CN114175851B - 带轴的陶瓷加热器 - Google Patents

带轴的陶瓷加热器 Download PDF

Info

Publication number
CN114175851B
CN114175851B CN202080050721.7A CN202080050721A CN114175851B CN 114175851 B CN114175851 B CN 114175851B CN 202080050721 A CN202080050721 A CN 202080050721A CN 114175851 B CN114175851 B CN 114175851B
Authority
CN
China
Prior art keywords
ceramic
conductive film
shaft
resistance heating
heating element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080050721.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN114175851A (zh
Inventor
竹林央史
相川贤一郎
久野达也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of CN114175851A publication Critical patent/CN114175851A/zh
Application granted granted Critical
Publication of CN114175851B publication Critical patent/CN114175851B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/005—Heaters using a particular layout for the resistive material or resistive elements using multiple resistive elements or resistive zones isolated from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/016—Heaters using particular connecting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Resistance Heating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
CN202080050721.7A 2019-07-16 2020-06-10 带轴的陶瓷加热器 Active CN114175851B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019130905 2019-07-16
JP2019-130905 2019-07-16
PCT/JP2020/022834 WO2021010062A1 (ja) 2019-07-16 2020-06-10 シャフト付きセラミックヒータ

Publications (2)

Publication Number Publication Date
CN114175851A CN114175851A (zh) 2022-03-11
CN114175851B true CN114175851B (zh) 2024-06-25

Family

ID=74210581

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080050721.7A Active CN114175851B (zh) 2019-07-16 2020-06-10 带轴的陶瓷加热器

Country Status (5)

Country Link
US (1) US12284729B2 (https=)
JP (1) JP7240499B2 (https=)
KR (1) KR102626667B1 (https=)
CN (1) CN114175851B (https=)
WO (1) WO2021010062A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101026119A (zh) * 2005-12-21 2007-08-29 通用电气公司 耐蚀刻晶片处理装置和其制造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237304A (ja) * 2000-02-21 2001-08-31 Ibiden Co Ltd 半導体製造・検査装置用セラミック基板
WO2003015157A1 (en) * 2001-08-10 2003-02-20 Ibiden Co., Ltd. Ceramic joint body
EP1588404A2 (en) 2003-01-17 2005-10-26 General Electric Company Wafer handling apparatus
JP4133958B2 (ja) * 2004-08-04 2008-08-13 日本発条株式会社 ワークを加熱または冷却するための装置と、その製造方法
JP5236927B2 (ja) 2007-10-26 2013-07-17 信越化学工業株式会社 耐腐食性積層セラミックス部材
JP2009182139A (ja) 2008-01-30 2009-08-13 Tokyo Electron Ltd 載置台構造及び処理装置
US9698074B2 (en) * 2013-09-16 2017-07-04 Applied Materials, Inc. Heated substrate support with temperature profile control
CN105282877B (zh) * 2014-06-17 2019-10-25 住友电气工业株式会社 用于半导体制造装置的陶瓷加热器
JP6674800B2 (ja) * 2016-03-07 2020-04-01 日本特殊陶業株式会社 基板支持装置
JP6560150B2 (ja) * 2016-03-28 2019-08-14 日本碍子株式会社 ウエハ載置装置
WO2018159687A1 (ja) * 2017-03-02 2018-09-07 日本碍子株式会社 ウエハ加熱装置
JP2019040939A (ja) * 2017-08-23 2019-03-14 住友電気工業株式会社 ウエハ載置台
JP7109953B2 (ja) 2018-03-26 2022-08-01 日本特殊陶業株式会社 加熱装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101026119A (zh) * 2005-12-21 2007-08-29 通用电气公司 耐蚀刻晶片处理装置和其制造方法

Also Published As

Publication number Publication date
KR102626667B1 (ko) 2024-01-17
WO2021010062A1 (ja) 2021-01-21
US20220046762A1 (en) 2022-02-10
CN114175851A (zh) 2022-03-11
JPWO2021010062A1 (https=) 2021-01-21
US12284729B2 (en) 2025-04-22
JP7240499B2 (ja) 2023-03-15
KR20210153679A (ko) 2021-12-17

Similar Documents

Publication Publication Date Title
US11004715B2 (en) Substrate supporting device
KR100497016B1 (ko) 가열 장치
US10410897B2 (en) Electrostatic chuck
KR102780233B1 (ko) 정전 척 및 기판 고정 장치
KR19980070688A (ko) 세라믹 부재와 전력 공급용 커넥터의 접합 구조체
JPWO2002084717A1 (ja) 半導体製造・検査装置用セラミックヒータ
JP4858319B2 (ja) ウェハ保持体の電極接続構造
JP4331427B2 (ja) 半導体製造装置に使用される給電用電極部材
JP7506807B2 (ja) セラミックサセプター
CN114026956A (zh) 带轴的陶瓷加热器
JP7050455B2 (ja) 静電チャックの製造方法
CN114175851B (zh) 带轴的陶瓷加热器
JP3602908B2 (ja) ウェハ保持部材
CN114041323B (zh) 带轴的陶瓷加热器
US12013433B2 (en) Heater substrate, probe card substrate, and probe card
CN114026957B (zh) 带轴的陶瓷加热器
JP4122723B2 (ja) 被処理物保持体
JP2006186351A (ja) 半導体製造装置
JP6856334B2 (ja) ヒータ
WO2025243995A1 (ja) セラミック構造体
CN113395793B (zh) 陶瓷加热器
JP7642159B1 (ja) マルチゾーンセラミックヒータ
CN121605794A (zh) 陶瓷基座
WO2000026995A1 (fr) Structure de connexion de borne d'entree electrique
JP2004207748A (ja) ウェハ保持部材

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant