coolant into the internal space; and a sealing member that closes the coolant injection hole in order to seal the coolant in the internal space.
  • the stop member is made of the same or similar plastic metal as the main body of the cooling section, and the intermediate plate is formed in a portion corresponding to a peripheral area of the refrigerant injection hole, and has a predetermined thickness, and the refrigerant A coolant hole formed in a portion corresponding to the injection hole, and the coolant is injected into the internal space from the coolant injection hole in the form of fine particles.
  • the heat pipe of the present invention is characterized in that the sealing member that closes the coolant injection hole does not protrude from the surface of the cooling unit main body.
  • the heat pipe of the present invention is a state in which the coolant injection hole is completely closed by the sealing member. Until the state becomes the state in which the outside and the internal space are in communication with each other, and when the refrigerant injection hole is completely closed, a gas vent groove closed by the sealing member forms an inner periphery of the refrigerant injection hole. It is formed on the surface.
  • the circulation path includes a vapor diffusion channel through which the refrigerant diffuses as vapor, and a portion corresponding to the refrigerant injection hole is disposed in the vapor diffusion channel,
  • the reinforcing portion is characterized in that a slit is formed along a diffusion direction in which the refrigerant diffuses as vapor in the vapor diffusion flow path.
  • the coolant is injected from the coolant injection hole formed in the metal cooling unit body into the internal space of the cooling unit body where the coolant circulation path is formed.
  • a step of placing a sealing member made of the same or similar plastic metal as the cooling unit main body on the coolant injection hole, and pressurizing the sealing member under vacuum And a sealing step of closing the coolant injection hole with a member.
  • the heat pipe manufacturing method of the present invention includes an injection step of injecting the refrigerant from the refrigerant injection hole formed in the cooling unit main body into the internal space of the cooling unit main body in which the cooling medium circulation path is formed.
  • the refrigerant is made into fine particles and injected into the internal space from the refrigerant injection hole.
  • a refrigerant circulation path is formed in an internal space by one or a plurality of middle plates provided between an upper plate and a lower plate.
  • a reinforcing portion having a predetermined thickness is formed in a portion corresponding to a peripheral region of the refrigerant injection hole formed in the upper plate or the lower plate, and a refrigerant hole is formed in a portion corresponding to the refrigerant injection hole.
  • the heat pipe manufacturing method of the present invention includes one or a plurality of middle plates provided between an upper plate and a lower plate.
  • a refrigerant circulation path is formed in the internal space, and the middle plate has a predetermined thickness at a portion corresponding to a peripheral region of the refrigerant injection hole formed in the upper plate or the lower plate.
  • a preparation step of preparing a cooling unit body made of metal having a coolant hole formed in a portion corresponding to the coolant injection hole, and from the coolant injection hole to the internal space of the cooling unit body An injection process for injecting the coolant, a mounting process for mounting a sealing member made of the same or similar plastic metal as the main body of the cooling unit in the coolant injection hole, and adding the sealing member under vacuum
  • the sealing step is formed on the inner peripheral surface of the refrigerant injection hole until the sealing member completely closes the refrigerant injection hole. It is characterized in that the state where the outside communicates with the internal space through the gas vent groove is maintained.
  • the sealing step includes temporarily sealing the coolant injection hole with the sealing member by pressurizing the sealing member under the vacuum, The refrigerant injection hole is completely sealed with the sealing member by heating the sealing member while continuing to pressurize the sealing member.
  • the heat pipe of claim 1 and the method of manufacturing the heat pipe of claim 6 the heat pipe that continues to exert its sealing effect reliably even at high temperatures and can have a longer life than conventional ones. Can provide.
  • FIG. 1 is a perspective view showing an external configuration of a heat pipe according to the present invention.
  • FIG. 2A is a cross-sectional view showing a cross-sectional configuration of a heat pipe in FIG.
  • FIG. 2B is a cross-sectional view showing a cross-sectional configuration of the heat pipe in FIG.
  • FIG. 3A is a schematic diagram showing a front configuration of an upper outer surface of an upper plate.
  • FIG. 3B is a schematic diagram showing the front configuration of the lower inner surface of the upper plate.
  • 4A is a schematic diagram showing the front configuration of the lower outer surface of the lower plate.
  • 4B is a schematic diagram showing the front configuration of the upper inner surface of the lower plate.
  • FIG. 5 is a schematic diagram showing the front configuration of the first middle plate.
  • FIG. 7 A schematic diagram showing the state of arrangement of the through holes of the first intermediate plate and the through holes of the second intermediate plate.
  • FIG. 8 is a schematic diagram showing the configuration of a vapor diffusion channel and a capillary channel formed by a first intermediate plate and a second intermediate plate.
  • FIG. 9A is a detailed sectional side view showing a refrigerant circulation phenomenon (1).
  • FIG. 9B is a detailed side sectional view showing a state (2) of a refrigerant circulation phenomenon.
  • FIG. 10 is a schematic view showing how refrigerant diffuses from the central part to the peripheral part.
  • FIG. 12A is a front view showing a partial detailed configuration of a region in the vicinity of the refrigerant injection hole formed on the lower inner surface of the upper plate, and a cross-sectional view of part C in the front view.
  • FIG. 12B is a front view showing a partial detailed configuration (1) of a region near the middle plate reinforcing portion formed on the first middle plate.
  • FIG. 12C is a front view showing a partial detailed configuration (1) of the region near the reinforcing portion with slit formed in the second intermediate plate.
  • FIG. 12D is a front view showing a partial detailed configuration (2) of a region in the vicinity of the middle plate reinforcing portion formed on the first middle plate.
  • 12E is a front view showing a partial detailed configuration (2) of the vicinity region of the reinforcing portion with slits formed on the second intermediate plate.
  • FIG. 12F is a front view showing a partial detailed configuration of a region near the lower plate reinforcing portion formed on the upper inner surface of the lower plate.
  • FIG. 13 is a cross-sectional view showing a detailed configuration of an upper plate reinforcing portion, a middle plate reinforcing portion, a slit reinforcing portion, and a lower plate reinforcing portion.
  • FIG. 14A is a cross-sectional view showing an example (1) of a manufacturing method for a heat pipe.
  • FIG. 14B is a cross-sectional view showing an example (2) of the manufacturing method for the heat pipe.
  • FIG. 14C is a cross-sectional view showing an example (3) of the manufacturing method for the heat pipe.
  • FIG. 14D is a cross-sectional view showing an example (4) of the manufacturing method for the heat pipe.
  • FIG. 14E is a cross-sectional view showing an example (5) of the manufacturing method for the heat pipe.
  • FIG. 15A is a schematic diagram showing a front configuration of a refrigerant injection hole.
  • FIG. 15B is a schematic view showing a state when a sealing member is placed on the refrigerant injection hole.
  • FIG. 15C is a schematic view showing a state when the refrigerant injection hole is closed with a sealing member.
  • FIG. 16A is a cross-sectional view showing an example (6) of a manufacturing method for a heat pipe.
  • FIG. 16B is a cross-sectional view showing an example (7) of the manufacturing method for the heat pipe.
  • FIG. 17 is a schematic view showing a state in which a refrigerant is supplied into a cooling unit body using an inkjet nozzle.
  • FIG. 18 is a schematic view showing the configuration (1) of the reinforcing portion with slit according to another embodiment.
  • FIG. 19 is a schematic view showing the configuration (2) of the reinforcing portion with slit according to another embodiment.
  • FIG. 20A is a schematic diagram showing a front configuration (1) of a refrigerant injection hole and an air discharge hole according to another embodiment.
  • FIG. 20B is a sectional view showing a side sectional configuration (1) of the refrigerant injection hole and the air discharge hole according to another embodiment.
  • FIG. 20C is a cross-sectional view showing a state (1) when the refrigerant injection hole and the air discharge hole according to another embodiment are closed by the sealing member.
  • FIG. 21A is a schematic diagram showing a front configuration (2) of a refrigerant injection hole and an air discharge hole according to another embodiment.
  • FIG. 21B is a sectional view showing a side sectional configuration (2) of the refrigerant injection hole and the air discharge hole according to another embodiment.
  • FIG. 21C is a cross-sectional view showing a state (2) when the refrigerant injection hole and the air discharge hole according to another embodiment are closed by the sealing member.
  • a sealing member made of the same or similar plastic metal as the cooling unit main body is placed on the refrigerant injection hole.
  • the refrigerant injection hole is sealed with the sealing member by pressurization under vacuum. Furthermore, its sealing In order to reliably obtain the sealing effect by the member, the sealing member is pressure-bonded by heating while continuing the pressurization, whereby the refrigerant injection hole is completely sealed and the heat pipe can be manufactured. .
  • the cooling unit body is made of metal and the sealing member is made of the same or similar plastic metal as the cooling unit body. Even if exposed, local battery operation by the cooling part main body and the sealing member does not occur, corrosion due to the action of the local battery can be prevented, and a longer life can be achieved compared with the conventional case.
  • the sealing member for example, when gold, silver, copper, copper-based material, aluminum or aluminum-based metal is used, its melting point is high.
  • the sealing effect can be maintained even at a high temperature of about 200 to 300 ° C., and the sealing effect can be reliably maintained even at high temperatures.
  • a cooling unit body formed by sandwiching one or a plurality of flat plate-like middle plates between a flat plate-like upper plate and a lower plate is used.
  • the cooling unit body has a flow path for diffusing steam to the peripheral side of the cooling unit body (hereinafter referred to as a vapor diffusion flow path) and an upper plate and a lower plate when viewed in the vertical direction.
  • a circulation path composed of a flow path (hereinafter referred to as a capillary flow path) through which the refrigerant flows in the vertical direction and the oblique direction by capillary action is formed inside by one or more intermediate plates. .
  • the lower inner surface of the upper plate is formed with a recessed groove portion having a lattice shape or the like
  • the upper inner surface of the lower plate is formed with a recessed groove portion having a lattice shape or the like.
  • Vapor diffusion flow through a recess formed in the inner surface (hereinafter referred to as the upper plate inner groove) and a recess formed in the upper inner surface of the lower plate (hereinafter referred to as the lower plate inner groove).
  • the channel and the capillary channel communicate with each other.
  • a protruding column having a flat tip portion is formed in each region divided by the upper plate inner surface groove portion and the lower plate inner surface groove portion.
  • the tip of the protruding column is flat and can be in close contact with the intermediate plate.
  • the upper plate inner surface groove portion and the lower plate inner surface groove portion are formed in a lattice shape, but may be formed in other shape patterns such as a mesh.
  • the protruding column has a corresponding cross section of square, circular, or oval. Polygonal, star-shaped columns.
  • the vapor diffusion flow path is formed radially toward the peripheral part including all four corners, for example, so that the entire cooling part body can be used evenly. Since the heat of the cooling device can be efficiently diffused and dissipated, the heat conduction effect can be enhanced and it can be said that it is optimal as a heat pipe.
  • the shape of the vapor diffusion channel may be a band shape or a trapezoidal shape, or the width dimension may gradually become wider or narrower from the central portion toward the peripheral portion, or may be various other shapes. .
  • the overlapping vapor diffusion channel holes may be completely overlapped, or the vapor diffusion channel holes may be shifted in the width direction.
  • the vapor diffusion channel hole itself becomes the vapor diffusion channel.
  • each intermediate plate When there are a plurality of intermediate plates, a plurality of intermediate plates are overlapped to form a capillary channel communicating with the vapor diffusion channel by the overlapping through holes.
  • the through holes of each intermediate plate may be formed in a different pattern for each intermediate plate, or may be formed in the same pattern in all the intermediate plates.
  • the through hole itself becomes a capillary channel.
  • each through-hole in each intermediate plate are completely the same, and the corresponding ones of the through-holes in each intermediate plate are the same, the same shape, and the same size capillary flow.
  • the middle plate is provided between the upper plate and the lower plate so that the path is constituted.
  • the shape of the through-hole extension and the capillary channel is, for example, a rectangle (for example, a square or a rectangle), and a corner R may be attached.
  • a force that is basically rectangular may be such that the surface of some or all of the sides (inner circumferential surface of the capillary channel) has a large surface area such as a wave shape or a bowl shape. This is because if the surface area of the inner peripheral surface of the capillary channel is large, the cooling effect is enhanced.
  • the shape of the capillary channel may be a hexagon, a circle, or an ellipse.
  • a plurality of middle plates may be used to form a smaller cross-sectional area of the capillary channel from the plane direction perpendicular to the up-and-down direction Is shifted from the position where the through-holes are perfectly aligned, and only a part of them is overlapped, the substantial cross-sectional area of the capillary channel is compared with the cross-sectional area in the planar direction of each through-hole of the intermediate plate. Then you can make it small.
  • the size, shape, and arrangement pitch of the through holes of the two intermediate plates are made the same, and the arrangement positions thereof are arranged. Shifting in a predetermined direction (for example, the lateral direction (one side direction when the through-hole is a quadrilateral)) by a half of the pitch will reduce the substantial cross-sectional area of the capillary channel to the through-holes of each intermediate plate. The power can be reduced to about half of the area.
  • the typical cross-sectional area can be reduced to about one-fourth of the cross-sectional area of each through hole in the intermediate plate.
  • the cooling part main body, the upper plate, the lower board, and the middle plate constituting the cooling part main body, and the material of the sealing member that closes the refrigerant injection hole are from the viewpoint of thermal conductivity, mechanical strength, and the like. Copper or copper-based metals such as copper alloy are optimal, but not necessarily limited thereto. For example, aluminum and aluminum alloys that have advantages such as low material costs, aluminum-based aluminum-based materials Metals may be used, and iron-based metals such as iron, iron alloys, and stainless steel, gold, and silver may be used.
  • the cooling unit main body is formed of copper or a copper-based metal such as a copper alloy
  • the outer surface of the cooling unit main body is nickel-plated including the surface of the sealing member made of copper or copper-based metal. Is normal.
  • water with large latent heat (pure water, distilled water, etc.) is optimal as the refrigerant, it is not necessarily limited to water, and for example, ethanol, methanol, acetone, etc. are suitable.
  • the refrigerant injection hole is constituted by an opening that is closed by the placed sealing member and a gas vent groove formed on the inner peripheral surface of the refrigerant injection hole, the refrigerant injection hole can be closed by the sealing member.
  • the cooling unit main body can be vented through the venting groove.
  • the sealing member made of a plastic metal when the sealing member made of a plastic metal is heated and pressurized, the sealing member is pressure-bonded while being plastically deformed to form a sealing plug. Therefore, in this heat pipe, the gas vent groove can also be reliably closed by the sealing member, whereby the refrigerant injection hole can be completely blocked, so that the refrigerant is enclosed in the internal space of the cooling unit body, and the refrigerant leaks. This can be reliably prevented.
  • an air discharge hole of the same size may be provided in the cooling unit main body.
  • the air in the internal space passes through the air discharge hole, so that the refrigerant can be injected more smoothly.
  • a normal nozzle may be used for the supply of the refrigerant.
  • the refrigerant may be made into fine refrigerant particles in the form of a mist using an inkjet nozzle or the like and injected into the cooling unit main body.
  • the cooling unit main body is not provided with an air discharge hole, the refrigerant can be injected from the refrigerant injection hole. By providing the air discharge hole, the refrigerant can be injected more smoothly. It can be said that it is more preferable.
  • the air discharge hole is provided in the cooling unit main body in addition to the refrigerant injection hole, the above-described blocking by the sealing member can be performed not only on the refrigerant injection hole but also on the air discharge hole. it can.
  • nozzle that supplies the refrigerant in the form of a mist an inkjet nozzle, a micro dispenser that can make the refrigerant into small fine particles, and a nanoliter level dispenser that can make the refrigerant into ultra fine particles may be used. .
  • the reinforcing plate having a predetermined thickness is formed on the intermediate plate provided in the internal space of the cooling unit main body at the portion corresponding to the peripheral region of the refrigerant injection hole.
  • a refrigerant hole communicating with the refrigerant injection hole is formed in the reinforcing portion in the portion corresponding to the refrigerant injection hole. It is preferable to do.
  • the refrigerant when the refrigerant is injected into the internal space through the refrigerant injection hole, the refrigerant can be evenly distributed to the middle plate and the lower plate by the refrigerant hole and the slit.
  • the refrigerant becomes vapor when passing through the vapor diffusion flow path.
  • Slits may be formed along the diffusion direction.
  • the slits may be formed in all the reinforcing portions of the intermediate plate, but may be formed only in some reinforcing portions of the intermediate plate.
  • FIG. 1 shows an external configuration of the upper and outer surfaces of the heat pipe 1 according to the embodiment.
  • the heat pipe 1 includes an upper plate 2 and a lower plate 3 formed of a copper-based metal that is a high thermal conductivity material such as copper or a copper alloy, and a coolant injection hole 4 is formed on an upper outer surface 2a of the upper plate 2.
  • the air exhaust hole 5 is drilled.
  • the refrigerant injection hole 4 is provided in the vicinity of one corner of the pair of opposing corners, and the air discharge hole 5 It is provided in the vicinity of the other corner portion opposite to the corner portion diagonally.
  • the refrigerant injection hole 4 and the air discharge hole 5 allow water or the like to be transferred from the refrigerant injection hole 4 to the internal space while the air discharge hole 5 allows the internal space (described later) to communicate with the outside.
  • the sealing member 8 made of the same copper metal as the upper plate 2 and the lower plate 3 is plastically deformed and sealed.
  • This heat pipe 1 is shown in Fig. 2 ⁇ showing a cross-sectional configuration at the ⁇ _ 1 'portion of the heat pipe 1 in Fig. 1 and Fig. 2 ⁇ showing a cross-sectional configuration at the BB' portion of the heat pipe 1 in Fig. 1
  • a cooled device HE as a heating element such as an IC (semiconductor integrated device), an LSI (large scale integrated circuit device), or a CPU can be mounted at the center of the lower outer surface of the lower plate 3.
  • the heat pipe 1 is further formed after the second intermediate plate 7a, the first intermediate plate 6a, the second intermediate plate 7b, and the first intermediate plate 6b are sequentially laminated on the lower plate 3.
  • the upper plate 2 is laminated on the first intermediate plate 6b, and is integrated by being positioned and directly joined based on positioning holes (not shown) to form the cooling unit body 10. .
  • the direct bonding here refers to an interatomic action between the first and second surface portions by applying heat treatment while applying pressure while the first and second surface portions to be bonded are in close contact with each other. This is to firmly bond atoms with each other by force, so that the first and second surface portions can be integrated without using an adhesive or the like.
  • the first intermediate plates 6a and 6b and the second intermediate plates 7a and 7b are sequentially stacked, so that as shown in FIG.
  • a fine capillary channel 42 is formed.
  • 2A is a cross-sectional view of the region where the inside of the cooling unit body 10 is divided into the capillary channel 42 and the vapor diffusion channel 44
  • FIG. 2B is the capillary channel 42 inside the cooling unit main body 10. It is sectional drawing in the area
  • a predetermined amount of refrigerant W made of water is sealed in the internal space 10a of the cooling unit body 10 by reducing the pressure, thereby lowering the boiling point of the refrigerant W and generating a slight amount of heat from the apparatus HE to be cooled.
  • the refrigerant W can be circulated through the vapor diffusion channel 44 and the capillary channel 42 as vapor.
  • FIG. 3A shows the configuration of the upper outer surface 2a of the upper plate 2
  • FIG. 3B shows the configuration of the lower inner surface 2b of the upper plate 2.
  • 4A shows the configuration of the lower outer surface 3a of the lower plate 3
  • FIG. 4B shows the configuration of the upper inner surface 3b of the lower plate 3.
  • FIG. 5 shows the configuration of the first middle plates 6a and 6b sandwiched between the upper plate 2 and the lower plate 3
  • FIG. 6 shows the configuration between the upper plate 2 and the lower plate 3 in the same manner as the first middle plates 6a and 6b. This shows the configuration of the second intermediate plates 7a and 7b sandwiched between the two.
  • the upper plate 2 has a main body portion 21 having a thickness of, for example, about 500 zm and a substantially square shape.
  • a thickness of, for example, about 500 zm and a substantially square shape On the lower inner surface 2b of the main body 21, an upper plate inner surface groove 23 that is recessed in a lattice shape is formed except for the frame-shaped peripheral portion 12.
  • the upper plate 2 is provided with protruding columns 24 each having a flat tip at each region partitioned by the upper plate inner surface groove 23 in a lattice pattern.
  • the lower plate 3 has a plate-like main body portion 11 having a thickness of about 500 ⁇ and a substantially square shape, like the upper plate 2.
  • a lower plate inner surface groove 14 that is recessed in a lattice shape is formed except for the frame-shaped peripheral portion 12.
  • the lower plate 3 is provided with a protruding column 15 having a flat tip end in each region partitioned by a lower plate inner surface groove portion 14 in a lattice shape.
  • the main body 31 of the first middle plates 6a and 6b as shown in FIG. 5 and the main body 32 of the second middle plates 7a and 7b as shown in FIG. It is made of the same copper-based metal as the plate 3, has a thickness of about 70 to 200 ⁇ m, for example, and is formed in a substantially square shape that is the same as the main body 11 of the lower plate 3.
  • a vapor diffusion channel hole 34 and a capillary tube forming region 36 are formed in the main body 31 of the first intermediate plate 6a.
  • the capillary tube forming region 36 is composed of a cooled device peripheral region 33a and a region 33b other than the cooled device peripheral region 33a, which is a region between adjacent vapor diffusion channel holes 34.
  • the cooled device peripheral region 33a is a region facing the cooled device HE provided on the lower plate 3 when the main body 31 is stacked on the main body 11 of the lower plate 3.
  • the vapor diffusion channel holes 34 are formed in a band shape, and are radial from the cooled device peripheral area 33a including the four corners. It is drilled so as to extend.
  • the capillary forming region 36 a plurality of through holes 37 for forming a capillary channel 42 (FIGS. 2A and 2B) are formed in a first pattern (described later).
  • the capillary forming region 36 has a grid-like partition wall 38, and each region partitioned by the partition wall 38 is a through hole 37.
  • the through-hole 37 has a four-sided shape, and is regularly arranged as a first pattern at a predetermined interval, and each of the four sides is a peripheral portion 12 that is an outline of the main body portion 32. They are arranged so as to be parallel to each of the four sides (Fig. 5).
  • the width of the through hole 37 is selected to be about 280 ⁇ m, for example, and the width of the partition wall 38 is selected to be about 70 ⁇ m, for example.
  • the second intermediate plates 7a and 7b shown in FIG. 6 are formed with the same dimensions as the first intermediate plates 6a and 6b.
  • the second intermediate plate 7a of the second intermediate plates 7a and 7b will be described below.
  • the second intermediate plate 7a is provided with the capillary forming region 36 and the vapor diffusion channel hole 34 in the same manner as the first intermediate plates 6a and 6b.
  • the plurality of through holes 40 provided are formed in a second pattern (described later) different from the first pattern described above.
  • a lattice-like partition wall 41 is formed, and each region partitioned by the partition wall 41 is a through hole 40.
  • the through-hole 40 has a quadrilateral shape, and is regularly arranged at a predetermined interval as the second pattern as the second pattern, and each four side is a peripheral portion of the main body 32.
  • the four sides of the twelve sides are arranged in parallel with each other, and are shifted from the through holes 37 of the first intermediate plate 6a by a predetermined distance.
  • the through hole 37 of the first intermediate plate 6a becomes the through hole in the second intermediate plate 7a.
  • One side of 40 is displaced in the X direction by one half of the side, and is shifted by one half of the side in the Y direction of the other side orthogonal to the one X direction.
  • four capillary channels 42 can be formed in one through hole 37 of the first intermediate plate 6a by overlapping the four adjacent through holes 40 of the second intermediate plate 7a.
  • the through-holes 37 are capillaries that are much smaller than the through-holes 37 and 40 and have a small surface area and a small surface area.
  • the channel 42 is formed so as to be formed in large numbers.
  • the second intermediate plates 7a and 7b and the first intermediate plates 6a and 6b are alternately stacked on the heat pipe 1 in turn, so that as shown in FIG. Accordingly, the capillary channel 42 is formed and the vapor diffusion channel holes 34 are overlapped to form the vapor diffusion channel 44. Further, the vapor diffusion channel 44 and the capillary channel 42 are communicated with each other via an upper plate inner surface groove portion 23 and a lower plate inner surface groove portion 14 (FIGS. 2A and 2B).
  • FIG. 9A showing a side cross-sectional configuration at AA ′ in FIG. 1 where the vapor diffusion channel 44 and the capillary channel 42 are provided. Since the refrigerant W is always present in each capillary channel 42 in the peripheral region 33a of the cooling device, the refrigerant W in each capillary channel 42 promptly transfers the heat transferred from the protrusions in the peripheral region 33a of the cooled device. The refrigerant W diffuses through the vapor diffusion flow path 44, the upper plate inner surface groove portion 23, and the lower plate inner surface groove portion 14 extending to the peripheral portion 12 by securely absorbing heat and starting to evaporate.
  • the refrigerant W is composed of the cooling device HE provided on the lower plate 3 and the vapor diffusion channel 44. It diffuses radially evenly along the upper plate inner groove 23 and the lower plate inner groove 14 and diffuses to the peripheral portion 12.
  • FIG. 12A is a front view showing a partial detailed configuration of a region in the vicinity of the refrigerant injection hole 4 formed on the lower inner surface 2b of the upper plate 2, and a cross-sectional view taken along a portion C-C ′ in the front view. is there.
  • the lower inner surface 2b of the upper plate 2 has a circular shape around the refrigerant inlet hole 4 so as to surround the refrigerant inlet hole 4.
  • An upper plate reinforcing portion 50 formed in a shape is provided.
  • the upper plate reinforcing portion 50 has a thickness greater than that of the upper plate inner groove portion 23 and is selected to have the same thickness as that of the protruding column 24 and the peripheral portion 12 provided between the upper plate inner groove portions 23.
  • the refrigerant injection hole 4 is a fine hole having a cylindrical opening 4a in the center having a diameter of, for example, about 500 to 1000 zm, and a gas vent groove 4b is formed on the inner peripheral surface.
  • a concave portion 4c is formed on the opening 4a and the gas vent groove 4b so that the spherical sealing member 8 can be stabilized.
  • the gas vent groove 4b has a semicircular shape having a diameter smaller than the diameter of the opening 4a as shown in FIG. 15A showing the front configuration of the refrigerant injection hole 4, and the opening 4a It has a configuration in which four are arranged at equal intervals on the inner peripheral surface of the.
  • FIG. 12B and FIG. 12D are front views showing a part of the detailed configuration of the region in the vicinity of the middle plate reinforcing portion 52 formed on the first middle plates 6a and 6b.
  • the middle plate reinforcing portion 52 of the first middle plate 6 a is circular and has the same shape as the upper plate reinforcing portion 50, and is formed at a position facing the upper plate reinforcing portion 50.
  • the middle plate reinforcing portion 52 is formed in the vapor diffusion channel hole 34, it is integrally formed with the partition wall 38, and the corner portion of the vapor diffusion channel hole 34 is divided. is doing.
  • the middle plate reinforcing portion 52 is selected to have the same thickness as that of the partition wall 38 and the peripheral portion 12, and the refrigerant hole 53 is formed at a position facing the opening 4a of the refrigerant injection hole 4 of the upper plate 2. It is installed.
  • FIG. 12C and FIG. 12E are front views showing a partial detailed configuration of a region in the vicinity of the reinforcing portion with slit 55 formed in the second intermediate plates 7a and 7b.
  • the reinforcing portions 55 with slits of the second intermediate plates 7a and 7b are formed integrally with the cutting wall 41, and the intermediate plate reinforcing portions 52 of the first intermediate plates 6a and 6b communicate with the vapor diffusion channel hole 34. It has the same structure except that the slit 56 is formed.
  • the refrigerant hole 57 is formed in a position facing the opening in the refrigerant injection hole 4 of the upper plate 2 and communicated with the slit 56.
  • the reinforcing portion 55 with the slit is the diffusion direction in which the vapor diffuses in the vapor diffusion channel hole 34 (in this case, the direction from the center point of the second intermediate plates 7a, 7b toward the corner).
  • a slit 56 is formed along D and communicates with the vapor diffusion channel hole 34 so that the vapor can diffuse to the corners.
  • the slit 56 is formed, for example, in a straight line and has a width of 0. It is selected to be about 3mm.
  • FIG. 12F is a front view showing a partial detailed configuration of a region in the vicinity of the lower plate reinforcing portion 60 formed on the upper inner surface 3 b of the lower plate 3.
  • the upper inner surface 3b of the lower plate 3 is provided with a lower plate reinforcing portion 60 formed in a circular shape in a region facing the middle plate reinforcing portion 52 and the reinforcing portion 55 with slits.
  • the lower plate reinforcing portion 60 has a thickness larger than that of the lower plate inner surface groove portion 14 and is selected to have the same thickness as the protruding columns 15 and the peripheral portion 12 provided between the lower plate inner surface groove portions 14.
  • the lower plate reinforcing portion 60 is formed with a slit facing groove 61 and a central recess 62 communicating with the lower plate inner surface groove portion 14.
  • the slit facing groove 61 has a width of about 300 ⁇ , for example, and is formed in a straight line on the lower plate reinforcing portion 60 so as to face the slit 56.
  • the central recess 62 is formed in a circular shape at a portion of the upper plate 2 facing the opening 4a of the refrigerant injection hole 4.
  • FIG. 13 shows that after the second intermediate plate 7a, the first intermediate plate 6a, the second intermediate plate 7b, and the first intermediate plate 6b are sequentially laminated on the lower plate 3, the first intermediate plate is further added.
  • FIG. 6 is a cross-sectional view showing a detailed configuration of an upper plate reinforcing portion 50, an intermediate plate reinforcing portion 52, a slit-attached reinforcing portion 55, and a lower plate reinforcing portion 60 when an upper plate 2 is laminated on 6b.
  • the upper plate reinforcing portion 50, the middle plate reinforcing portion 52, the slit-equipped reinforcing portion 55, and the lower plate reinforcing portion 60 are in close contact to form a support structure.
  • the mechanical strength can be improved.
  • the refrigerant particles W1 which are continuously dropped from the nozzle 70 into the refrigerant injection hole 4 at a high speed (for example, 1000 drops per second), drop into the opening 4a of the upper plate 2, the first middle plate.
  • the refrigerant passes through the refrigerant hole 53 of 6b and the refrigerant hole 57 of the second intermediate plate 7b, etc., reaches the slit facing groove 61 and the central recess 62 of the lower plate 3, and is cooled through each slit 56.
  • the internal space 10a (FIG. 2A) of the main body 10 is configured to spread over the entire area.
  • FIGS. 14A to 14E and FIGS. 16A and 16B show an example of a manufacturing method for the heat pipe 1.
  • the second intermediate plate 7a, The middle plate 6a, the second middle plate 7b, the first middle plate 6b, and the upper plate 2 are laminated in order from the bottom.
  • a bonding projection 72 protruding from the upper surface is formed in a frame shape along the peripheral portion 12.
  • the lower plate 3 has an upper inner surface 3b from the main body 11.
  • the protruding joining projection 73 is formed in a frame shape along the peripheral portion 12.
  • the second intermediate plate 7a, the first intermediate plate 6a, the second intermediate plate 7b, the first intermediate plate 6b and the upper plate 2 are superposed at the optimum positions and stacked on the lower plate 3.
  • the upper plate 2, the lower plate 3, the first middle plates 6a and 6b, and the second middle plates 7a and 7b are further pressurized while being heated at a temperature equal to or lower than the melting point, so that the joining protrusions 7 2 and 73 are Directly.
  • the upper plate 2, the lower plate 3, the first middle plates 6a and 6b, and the second middle plates 7a and 7b are integrated by being directly joined as shown in FIG. 14B.
  • the cooled cooling unit body 10 can be formed.
  • the cooling section main body 10 is in a state where the internal space 10a communicates with the outside only through the refrigerant injection hole 4 and the air discharge hole 5 formed in the upper plate 2.
  • the first intermediate plates 6a, 6b, the second intermediate plates 7a, 7b, and the lower plate 3 are provided with projections 74 at the four-side outline positions of the central portion facing the cooled device HE, respectively.
  • the projection 74 is directly joined and integrated not only in the peripheral portion 12 but also in the outer position of the cooled device peripheral region 33a.
  • the column structure is also provided in the cooled device peripheral region 33a and the like to improve the mechanical strength, and the refrigerant is thermally expanded by the heat generated from the cooled device HE, so that the substantially central portion is formed. This prevents the cooling unit body 10 itself from being destroyed by a phenomenon of expanding outward (hereinafter referred to as the popcorn phenomenon).
  • a vapor diffusion channel 44 is formed by overlapping the vapor diffusion channel holes 34 of the first intermediate plates 6a, 6b and the second intermediate plates 7a, 7b.
  • a plurality of capillary channels 42 are formed by overlapping the capillary forming regions 36, whereby a circulation path composed of the vapor diffusion channel 44 and the capillary channel 42 can be configured (FIGS. 9A and 9). B).
  • the upper plate reinforcing portion 50, the middle plate reinforcing portion 52, the reinforcing portion with slit 55, and the lower plate reinforcing portion 60 are in close contact with each other below the peripheral area of the refrigerant injection hole 4 and the air discharge hole 5.
  • a structure can be formed.
  • the coolant W1 for example, water
  • the air discharge hole 5 serves as an air discharge port when the refrigerant is supplied, and can smoothly inject the refrigerant into the internal space 10a.
  • the enclosed amount is equivalent to the total volume of the through-holes 37 and 40. I prefer water.
  • a predetermined number of sealing members 8 made of, for example, a spherical body are prepared in advance, and the cooling pipes 4 and the air discharge holes 5 are placed on the refrigerant injection holes 4 and the air discharge holes 5 as shown in FIG. Place the sealing member 8 on it.
  • the refrigerant injection hole 4 and the air discharge hole 5 have a plurality of gas vent grooves 4b formed on the inner peripheral surface of the opening 4a. Even if 8 is placed, as shown in FIG. 15B, the internal space 10a of the cooling unit body 10 and the outside are maintained in communication with each other by the gas vent groove 4b, and the internal space 10a of the cooling unit body 10 is maintained. It is designed to be able to vent gas.
  • FIG. 14E which sequentially shows the manufacturing method of the heat pipe 1
  • vacuum degassing by depressurization is performed, for example, for about 10 minutes through the degassing groove 4b at this temperature in this state.
  • the air in the internal space 10a is extracted through the gas vent groove 4b, and harmful components are removed from the internal space 10a together with the air. May decrease.
  • the arrow in FIG. 14E indicates the direction of degassing (outgassing).
  • FIG. 16A which sequentially shows the manufacturing method of the heat pipe 1
  • the sealing member 8 is pressed from above with a press 75 for several minutes while being kept at room temperature, and deformed at low temperature.
  • the refrigerant injection hole 4 and the air discharge hole 5 are temporarily sealed with the sealing member 8 by performing the low-temperature vacuum pressurization treatment.
  • the refrigerant injection hole 4 and the air discharge hole 5 are closed by the sealing member 8.
  • the upper plate reinforcing portion 50, the middle plate reinforcing portion 52, the slit-attached reinforcing portion 55, and the lower plate reinforcing portion 60 are in close contact with the portions facing the peripheral regions of the refrigerant injection hole 4 and the air discharge hole 5. Therefore, when the sealing member 8 is pressed by the press 75, the supporting structure receives the external force from the press 75, and the internal space 10a is not crushed and sealed by the press 75. The member 8 can be reliably pressurized with the necessary external force.
  • the sealing member 8 when the sealing member 8 is pressurized at a temperature higher than normal temperature, the refrigerant vapor, for example, water vapor easily leaks to the outside, which is preferable. Therefore, vacuum deaeration is performed.
  • the preferred temperature is a room temperature of about 25 ° C.
  • the degree of vacuum is set to 0.5 KPa, for example, at a high temperature for about 10 minutes, and then the sealing member 8 is further pressurized with a press 75.
  • the sealing member 8 is deformed at high temperature and pressure, penetrates deeply into the refrigerant injection hole 4 and the air discharge hole 5, and is further tightly pressed and sealed with the sealing member 8.
  • the sealing member 8 is mainly plastically deformed by pressurization and is plastically deformed by heating (accordingly), and the refrigerant injection hole 4 and the air discharge hole 5 including the gas vent groove 4b. Can be closed.
  • the sealing member 8 which is a spherical body is formed into a refrigerant injection hole 4 and an air discharge hole 5 by plastic deformation, and the refrigerant injection hole 4 and The air discharge hole 5 is pressure-bonded to substantially become a sealing plug, and the internal space 10a of the cooling unit body 10 is sealed.
  • the outer surface of the sealing member 8 is formed on substantially the same plane as the outer surface of the cooling unit body 10. This is to maintain the flatness of the outer surface of the heat pipe 1, thereby improving the adhesion between the heat pipe 1 itself and a radiator such as a fin attached thereto, and improving the thermal conductivity between them without any trouble. Because you can.
  • the outer surface of the cooling unit main body 10 is nickel-plated for protection.
  • the coolant injection hole 4 and the air discharge hole 5 are closed using a sealing member having a soldering force, it is difficult to make a good nickel plating on the solder.
  • there is an inconvenience that the portion where the air discharge hole 5 is blocked is not easily nickel-plated.
  • the coolant injection hole 4 and the air discharge hole 5 are closed using the sealing member 8 made of the same copper-based metal as the cooling unit body 10, so that such inconvenience does not occur.
  • the portions where the refrigerant injection hole 4 and the air discharge hole 5 are closed can be satisfactorily nickel-plated.
  • a plurality of heat pipes 1 are arranged under vacuum, and the heat pipe 1 is placed on the refrigerant injection hole 4 and the air discharge hole 5 of each heat pipe 1.
  • the sealing member 8 is placed, and the plurality of heat pipes 1 are degassed at once and the sealing portion It is possible to pressurize and heat the material 8 and plastically deform all the sealing members 8 to simultaneously seal the refrigerant S.
  • the mass productivity of the heat pipe 1 can be increased. It is possible to reduce the price of the heat pipe 1 by increasing.
  • the internal space 10a is in a depressurized state (when the refrigerant is water, for example, about 0.5 KPa), the boiling point of the refrigerant is lowered, and the room temperature is below 50 ° C, for example. Even at a slightly high temperature (for example, about 30 ° C to 35 ° C), the refrigerant easily becomes vapor. As a result, the heat pipe 1 is formed so that the circulation phenomenon of the refrigerant can be repeated continuously and easily even with slight heat from the apparatus to be cooled HE.
  • the coolant injection hole 4 and the air discharge hole 5 are closed using the sealing member 8 made of the same plastic material as the cooling body 10 made of copper-based metal.
  • the sealing member 8 made of the same plastic material as the cooling body 10 made of copper-based metal.
  • solder when solder is used as the sealing member 8, since the solder contains lead, which is a harmful substance, the force required for management and the like necessary for sealing with lead is used in the present invention. Since copper-based metal is used as the material for the component 8, the management necessary for the lead is not required, and the cost can be reduced accordingly.
  • the cooling unit body 10 is preferably formed of a copper-based metal.
  • the cooling unit body 10 is preferably formed of a copper-based metal.
  • it is made of a system metal it is a common practice to coat the outer surface of the cooling unit body 10 with nickel for protection and the like.
  • the solder is eroded by the pretreatment for nickel plating, and a weak adhesion and a plating film are formed on the surface of the solder. The adhesion of the nickel plating film formed on the substrate The problem of weakening arises.
  • the cooling section main body 10 is made of a copper-based metal
  • the sealing member 8 that closes the refrigerant injection hole 4 is also made of a copper-based metal. Nickel plating can be reliably applied to the entire shell.
  • the spherical sealing member 8 since the spherical sealing member 8 is plastically deformed in accordance with the shapes of the refrigerant injection hole 4 and the air discharge hole 5, it becomes a sealing plug.
  • the sealing member 8 does not easily protrude from the outer surface, and the flatness of the outer surface of the heat pipe 1 can be prevented from being lost by sealing, and the degree of freedom of mounting on portable devices and small devices can be improved by force.
  • this heat pipe 1 for example, electronic parts such as CPUs and LEDs (light emitting diodes) that require heat dissipation are mounted on one side, and fins and other radiators (heat dissipator) are installed on the other side. Since the outer surface of the sealing member 8 does not protrude from the outer surface of the cooling unit body 10, the adhesion with electronic components and the radiator is improved and the thermal conductivity between them is improved. As a result, it is possible to effectively dissipate heat generated by electronic components.
  • electronic parts such as CPUs and LEDs (light emitting diodes) that require heat dissipation are mounted on one side, and fins and other radiators (heat dissipator) are installed on the other side. Since the outer surface of the sealing member 8 does not protrude from the outer surface of the cooling unit body 10, the adhesion with electronic components and the radiator is improved and the thermal conductivity between them is improved. As a result, it is possible to effectively dissipate heat generated by electronic components.
  • a gas vent groove 4 b is separately provided on the inner peripheral surface of the opening 4 a of the refrigerant injection hole 4 and the air discharge hole 5.
  • the sealing member 8 is pressurized under pressure, so that the refrigerant injection hole 4 is temporarily sealed with the sealing member 8, and then the sealing member 8 is further pressurized.
  • the sealing member 8 made of a plastic metal is plastically deformed and deformed in accordance with the shape of the gas vent groove 4b. It is possible to prevent the leakage of the refrigerant W enclosed in the internal space 10a.
  • the upper plate reinforcing portion 50, the middle plate reinforcing portion 52, the reinforcing portion with slit 55, and the lower plate reinforcing are provided in portions corresponding to the peripheral regions of the refrigerant injection hole 4 and the air discharge hole 5. Since the support 60 is formed in close contact with the part 60, the refrigerant injection hole 4 and the air discharge Improves mechanical strength in the peripheral area of the hole 5 and prevents damage during the manufacturing process such as the internal space 10a being crushed by external force from the press 75 applied to the sealing member 8 from the outside of the upper plate 2 And as a result, production costs can be reduced.
  • the internal space 10a is prevented from being crushed in the peripheral region of the refrigerant injection hole 4 and the air discharge hole 5 by various external forces applied from the upper plate 2 and the lower plate 3. The ability to extend the life of pipe 1 is possible.
  • the vapor diffusion flow path 44 and the capillary flow as a circulation path in the internal space 10a. Road 42 is formed.
  • the vapor diffusion flow path 44 is disposed so as to extend to the corners of the four sides farthest from the central part where the heat is diffused to the peripheral part 12 of the cooling part body 10 to efficiently dissipate heat. .
  • the refrigerant injection hole 4 and the air discharge hole 5 are arranged at one corner of the heat pipe 1 to facilitate smooth supply of the refrigerant to the entire inside of the heat pipe 1.
  • the air discharge hole 5 is arranged in the other corner opposite to the one corner.
  • the refrigerant injection hole 4 and the air discharge hole 5 are arranged on the vapor diffusion channel 44 having a hollow structure. For this reason, if the region facing the refrigerant injection hole 4 and the air discharge hole 5 remains in a hollow structure, the sealing member 8 is placed on the refrigerant injection hole 4 and the air discharge hole 5 and pressed. In this case, since the external force from the press 75 is received only by the upper plate 2, the upper plate 2 may be damaged.
  • the upper plate reinforcing portion 50, the middle plate reinforcing portion 52, in the vapor diffusion channel 44 facing the peripheral regions of the refrigerant injection hole 4 and the air discharge hole 5 Since the reinforcing portion 55 with the slit and the lower plate reinforcing portion 60 are in close contact to form a support structure, the external force from the press 75 is received by the support structure, and the upper plate 2 or the lower plate 3 is received by the external force. It is possible to prevent the internal space 10a from being damaged and being crushed.
  • the upper plate reinforcing portion 50, the middle plate reinforcing portion 52, the slit-equipped reinforcing portion 55, and the lower plate reinforcing portion 60 have the refrigerant injection hole 4 in a portion corresponding to the refrigerant injection hole 4 of the upper plate 2.
  • Refrigerant holes 53 and 57 communicating with the refrigerant W are formed.
  • the reinforcing part 55 with slits is formed through the slits 56 because the slits 56 are formed along the diffusion direction D of the refrigerant W diffusing in the vapor diffusion flow path 44. Can be guided to the corners of the cooling unit body 10 and diffused to the corners of the internal space 10a to efficiently dissipate heat.
  • the cooling unit main body 10 having no air discharge hole is used. be able to.
  • illustration and description of the shape and structure of the circulation path of the internal space 10a are omitted.
  • a refrigerant for example, pure water
  • an inkjet nozzle 80 for example, 50 ⁇ m in diameter.
  • the refrigerant can be supplied by making the refrigerant particles W2 into extremely fine refrigerant particles W2 and driving them one by one at a high speed.
  • the vacuum evacuation work to be performed can be omitted, and the manufacturing cost can be reduced as much as the work is omitted.
  • a mechanism that digitally controls the number of discharges to the ink jet nozzle makes it easy and accurate with a drop unit accuracy. , Can be filled at high speed.
  • FIG. 18 and 19 are plan views showing the reinforcing portions with slits 81 and 85 according to other embodiments, and the shape of the slit 56 is different from the reinforcing portions with slits 55 of the above-described embodiments. . Fig. 18 As shown in FIG. 8, the reinforcing part 81 with slit is formed so that the width dimension of the slit 83 gradually increases from the center of the circular coolant hole 82 toward the outer periphery of the reinforcing part 81 with slit. Further, as shown in FIG.
  • the reinforcing portion with slit 85 is formed such that the width dimension of the slit 87 gradually becomes narrower from the center of the refrigerant hole 86 toward the outer periphery of the reinforcing portion with slit 85.
  • These slit reinforcing portions 81 and 85 can provide the same effects as the slit reinforcing portion 55 of the above-described embodiment. Note that the widths of the slits 56, 81, 85 may be non-uniform for each intermediate plate.
  • the refrigerant injection hole 4 and the air discharge hole 5 each having a shape in which four semicircular degassing grooves 4b are provided on the inner peripheral surface of the cylindrical opening 4a are provided.
  • the present invention is not limited to this, the present invention is not limited to this.
  • FIG. 20A showing the front configuration of the refrigerant injection hole or the air discharge hole
  • FIG. 20B showing the side sectional configuration
  • the refrigerant injection hole 90a and the air discharge hole 90b having an inverted trapezoidal conical shape that gradually decreases as the diameter of the gas increases and decreases gradually at the lower end, and may be applied.
  • FIG. 20A showing the front configuration of the refrigerant injection hole or the air discharge hole
  • FIG. 20B showing the side sectional configuration
  • the refrigerant injection hole 90a and the air discharge hole 90b having an inverted trapezoidal conical shape that gradually decreases as the diameter of the gas increases and decreases gradually at the lower end, and may be applied.
  • FIG. 20A showing the front
  • the spherical sealing member 8 is plastically deformed in accordance with the shapes of the refrigerant injection hole 90a and the air discharge hole 90b. As a result, it becomes flat and the internal space can be reliably sealed.
  • the refrigerant injection hole and the air discharge hole are shown in Fig. 21A showing a front configuration of the refrigerant injection hole or the air discharge hole and Fig. 21B showing a side sectional configuration.
  • the refrigerant injection hole 9 la has an upper portion 92 having a large-diameter short columnar shape and a lower portion 93 having a small-diameter short columnar shape, and the upper portion 92 and the lower portion 93 are integrally formed via a step portion 94.
  • the air discharge hole 91b may be applied.
  • FIG. 21C showing the state of sealing by the sealing member 8
  • the sealing member 8 when the sealing member 8 is plastically deformed and completely holds the lower part 93, the sealing member 8
  • the remaining portion of the sealing member 8 is accommodated in the upper portion 92 having a large diameter, which prevents the sealing member 8 from protruding from the upper outer surface of the heat pipe 1 and makes it flat.
  • FIGS. 20A and 20B and FIGS. 21A and 21B the same effect as that of the above-described embodiment can be obtained.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un tuyau chauffant pouvant voir sa durée de vie remarquablement rallongée en appliquant en toute fiabilité un effet d'étanchéité même à haute température, et un procédé de fabrication du tuyau chauffant. Elle concerne également un tuyau chauffant de coût remarquablement réduit en augmentant la productivité et pouvant voir sa durée de vie rallongée. Dans le tuyau chauffant (1), une pièce d'armature de plaque supérieure (50), des pièces d'armature de plaque intermédiaire (52), des pièces d'armature (55) avec des fentes, et une pièce d'armature de plaque inférieure (60) sont assemblées dans un passage d'écoulement diffuseurde vapeur (44) faisant face aux zones périphériques d'un trou de remplissage de réfrigérant (4) et d'un trou d'échappement d'air (5) pour constituer une structure en colonne. Comme une force externe provenant d'une presse (75) est supportée par la structure en colonne composée de la pièce d'armature de plaque supérieure (50), des pièces d'armature de plaque intermédiaire (52), des pièces d'armature (55) avec des fentes, et de la pièce d'armature de plaque inférieure (60), les désavantages selon lesquels une plaque supérieure (2) ou une plaque inférieure (3) est endommagée par la force externe, et donc un espace interne (10a) se comprime peuvent être supprimés.
PCT/JP2007/053509 2006-07-28 2007-02-26 tuyau chauffant et son procédé de fabrication WO2008012960A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2007510405A JP4035155B1 (ja) 2006-07-28 2007-02-26 ヒートパイプ及びその製造方法
CN2007800136122A CN101421577B (zh) 2006-07-28 2007-02-26 热管及其制造方法
US11/993,939 US20210310745A1 (en) 2006-07-28 2007-02-26 Heat pipe and method for manufacturing same
EP07714941A EP2051032A1 (fr) 2006-07-28 2007-02-26 Tuyau chauffant et son procédé de fabrication
TW096123746A TWI409424B (zh) 2006-07-28 2007-06-29 Heat pipe and its manufacturing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006206160 2006-07-28
JP2006-206160 2006-07-28

Publications (1)

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WO2008012960A1 true WO2008012960A1 (fr) 2008-01-31

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US (1) US20210310745A1 (fr)
EP (1) EP2051032A1 (fr)
JP (1) JP4035155B1 (fr)
KR (1) KR20090045146A (fr)
CN (1) CN101421577B (fr)
TW (1) TWI409424B (fr)
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TWI612266B (zh) * 2016-06-28 2018-01-21 Cai Ming Kun 均溫裝置之腔體之製造方法及其結構
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CN110243216A (zh) * 2018-03-09 2019-09-17 双鸿电子科技工业(昆山)有限公司 均温板及其制造方法
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TWI695962B (zh) * 2019-05-14 2020-06-11 超眾科技股份有限公司 均溫板毛細支撐結構
TWI710742B (zh) * 2019-11-22 2020-11-21 邁萪科技股份有限公司 均溫板
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Publication number Priority date Publication date Assignee Title
JP2009266941A (ja) * 2008-04-23 2009-11-12 Fuchigami Micro:Kk ヒートパイプ、ヒートパイプの製造方法および電子基板
TWI612266B (zh) * 2016-06-28 2018-01-21 Cai Ming Kun 均溫裝置之腔體之製造方法及其結構
JP7386469B2 (ja) 2017-12-22 2023-11-27 国立大学法人 鹿児島大学 ヒートパイプ

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US20210310745A1 (en) 2021-10-07
JPWO2008012960A1 (ja) 2009-12-17
JP4035155B1 (ja) 2008-01-16
CN101421577A (zh) 2009-04-29
TW200817646A (en) 2008-04-16
EP2051032A1 (fr) 2009-04-22
CN101421577B (zh) 2011-08-03
TWI409424B (zh) 2013-09-21

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