KR102626667B1 - 샤프트 부착 세라믹 히터 - Google Patents

샤프트 부착 세라믹 히터 Download PDF

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Publication number
KR102626667B1
KR102626667B1 KR1020217037422A KR20217037422A KR102626667B1 KR 102626667 B1 KR102626667 B1 KR 102626667B1 KR 1020217037422 A KR1020217037422 A KR 1020217037422A KR 20217037422 A KR20217037422 A KR 20217037422A KR 102626667 B1 KR102626667 B1 KR 102626667B1
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KR
South Korea
Prior art keywords
ceramic
shaft
resistance heating
heating element
conductive film
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Active
Application number
KR1020217037422A
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English (en)
Korean (ko)
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KR20210153679A (ko
Inventor
히로시 다케바야시
겐이치로 아이카와
다츠야 구노
Original Assignee
엔지케이 인슐레이터 엘티디
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Publication of KR20210153679A publication Critical patent/KR20210153679A/ko
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
    • H01L21/02—
    • H01L21/683—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/005—Heaters using a particular layout for the resistive material or resistive elements using multiple resistive elements or resistive zones isolated from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/016—Heaters using particular connecting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Resistance Heating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020217037422A 2019-07-16 2020-06-10 샤프트 부착 세라믹 히터 Active KR102626667B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019130905 2019-07-16
JPJP-P-2019-130905 2019-07-16
PCT/JP2020/022834 WO2021010062A1 (ja) 2019-07-16 2020-06-10 シャフト付きセラミックヒータ

Publications (2)

Publication Number Publication Date
KR20210153679A KR20210153679A (ko) 2021-12-17
KR102626667B1 true KR102626667B1 (ko) 2024-01-17

Family

ID=74210581

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217037422A Active KR102626667B1 (ko) 2019-07-16 2020-06-10 샤프트 부착 세라믹 히터

Country Status (5)

Country Link
US (1) US12284729B2 (https=)
JP (1) JP7240499B2 (https=)
KR (1) KR102626667B1 (https=)
CN (1) CN114175851B (https=)
WO (1) WO2021010062A1 (https=)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237304A (ja) * 2000-02-21 2001-08-31 Ibiden Co Ltd 半導体製造・検査装置用セラミック基板
WO2003015157A1 (en) * 2001-08-10 2003-02-20 Ibiden Co., Ltd. Ceramic joint body
EP1588404A2 (en) 2003-01-17 2005-10-26 General Electric Company Wafer handling apparatus
JP4133958B2 (ja) * 2004-08-04 2008-08-13 日本発条株式会社 ワークを加熱または冷却するための装置と、その製造方法
US7446284B2 (en) * 2005-12-21 2008-11-04 Momentive Performance Materials Inc. Etch resistant wafer processing apparatus and method for producing the same
JP5236927B2 (ja) 2007-10-26 2013-07-17 信越化学工業株式会社 耐腐食性積層セラミックス部材
JP2009182139A (ja) 2008-01-30 2009-08-13 Tokyo Electron Ltd 載置台構造及び処理装置
US9698074B2 (en) * 2013-09-16 2017-07-04 Applied Materials, Inc. Heated substrate support with temperature profile control
CN105282877B (zh) * 2014-06-17 2019-10-25 住友电气工业株式会社 用于半导体制造装置的陶瓷加热器
JP6674800B2 (ja) * 2016-03-07 2020-04-01 日本特殊陶業株式会社 基板支持装置
JP6560150B2 (ja) * 2016-03-28 2019-08-14 日本碍子株式会社 ウエハ載置装置
WO2018159687A1 (ja) * 2017-03-02 2018-09-07 日本碍子株式会社 ウエハ加熱装置
JP2019040939A (ja) * 2017-08-23 2019-03-14 住友電気工業株式会社 ウエハ載置台
JP7109953B2 (ja) 2018-03-26 2022-08-01 日本特殊陶業株式会社 加熱装置

Also Published As

Publication number Publication date
CN114175851B (zh) 2024-06-25
WO2021010062A1 (ja) 2021-01-21
US20220046762A1 (en) 2022-02-10
CN114175851A (zh) 2022-03-11
JPWO2021010062A1 (https=) 2021-01-21
US12284729B2 (en) 2025-04-22
JP7240499B2 (ja) 2023-03-15
KR20210153679A (ko) 2021-12-17

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