WO2013065427A1 - Module semi-conducteur et procédé de fabrication de ce dernier - Google Patents

Module semi-conducteur et procédé de fabrication de ce dernier Download PDF

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Publication number
WO2013065427A1
WO2013065427A1 PCT/JP2012/074762 JP2012074762W WO2013065427A1 WO 2013065427 A1 WO2013065427 A1 WO 2013065427A1 JP 2012074762 W JP2012074762 W JP 2012074762W WO 2013065427 A1 WO2013065427 A1 WO 2013065427A1
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WO
WIPO (PCT)
Prior art keywords
heat
heat spreader
semiconductor module
fin region
resin sheet
Prior art date
Application number
PCT/JP2012/074762
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English (en)
Japanese (ja)
Inventor
純司 鶴岡
青木　一雄
真 田口
誠二 安井
Original Assignee
アイシン・エィ・ダブリュ株式会社
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Application filed by アイシン・エィ・ダブリュ株式会社 filed Critical アイシン・エィ・ダブリュ株式会社
Publication of WO2013065427A1 publication Critical patent/WO2013065427A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a semiconductor module and a manufacturing method thereof, and in particular, a semiconductor chip, a heat spreader on which the semiconductor chip is placed, and a surface side of the heat spreader opposite to the placement surface on which the semiconductor chip is placed. And a heat sink that releases heat generated in the semiconductor chip to the outside, and a resin sheet that is interposed between the heat spreader and the heat sink and adhesively bonds the heat spreader and the heat sink And a manufacturing method thereof.
  • a semiconductor module in which a heat spreader on which a semiconductor chip is placed and a heat radiating body are bonded and bonded using a resin sheet (see, for example, Patent Document 1).
  • the resin sheet generates an adhesive force that adheres and bonds the heat spreader and the radiator by applying heat and pressure. Therefore, the adhesive bond between the heat spreader and the heat radiating body is realized by applying heat and pressure to the resin sheet while the resin sheet is interposed between the heat spreader and the heat radiating body.
  • the heat dissipator is disposed on the surface opposite to the mounting surface on which the semiconductor chip of the heat spreader is mounted, and has a function of releasing heat generated in the semiconductor chip to the outside.
  • the heat dissipating body is provided with fins on the non-adhesive surface opposite to the adhesive surface that is adhesively bonded to the heat spreader via the resin sheet.
  • the fin has a function of enhancing the heat dissipation performance of the radiator by promoting heat exchange with air or liquid cooling fluid.
  • the area occupied by the fins on the non-adhesive surface of the heat radiating body extends to the outside of the outer edge of the heat spreader (see particularly FIG. 1).
  • the heat spreader is pressed around the place where the fin of the heat radiating portion is provided as a support center.
  • the structure of the semiconductor module described above can ensure the function of the fins provided in the heat radiating body. Therefore, the heat spreader is warped by the heat spreader, and the pressure applied to the resin sheet is not sufficiently applied. As a result, the heat spreader and the heat sink are sufficiently bonded to each other via the resin sheet. There is a possibility that a sufficient adhesive force cannot be obtained.
  • the present invention has been made in view of the above points, and without impairing the function of the fins provided on the radiator, pressure applied to the resin sheet interposed between the heat spreader and the radiator provided with the fins It is an object of the present invention to provide a semiconductor module that can be sufficiently applied and a manufacturing method thereof.
  • the object is to provide a semiconductor chip, a heat spreader on which the semiconductor chip is mounted, and a surface of the heat spreader opposite to the mounting surface on which the semiconductor chip is mounted.
  • a heat dissipating body that releases generated heat to the outside, and a resin sheet that is interposed between the heat spreader and the heat dissipating member and adhesively bonds the heat spreader and the heat dissipating member, and the heat dissipating member includes the resin
  • a fin provided on a non-adhesive surface opposite to an adhesive surface that is adhesively bonded to the heat spreader via a sheet, and the semiconductor chip is disposed on the heat spreader, the heat spreader, the resin sheet, and the heat dissipation
  • the heat spreader is positioned so as to overlap the fin region occupied by the fin with respect to the non-adhesive surface with the body being separated. Header is on the resin sheet, separates the resin sheet and the radiator, is achieved by a semiconductor module having a fin region outer end located
  • the above object is a method for manufacturing the above-described semiconductor module, and is opposed to the outer end of the fin region of the heat spreader in a direction perpendicular to the non-adhesion surface with the resin sheet and the heat dissipating member therebetween.
  • a step of pressing the semiconductor module is performed by pressing the semiconductor module.
  • FIG. 1 It is a block diagram of the semiconductor module which is one Example of this invention. It is sectional drawing in each part of the semiconductor module shown in FIG. It is the perspective view at the time of seeing the structure which decomposed
  • FIG. 1 shows a configuration diagram of a semiconductor module 20 according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of each part of the semiconductor module 20 shown in FIG. 2A shows the AA cross section
  • FIG. 2B shows the BB cross section
  • FIG. 2C shows the CC cross section
  • FIG. FIG. 2E shows a cross section D
  • FIG. 2E shows a cross section EE.
  • FIG. 3 is a perspective view of the structure obtained by disassembling the semiconductor module 20 of the present embodiment at the upper part and the lower part when viewed obliquely from above.
  • FIG. 4 is a perspective view of the structure obtained by disassembling the semiconductor module 20 of the present embodiment at the upper part and the lower part when viewed obliquely from below.
  • the semiconductor module 20 of this embodiment is a power module that is mounted on, for example, a hybrid vehicle or an electric vehicle, and is used in a motor control device such as an inverter that performs power conversion.
  • the semiconductor module 20 includes a semiconductor chip 22 made of a semiconductor.
  • a plurality of semiconductor chips 22 are provided corresponding to each phase of a three-phase motor, for example.
  • the semiconductor module 20 is a combination of a plurality of semiconductor chips 22 in one package.
  • the semiconductor chip 22 is a switching element such as an IGBT, a power MOS-FET, or a diode connected in parallel to the switching element. In the present embodiment, it is assumed that the semiconductor module 20 includes 12 semiconductor chips 22.
  • the semiconductor module 20 also includes a heat spreader 24 on which the semiconductor chip 22 is placed.
  • the heat spreader 24 is a rectangular member made of, for example, copper, aluminum, or an alloy mainly composed of these metals.
  • a plurality of heat spreaders 24 are provided.
  • Each heat spreader 24 has one or more semiconductor chips 22 mounted thereon. The mounting position of the semiconductor chip 22 on the heat spreader 24 is near the center on the surface of the heat spreader 24.
  • the semiconductor module 20 includes six heat spreaders 24, and one heat spreader 24 includes two semiconductor chips 22 (specifically, a semiconductor chip 22 including one switching element). And a semiconductor chip 22 composed of a single diode).
  • the semiconductor module 20 is also provided with a heat radiating body (heat sink) 26 that releases heat generated in the semiconductor chip 22 to the outside.
  • the radiator 26 is disposed on the surface of the heat spreader 24 opposite to the mounting surface on which the semiconductor chip 22 is mounted.
  • the six heat spreaders 24 are arranged in series on the mounting surface of the radiator 26.
  • the radiator 26 is a member made of, for example, copper, aluminum, or an alloy mainly composed of those metals.
  • the heat radiating body 26 has a flat plate portion 26a formed in a flat plate shape and fins 26b formed in a sword mountain shape.
  • the flat plate portion 26a has a size (area) necessary and sufficient for arranging the six heat spreaders 24 horizontally.
  • the six heat spreaders 24 are arranged adjacent to each other in a predetermined direction on the flat plate portion 26a.
  • a gap 28 is formed between the two heat spreaders 24 adjacent to each other.
  • the semiconductor module 20 further includes a resin sheet 30 interposed between the heat spreader 24 and the heat radiator 26.
  • the resin sheet 30 is a member made of an epoxy resin or the like having flexibility and insulation, and has a function of bonding the heat spreader 24 and the radiator 26 to each other.
  • the resin sheet 30 adheres and bonds the heat spreader 24 and the radiator 26 by applying heat at a predetermined temperature and a predetermined pressure (for example, 3 MPa).
  • silicon grease or the like may be applied to the surface of the resin sheet 30.
  • the resin sheet 30 has a size (area) necessary and sufficient for horizontally arranging the six heat spreaders 24.
  • the size of the resin sheet 30 is set to be smaller than the size of the flat plate portion 26 a of the radiator 26.
  • the fin 26b of the radiator is opposite to the surface of the flat plate portion 26a opposite to the surface on which the heat spreader 24 is disposed, that is, the adhesive surface 32 that is adhesively bonded to the heat spreader 24 via the resin sheet 30. It is provided on the non-bonding surface 34 on the side.
  • the non-bonding surface 34 is formed in a substantially flat shape.
  • the fins 26 b have a function of improving the heat dissipation performance as the heat dissipating body 26 that releases the heat transmitted from the semiconductor chip 22 to the outside by increasing the surface area of the heat dissipating body 26.
  • the fin 26b is composed of a plurality of pins 36 each protruding in a cylindrical shape from the non-adhesive surface 34 of the flat plate portion 26a.
  • the pins 36 are provided so as to be regularly arranged on the non-adhesion surface 34 of the flat plate portion 26a, and each pin 36 is disposed at a predetermined distance from the adjacent pin 36.
  • a region (hereinafter referred to as a fin region) 40 occupied by the fins 26b is formed on the non-bonding surface 34 of the flat plate portion 26a.
  • the fin region 40 has a size (area) smaller than the entire size of the non-bonding surface 34 of the flat plate portion 26a.
  • the semiconductor chip 22 of the heat spreader 24 is mounted on the non-bonding surface 34 of the flat plate portion 26a so that the heat generated in the semiconductor chip 22 can be effectively released to the outside using the fin 26b.
  • the region including the region directly under the portion to be placed, and the region where the heat dissipation performance needs to be improved by the fins 26b on the non-adhesive surface 34, for example, the outermost pin of all the pins 36 It is a substantially rectangular region obtained by connecting 36.
  • the non-adhesion surface 34 of the flat plate portion 26 a of the radiator 26 has the fin region 40 described above and a non-fin region 42 outside the fin region 40.
  • the fin region 40 occupies a substantially central portion of the non-bonding surface 34 of the flat plate portion 26a.
  • the non-fin region 42 occupies the peripheral portion of the non-adhesive surface 34 of the flat plate portion 26 a so as to surround the fin region 40 on the outer peripheral side of the fin region 40.
  • the non-fin region 42 is a region obtained by removing the fin region 40 from the non-adhesion surface 34 of the radiator 26.
  • a flow path case 44 is bonded and fixed to the non-bonding surface 34 of the flat plate portion 26 a of the heat radiator 26.
  • the flow path case 44 is formed in a substantially U-shaped cross section.
  • the flow path case 44 forms a cooling flow path 46 for guiding a cooling fluid (water, air, etc.) between the non-adhesive surface 34 of the flat plate portion 26a.
  • the fins 26 b are exposed in the cooling flow path 46.
  • the cooling fluid flows substantially uniformly with respect to the six heat spreaders 24 arranged substantially uniformly in parallel in the fin region 40. After the cooling fluid flows into the inlet of the cooling channel 46, the cooling fluid exchanges heat with the radiator 26 (mainly the fins 26 b), and is then discharged from the outlet of the cooling channel 46.
  • the semiconductor chip 22 including the switching element and the diode when the switching element as the semiconductor chip 22 is repeatedly turned on / off, the semiconductor chip 22 including the switching element and the diode generates heat.
  • the heat generated in the semiconductor chip 22 is transmitted to the heat radiating body 26 through the heat spreader 24 and the resin sheet 30, and then released from the heat radiating body 26 to the outside.
  • the cooling fluid introduced into the cooling flow path 46 flows between the pins 36 of the fins 26 b of the radiator 26 and exchanges heat with the radiator 26, thereby generating heat generated in the semiconductor chip 22. Is radiated from the cooling channel 46 to the outside. Therefore, according to the semiconductor module 20 of the present embodiment, it is possible to improve the heat radiation performance of the heat radiator 26 by introducing the cooling fluid into the cooling flow path 46 formed below the heat radiator 26.
  • the heat spreader 24 and the heat radiating body 26 are adhesively bonded via the resin sheet 30.
  • a predetermined temperature and a predetermined pressure for example, 3 MPa
  • heat at a predetermined temperature and a predetermined pressure are applied to the resin sheet 30.
  • a predetermined pressure for example, 3 MPa
  • an adhesive force for bonding the heat spreader 24 and the heat radiating body 26 to the resin sheet 30 is generated.
  • the heat spreader 24 and the radiator 26 are connected to the resin sheet 30 by applying heat and a predetermined pressure to the resin sheet 30 interposed between the heat spreader 24 and the radiator 26. It is possible to adhesively bond via
  • the application of pressure to the resin sheet 30 interposed between the heat spreader 24 and the radiator 26 is generally realized by pressurizing the heat spreader 24 toward the radiator 26 side.
  • the semiconductor chip 22 is mounted on the heat spreader 24
  • applying the pressure to the heat radiator 26 side of the heat spreader 24 on the entire mounting surface of the heat spreader 24 means that the semiconductor chip on the heat spreader 24. It is not appropriate in that it can damage 22.
  • the peripheral portion of the heat spreader 24 where the semiconductor chip 22 is not placed is pressed so as not to damage the semiconductor chip 22 on the heat spreader 24. Is appropriate.
  • FIG. 5 shows an upper part of the semiconductor module 20 of the present embodiment, and a jig 50 that is a support member necessary for adhesively bonding the heat spreader 24 and the radiator 26 via the resin sheet 30 when viewed obliquely from above.
  • FIG. FIG. 6 is a perspective view of the upper part of the semiconductor module 20 of the present embodiment and a jig 50 necessary for adhesively bonding the heat spreader 24 and the radiator 26 via the resin sheet 30 when viewed obliquely from below.
  • FIG. 7 shows a configuration diagram when the upper part of the semiconductor module 20 of the present embodiment is installed in the jig 50.
  • FIG. 8 is a cross-sectional view of each part of the configuration shown in FIG. 8A shows a FF cross section, FIG. 8B shows a GG cross section, and FIG. 8C shows a HH cross section.
  • the semiconductor module 20 has the heat spreader 24 and the radiator 26 bonded via the resin sheet 30 before the flow path case 44 is bonded and fixed to the non-bonding surface 34 of the flat plate portion 26 a of the radiator 26. It is supported by the jig 50 in the combined process.
  • the heat spreader 24 is pressed toward the radiator 26, that is, when the resin sheet 30 is pressed to adhesively bond the heat spreader 24 and the radiator 26, the jig 50 is provided with the semiconductor module 20 (particularly the radiator 26. ).
  • the jig 50 is installed below the non-adhesive surface 34 of the semiconductor module 20 before the flow path case 44 is bonded and fixed to the non-adhesive surface 34 of the flat plate portion 26 a of the heat radiator 26 in the semiconductor module 20.
  • the heat spreader 24 is pressed toward the radiator 26, that is, when the resin sheet 30 is pressed to adhesively bond the heat spreader 24 and the radiator 26, the jig 50 has a non-flat plate 26 a.
  • the adhesive surface 34 is contacted.
  • the jig 50 is formed in a substantially flat plate shape, has substantially the same size (area) as the flat plate portion 26a of the radiator 26, and has a predetermined thickness.
  • the jig 50 includes a contact portion 52 that contacts the non-bonding surface 34 of the flat plate portion 26a, and a hole 54 that is open at the center.
  • the hole 54 has a shape corresponding to the fin region 40 occupied by the fins 26 b on the non-bonding surface 34 of the radiator 26.
  • the contact portion 52 has a shape corresponding to the non-fin region 42 outside the fin region 40.
  • the semiconductor module 20 is installed in the jig 50 such that the contact portion 52 of the jig 50 contacts the non-adhesive surface 34 of the flat plate portion 26a of the radiator 26.
  • the semiconductor module 20 is supported by the contact portion 52 of the jig 50 in a state where the fins 26 b of the radiator 26 have entered the holes 54 of the jig 50.
  • the region where the contact portion 52 of the jig 50 contacts on the non-bonding surface 34 of the flat plate portion 26a of the radiator 26 is a support region for supporting the semiconductor module 20 with the jig 50 and substantially coincides with the non-fin region 42 described above. To do.
  • FIG. 9 is a plan view showing a pressurizing portion of the heat spreader 24 that is adhesively bonded to the radiator 26 via the resin sheet 30 in the semiconductor module 20.
  • FIG. 10 is a cross-sectional view showing the main structure of the semiconductor module 20 of this embodiment.
  • FIG. 11 is a cross-sectional view showing the contrast structure 100 compared with the semiconductor module 20 of the present embodiment.
  • FIG. 12 is a plan view showing the relative positional relationship between the semiconductor module 20 and the jig 50 according to this embodiment.
  • the semiconductor chip 22 of the heat spreader 24 is placed so that the heat spreader 24 is pressed against the radiator 26 in the manufacturing process of the semiconductor module 20 so as not to damage the semiconductor chip 22 on the heat spreader 24.
  • This is realized by pressurizing a peripheral portion (a region indicated by hatching in FIG. 9) that is not directed toward the radiator 26 side.
  • the semiconductor chip 22 is separated from the non-adhesive surface 34 of the flat plate portion 26a of the radiator 26 with the heat spreader 24, the resin sheet 30, and the radiator 26 separated on the heat spreader 24.
  • the fin 26b is located so as to overlap the fin region 40. That is, the fin region 40 in the heat radiator 26 includes at least a region on the non-adhesion surface 34 of the flat plate portion 26a that is directly below the portion where the semiconductor chip 22 of the heat spreader 24 is placed.
  • the planar relative relationship between the semiconductor chip 22 and the fin region 40 of the radiator 26 when viewed from the direction perpendicular to the surface is defined so that the entire semiconductor chip 22 is located in the fin region 40. Yes.
  • the region of the non-adhesion surface 34 just below the portion where the semiconductor chip 22 of the heat spreader 24 is placed is the fin region 40 occupied by the fins 26b
  • the region of the non-adhesion surface 34 is Compared to the structure of the non-fin region 42 in which the fins 26 b are not provided, the heat generated in the semiconductor chip 22 is easily transmitted to the fins 26 b of the radiator 26 via the heat spreader 24 and the resin sheet 30.
  • the semiconductor chip 22 is positioned on the heat spreader 24 so as to overlap the fin region 40 with respect to the non-bonding surface 34 of the flat plate portion 26a of the radiator 26.
  • the heat spreader 24 has a fin on the non-adhesive surface 34 of the flat plate portion 26a of the heat radiator 26 with the resin sheet 30 and the heat radiator 26 separated on the resin sheet 30.
  • An end portion (hereinafter referred to as a fin region outer end portion) 24a located outside the region 40 (that is, the non-fin region 42) is provided.
  • the fin region outer end portion 24a is preferably formed over the entire periphery of the heat spreader 24, but only a part of the entire periphery of the periphery may be formed.
  • the fin region outer end 24a may be formed only at the four corners of the heat spreader 24, as shown in FIG. 12, or the side of the heat spreader 24 facing the adjacent heat spreader 24. It is good also as forming only in the peripheral part except a part.
  • the heat spreader 24 is a rectangular member.
  • the fin region 40 occupied by the fin 26b is formed in a substantially rectangular shape, but more specifically, the fin 26b is provided for the rectangle. It has a notch 40a provided with no notch.
  • the notch 40a of the fin region 40 is provided at a position facing each of the four corners including the fin region outer end 24a of the heat spreader 24, and is formed in a tapered shape or a triangular shape, for example.
  • the notch 40a of the fin region 40 extends from the outside to the inside in the direction orthogonal to the adjacent direction in which the two heat spreaders 24 are adjacent to the region (gap 28) between the heat spreaders 24 adjacent to each other on the resin sheet 30.
  • the width in the adjacent direction is gradually narrowed, or the two heat spreaders 24 are arranged on the resin sheet 30 from the outer side to the inner side in the direction perpendicular to the adjacent adjacent direction with respect to the outer region of the heat spreader 24 at both ends. It is formed so that the width in the adjacent direction is gradually narrowed.
  • the non-fin region 42 where the fins 26b are not provided includes a region corresponding to the notch 40a described above. Further, on the non-adhesion surface 34 of the flat plate portion 26a of the radiator 26, the support region where the semiconductor module 20 is supported by the jig 50 substantially coincides with the above-described non-fin region 42 and corresponds to the above-described notch portion 40a. including.
  • a part of the support region where the semiconductor module 20 is supported by the jig 50 is a region (gap 28) between the heat spreaders 24 adjacent to each other in the non-fin region 42 outside the fin region 40. ) So that the width in the adjacent direction gradually decreases from the outside to the inside in the direction orthogonal to the adjacent adjacent direction, or outside the heat spreader 24 at both ends on the resin sheet 30. Two heat spreaders 24 with respect to the region are formed such that the width in the adjacent direction gradually decreases from the outside to the inside in the direction orthogonal to the adjacent adjacent direction.
  • the contact portion 52 of the jig 50 has a shape corresponding to the non-fin region 42 outside the fin region 40.
  • the contact portion 52 has a protrusion 56 that protrudes toward the center of the hole 54 corresponding to the above-described notch portion 40a.
  • the protrusions 56 are provided at positions facing the four corners of the heat spreader 24, and are formed in a tapered shape or a triangular shape, for example.
  • the protrusion 56 of the contact portion 52 is formed so that its width gradually decreases from the root side to the tip side.
  • the fin region 40 on the non-adhesive surface 34 of the radiator 26 extends to the outside of the outer edge of the heat spreader 24, and the situation extends over the entire periphery of the periphery of the heat spreader 24.
  • the pressurization is performed with the fin region 40 provided with the fins 26b that are not sufficient as a support member as the support center.
  • the flat plate portion 26a of the radiator 26 is warped, and the support of the semiconductor module 20 by the jig 50 becomes unstable.
  • the semiconductor module 20 is supported by the jig 50 in the process in which the heat spreader 24 and the radiator 26 are bonded and bonded via the resin sheet 30 when the semiconductor module 20 is manufactured.
  • the protrusion 56 of the contact portion 52 of the jig 50 comes into contact with a region corresponding to the notch 40 a in the non-fin region 42 of the non-adhesive surface 34 of the radiator 26.
  • the notch 40a is provided at a position facing each of the four corners including the fin region outer end 24a of the heat spreader 24.
  • the semiconductor of the heat spreader 24 is used to apply pressure to the resin sheet 30 interposed between the heat spreader 24 and the heat radiator 26 when the semiconductor module 20 is manufactured.
  • the fin region outer end 24 a of the heat spreader 24 and the protrusion 56 of the contact portion 52 of the jig 50 are flat plates of the heat radiator 26. Since the semiconductor modules 20 (especially the radiator 26) are reliably supported by the contact portion 52 of the jig 50 and overlap each other in the direction perpendicular to the non-bonding surface 34 of the portion 26a, the flat plate portion 26a of the radiator 26 is supported. The occurrence of warping due to the pressurization of the heat spreader 24 is avoided.
  • the function of the fins 26b provided in the radiator 26 (specifically, the function of effectively discharging the heat generated in the semiconductor chip 22 to the outside) is impaired.
  • the notch 40a where the fins 26b are not provided on the non-adhesive surface 34 of the radiator 26 has a width from the peripheral side to the center side of the fin region 40 in the region corresponding to the vicinity of the peripheral edge of the heat spreader 24. It has a tapered shape so that it gradually becomes narrower. Further, the protrusion 56 of the contact portion 52 of the jig 50 is formed so that its width gradually decreases from the root side to the tip side in accordance with the shape of the notch 40a.
  • the non-bonding surface 34 of the heat radiating body 26 is left in the region near the placement of the semiconductor chip 22 as much as possible while leaving the non-fin region 42 in the fin region 40 as much as possible. Since the heat radiation performance by the fins 26b can be maintained, the pressure to the heat spreader 24 and the pressure application to the resin sheet 30 can be performed closer to the center of the fin region 40. . Therefore, according to the semiconductor module 20 of the present embodiment, even when a plurality of heat spreaders 24 are arranged, sufficient pressure is applied even on the side where the adjacent heat spreaders 24 face each other (that is, near the center of the resin sheet 30). Thus, the heat spreader 24 can be fully pressurized over substantially the entire circumference, and the adhesive force for bonding the heat spreader 24 and the radiator 26 can be increased.
  • FIG. 13 is a diagram showing the flow of the cooling fluid in the semiconductor module 20 of the present embodiment.
  • FIG. 14 is a view showing the flow of the cooling fluid in the comparison structure compared with the semiconductor module 20 of the present embodiment.
  • 13 and 14 are plan views showing the relative positional relationship between the semiconductor module 20 and the flow path case 44, respectively.
  • the fin region 40 in which the fins 26b occupy the non-bonding surface 34 of the radiator 26 has the cutout portions 40a where the fins 26b are not provided as described above.
  • the notch 40 a is provided at a position facing the region (gap 28) between the heat spreaders 24 adjacent to each other on the resin sheet 30.
  • the flow path case 44 is provided with a block member 60 that blocks the flow of the cooling fluid at the inlet or outlet of the cooling flow path 46.
  • the block member 60 has a planar shape (tapered or triangular) corresponding to the notch 40a in the non-fin region 42 of the non-adhesive surface 34 of the radiator 26, and the non-adhesive surface 34 and the flow path case. 44 and the height of the cooling flow path 46 formed by 44.
  • the block member 60 may have a wall erected so that the region occupied by the notch 40a is closed.
  • the block member 60 is provided for each notch 40a at a position facing a region corresponding to the corresponding notch 40a. Each block member 60 faces the region corresponding to the notch 40a after the heat radiator 26 and the flow path case 44 are bonded and fixed.
  • the block member 60 is disposed at locations corresponding to the inlet and outlet cutout portions 40 a of the cooling flow path 46. As shown in FIG. 13, the cooling fluid flowing into the inlet of the cooling flow path 46 is blocked by the block member 60, and the flow of the cooling fluid to the portion corresponding to the notch 40 a of the cooling flow path 46 is blocked. For this reason, the cooling fluid that has flowed into the inlet of the cooling flow path 46 is divided on both sides of the block member 60, and is easily concentrated between the two adjacent block members 60.
  • the block member 60 is opposed to the region corresponding to the notch 40a, the notch 40a is opposed to each of the four corners of the heat spreader 24, and the semiconductor chip 22 is placed near the center on the surface of the heat spreader 24.
  • the cooling fluid that has flowed in between the two block members 60 adjacent to each other at the inlet of the cooling flow path 46 circulates directly under the semiconductor chip 22 toward the outlet.
  • circulated to the exit of the cooling flow path 46 is interrupted
  • the structure of the semiconductor module 20 of the present embodiment it becomes easy for the cooling fluid to flow directly under the semiconductor chip 22 and the flow velocity thereof can be increased, so that the temperature drop of the semiconductor chip 22 can be promoted. It is possible to improve the heat dissipation performance from the radiator 26 to the outside via the cooling fluid.
  • the block member 60 corresponds to “distribution prevention means” described in the claims.
  • a plurality of heat spreaders 24 are arranged for one radiator 26, but one heat spreader 24 may be arranged for each radiator 26 one by one.
  • a plurality (six) of heat spreaders 24 are arranged in series on the mounting surface of the radiator 26, but the present invention is not limited to this. It may be arranged in a matrix of 2 rows and 2 columns.
  • the fin area 40 and the non-fin area 42 on the non-adhesive surface 34 of the radiator 26 are set in accordance with the arrangement positions of the plurality of heat spreaders 24, and the shapes and arrangement positions of the jig 50 and the block member 60 are set. It should be set.
  • the non-fin region 42 and the support region for supporting the semiconductor module 20 with the jig 50 are regions on the non-adhesion surface 34 of the flat plate portion 26 a formed in the flat plate shape on the radiator 26. Therefore, if it is a shape that can support the jig 50, it may be, for example, a curved surface, or a plurality of pins that are separated by a distance shorter than the separation distance between adjacent pins 36 of the fin 26b. It is good also as the surface which consists of.
  • the fin 26b which is the heat dissipating body 26, is composed of a plurality of pins 36 each protruding in a cylindrical shape from the non-adhesive surface 34 of the flat plate portion 26a.
  • the present invention is not limited to this. Instead, it may be a straight shape in which a plurality of flat plates are erected, or a zigzag shape in which a plurality of meandering plates are erected.
  • the fin region 40 may be a region occupied by the fin 26b, and is a substantially rectangular region surrounding the outermost (outermost) plate among all the plates constituting the fin 26b. May be.
  • the block member 60 that blocks the flow of the cooling fluid at the inlet or outlet of the cooling channel 46 is provided in the channel case 44.
  • the present invention is not limited to this. Alternatively, it may be provided on the non-adhesion surface 34 of the flat plate portion 26a of the radiator 26.
  • the non-fin region 42 outside the fin region 40 on the non-bonding surface 34 of the flat plate portion 26a of the radiator 26 and the support region for supporting the semiconductor module 20 with the jig 50 substantially coincide.
  • the present invention is not limited to this, and the supporting region may be included in the non-fin region 42.
  • the non-fin region 42 includes a region where the jig 50 does not contact. Also good.
  • the cooling fluid flowing through the cooling flow path 46 flows in the direction orthogonal to the adjacent direction in which the plurality of heat spreaders 24 are adjacent as shown in FIG. It is good.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Afin d'appliquer une pression suffisante à une feuille de résine intercalée entre un dissipateur thermique et un dispositif de dispersion de chaleur sans avoir d'effet négatif sur la fonctionnalité des ailettes agencées sur le dissipateur thermique, la présente invention comprend les éléments suivants : une puce semi-conductrice ; le dispositif de dispersion de chaleur susmentionné sur lequel est montée la puce semi-conductrice ; le dissipateur thermique susmentionné qui est disposé sur le côté opposé du dispositif de dispersion de chaleur par rapport à la surface de montage de ce dernier sur laquelle est montée la puce semi-conductrice ; et la feuille de résine susmentionnée qui colle ensemble le dispositif de dispersion de chaleur et le dissipateur thermique. Des ailettes sont agencées sur la surface non collée du dissipateur thermique qui constitue la surface de ce dernier qui est opposée à la surface de ce dernier à laquelle le dispositif de dispersion de chaleur est collé. La puce semi-conductrice est positionnée sur le dispositif de dispersion de chaleur de sorte à recouvrir, au moyen du dispositif de dispersion de chaleur, la feuille de résine, le dissipateur thermique et la partie ailette de la surface non collée où les ailettes sont agencées. Sur la feuille de résine, le dispositif de dispersion de chaleur présente une zone périphérique à l'extérieur de la partie ailette qui, à travers la feuille de résine et le dissipateur thermique, est située à l'extérieur de la partie ailette de la surface non collée susmentionnée.
PCT/JP2012/074762 2011-11-04 2012-09-26 Module semi-conducteur et procédé de fabrication de ce dernier WO2013065427A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-242883 2011-11-04
JP2011242883A JP2015038903A (ja) 2011-11-04 2011-11-04 半導体モジュール

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Cited By (4)

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WO2019175522A1 (fr) * 2018-03-16 2019-09-19 Safran Electrical & Power Ensemble de puissance, notamment pour un aeronef
WO2022137692A1 (fr) * 2020-12-22 2022-06-30 日立Astemo株式会社 Circuit électrique et dispositif de conversion de puissance
CN115699300A (zh) * 2020-05-29 2023-02-03 三菱电机株式会社 冷却器及半导体装置
JP7555261B2 (ja) 2020-12-22 2024-09-24 日立Ａｓｔｅｍｏ株式会社 電気回路体および電力変換装置

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Publication number Priority date Publication date Assignee Title
JP6662242B2 (ja) * 2016-08-24 2020-03-11 トヨタ自動車株式会社 半導体装置
JP7380417B2 (ja) * 2020-05-21 2023-11-15 株式会社デンソー 電力変換装置
JP2022175583A (ja) * 2021-05-14 2022-11-25 Ｎｅｃプラットフォームズ株式会社 冷却部品

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JP2008300476A (ja) * 2007-05-30 2008-12-11 Sumitomo Electric Ind Ltd パワーモジュール
JP2009182313A (ja) * 2008-02-01 2009-08-13 Denso Corp 部品冷却構造
JP2010021406A (ja) * 2008-07-11 2010-01-28 Toyota Industries Corp 半導体装置
JP2011134978A (ja) * 2009-12-25 2011-07-07 Fuji Electric Co Ltd 流体冷却式ヒートシンク

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2008300476A (ja) * 2007-05-30 2008-12-11 Sumitomo Electric Ind Ltd パワーモジュール
JP2009182313A (ja) * 2008-02-01 2009-08-13 Denso Corp 部品冷却構造
JP2010021406A (ja) * 2008-07-11 2010-01-28 Toyota Industries Corp 半導体装置
JP2011134978A (ja) * 2009-12-25 2011-07-07 Fuji Electric Co Ltd 流体冷却式ヒートシンク

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019175522A1 (fr) * 2018-03-16 2019-09-19 Safran Electrical & Power Ensemble de puissance, notamment pour un aeronef
FR3079069A1 (fr) * 2018-03-16 2019-09-20 Safran Electrical & Power Ensemble de puissance, notamment pour un aeronef
US11373928B2 (en) 2018-03-16 2022-06-28 Safran Electrical & Power Power unit, in particular for an aircraft
CN115699300A (zh) * 2020-05-29 2023-02-03 三菱电机株式会社 冷却器及半导体装置
WO2022137692A1 (fr) * 2020-12-22 2022-06-30 日立Astemo株式会社 Circuit électrique et dispositif de conversion de puissance
JP7555261B2 (ja) 2020-12-22 2024-09-24 日立Ａｓｔｅｍｏ株式会社 電気回路体および電力変換装置

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