JPWO2021010062A1 - - Google Patents

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Publication number
JPWO2021010062A1
JPWO2021010062A1 JP2021532729A JP2021532729A JPWO2021010062A1 JP WO2021010062 A1 JPWO2021010062 A1 JP WO2021010062A1 JP 2021532729 A JP2021532729 A JP 2021532729A JP 2021532729 A JP2021532729 A JP 2021532729A JP WO2021010062 A1 JPWO2021010062 A1 JP WO2021010062A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021532729A
Other languages
Japanese (ja)
Other versions
JP7240499B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021010062A1 publication Critical patent/JPWO2021010062A1/ja
Application granted granted Critical
Publication of JP7240499B2 publication Critical patent/JP7240499B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/005—Heaters using a particular layout for the resistive material or resistive elements using multiple resistive elements or resistive zones isolated from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/016—Heaters using particular connecting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Resistance Heating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
JP2021532729A 2019-07-16 2020-06-10 シャフト付きセラミックヒータ Active JP7240499B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019130905 2019-07-16
JP2019130905 2019-07-16
PCT/JP2020/022834 WO2021010062A1 (ja) 2019-07-16 2020-06-10 シャフト付きセラミックヒータ

Publications (2)

Publication Number Publication Date
JPWO2021010062A1 true JPWO2021010062A1 (https=) 2021-01-21
JP7240499B2 JP7240499B2 (ja) 2023-03-15

Family

ID=74210581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021532729A Active JP7240499B2 (ja) 2019-07-16 2020-06-10 シャフト付きセラミックヒータ

Country Status (5)

Country Link
US (1) US12284729B2 (https=)
JP (1) JP7240499B2 (https=)
KR (1) KR102626667B1 (https=)
CN (1) CN114175851B (https=)
WO (1) WO2021010062A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006049568A (ja) * 2004-08-04 2006-02-16 Nhk Spring Co Ltd ワークを加熱または冷却するための装置と、その製造方法
JP2006517740A (ja) * 2003-01-17 2006-07-27 ゼネラル・エレクトリック・カンパニイ ウェーハ加工装置及びその製造方法
JP2007173828A (ja) * 2005-12-21 2007-07-05 General Electric Co <Ge> エッチング耐性ウェーハ加工装置及びその製造方法
JP2009111005A (ja) * 2007-10-26 2009-05-21 Shin Etsu Chem Co Ltd 耐腐食性積層セラミックス部材
JP2009182139A (ja) * 2008-01-30 2009-08-13 Tokyo Electron Ltd 載置台構造及び処理装置
JP2016536803A (ja) * 2013-09-16 2016-11-24 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 温度プロファイル制御装置を有する加熱基板支持体
JP2017162878A (ja) * 2016-03-07 2017-09-14 日本特殊陶業株式会社 基板支持装置
JP2019175883A (ja) * 2018-03-26 2019-10-10 日本特殊陶業株式会社 加熱装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237304A (ja) * 2000-02-21 2001-08-31 Ibiden Co Ltd 半導体製造・検査装置用セラミック基板
WO2003015157A1 (en) * 2001-08-10 2003-02-20 Ibiden Co., Ltd. Ceramic joint body
CN105282877B (zh) * 2014-06-17 2019-10-25 住友电气工业株式会社 用于半导体制造装置的陶瓷加热器
JP6560150B2 (ja) * 2016-03-28 2019-08-14 日本碍子株式会社 ウエハ載置装置
WO2018159687A1 (ja) * 2017-03-02 2018-09-07 日本碍子株式会社 ウエハ加熱装置
JP2019040939A (ja) * 2017-08-23 2019-03-14 住友電気工業株式会社 ウエハ載置台

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006517740A (ja) * 2003-01-17 2006-07-27 ゼネラル・エレクトリック・カンパニイ ウェーハ加工装置及びその製造方法
JP2006049568A (ja) * 2004-08-04 2006-02-16 Nhk Spring Co Ltd ワークを加熱または冷却するための装置と、その製造方法
JP2007173828A (ja) * 2005-12-21 2007-07-05 General Electric Co <Ge> エッチング耐性ウェーハ加工装置及びその製造方法
JP2009111005A (ja) * 2007-10-26 2009-05-21 Shin Etsu Chem Co Ltd 耐腐食性積層セラミックス部材
JP2009182139A (ja) * 2008-01-30 2009-08-13 Tokyo Electron Ltd 載置台構造及び処理装置
JP2016536803A (ja) * 2013-09-16 2016-11-24 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 温度プロファイル制御装置を有する加熱基板支持体
JP2017162878A (ja) * 2016-03-07 2017-09-14 日本特殊陶業株式会社 基板支持装置
JP2019175883A (ja) * 2018-03-26 2019-10-10 日本特殊陶業株式会社 加熱装置

Also Published As

Publication number Publication date
CN114175851B (zh) 2024-06-25
KR102626667B1 (ko) 2024-01-17
WO2021010062A1 (ja) 2021-01-21
US20220046762A1 (en) 2022-02-10
CN114175851A (zh) 2022-03-11
US12284729B2 (en) 2025-04-22
JP7240499B2 (ja) 2023-03-15
KR20210153679A (ko) 2021-12-17

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