CN114026956A - 带轴的陶瓷加热器 - Google Patents

带轴的陶瓷加热器 Download PDF

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CN114026956A
CN114026956A CN202080047910.9A CN202080047910A CN114026956A CN 114026956 A CN114026956 A CN 114026956A CN 202080047910 A CN202080047910 A CN 202080047910A CN 114026956 A CN114026956 A CN 114026956A
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ceramic
shaft
power supply
heating element
supply rod
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相川贤一郎
竹林央史
久野达也
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NGK Insulators Ltd
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Abstract

带轴的陶瓷加热器具备：陶瓷板，其埋设有RF电极和电阻发热体；中空的陶瓷轴，其设置于陶瓷板的与晶片载置面相反侧的面上；RF供电棒，其收容于陶瓷轴的内部空间，从陶瓷板的与晶片载置面相反侧的面接合于RF电极；以及发热体供电棒，其收容于陶瓷轴的内部空间，从陶瓷板的与晶片载置面相反侧的面接合于电阻发热体。RF供电棒及发热体供电棒的至少一方中的位于陶瓷轴的内部空间的部分的外周面被绝缘薄膜覆盖，绝缘薄膜为气溶胶沉积膜或喷镀膜。

Description

带轴的陶瓷加热器
技术领域
本发明涉及带轴的陶瓷加热器。
背景技术
以往，在半导体晶片的传送、曝光、CVD等成膜工艺、清洗、蚀刻、切割等微细加工中，使用保持晶片的带轴的陶瓷加热器。作为这样的带轴的陶瓷加热器，如专利文献1所示，公开了一种陶瓷加热器，其具备埋设有电阻发热体的陶瓷板、设置于陶瓷板的与晶片载置面相反侧的面上的中空的陶瓷轴、以及收容于陶瓷轴的内部空间的发热体供电棒(参照图4)。发热体供电棒从陶瓷板的与晶片载置面相反侧的面接合于电阻发热体。另外，发热体供电棒中的位于陶瓷轴的内部空间的部分的外周面被由陶瓷形成的绝缘构件覆盖。
现有技术文献
专利文献
专利文献1：日本特开2007-51317号公报
发明内容
发明所要解决的课题
在这样的带轴的陶瓷加热器中，在使用绝缘套管等作为覆盖发热体供电棒的绝缘构件的情况下，绝缘套管需要一定程度的厚度，因此若想要将多个发热体供电棒收容于陶瓷轴的内部空间，则需要增大陶瓷轴的直径。然而，若增大陶瓷轴的直径，则晶片载置面、晶片的均热性变差，或者陶瓷轴与陶瓷板的接合界面处的应力变大，因此在增大陶瓷轴的直径方面存在极限。
本发明是为了解决这样的课题而完成的，其主要目的在于，在确保供电棒间的绝缘性的同时提高供电棒的配置密度。
用于解决课题的方案
本发明的带轴的陶瓷加热器具备：
陶瓷板，其埋设有RF电极和电阻发热体；
中空的陶瓷轴，其设置于所述陶瓷板的与晶片载置面相反侧的面上；
RF供电棒，其收容于所述陶瓷轴的内部空间，从所述陶瓷板的与晶片载置面相反侧的面接合于所述RF电极；以及
发热体供电棒，其收容于所述陶瓷轴的内部空间，从所述陶瓷板的与晶片载置面相反侧的面接合于所述电阻发热体，
所述RF供电棒和所述发热体供电棒的至少一方中的位于所述陶瓷轴的内部空间的部分的外周面被绝缘薄膜覆盖，所述绝缘薄膜是气溶胶沉积(AD)膜或喷镀膜。
在该带轴的陶瓷加热器中，RF供电棒和发热体供电棒中的至少一方中的位于陶瓷轴的内部空间的部分的外周面被绝缘薄膜覆盖，绝缘薄膜为AD膜或喷镀膜。因此，绝缘薄膜的厚度变得足够薄。因此，能够在确保供电棒间的绝缘性的同时提高供电棒的配置密度。其结果，能够增加能够收容于陶瓷轴内部空间的供电棒的数量，或者能够将相同数量的供电棒收容于直径小的陶瓷轴的内部空间。
在本发明的带轴的陶瓷加热器中，所述绝缘薄膜的厚度可以为10μm以上且200μm以下。这样，能够更可靠地得到本发明的效果。
在本发明的带轴的陶瓷加热器中，也可以是，所述电阻发热体分别设置于所述陶瓷板的多个区域，所述发热体供电棒针对每个所述电阻发热体设置。对于在多个区域分别具备电阻发热体的所谓多区域加热器而言，本发明是特别有用的。
附图说明
图1是本实施方式的带轴的陶瓷加热器的纵剖视图。
图2是带轴的陶瓷加热器的横剖视图。
图3是带轴的陶瓷加热器的横剖视图。
图4是现有的带轴的陶瓷加热器的纵剖视图。
具体实施方式
以下，参照附图对本发明的优选实施方式进行说明。图1是本实施方式的带轴的陶瓷加热器的纵剖视图。
如图1所示，带轴的陶瓷加热器具备陶瓷板、陶瓷轴、RF供电棒以及发热体供电棒。在陶瓷板中埋设有RF电极和电阻发热体。RF电极是在产生等离子体时被施加高频电压的电极。电阻发热体分别设置于陶瓷板的多个区域。陶瓷轴是通过直接接合而接合于陶瓷板的与晶片载置面相反侧的面上的中空轴。RF供电棒收容于陶瓷轴的内部空间，从陶瓷板的与晶片载置面相反侧的面接合于RF电极。发热体供电棒收容于陶瓷轴的内部空间，从陶瓷板的与晶片载置面相反侧的面接合于电阻发热体。发热体供电棒针对每个电阻发热体设置。作为各供电棒的材质，例如可举出钼、钛、镍等。RF供电棒中的位于陶瓷轴的内部空间的部分的外周面被绝缘薄膜(例如氧化铝薄膜)覆盖。发热体供电棒中的位于陶瓷轴的内部空间的部分的外周面被绝缘薄膜(例如氧化铝薄膜)覆盖。绝缘薄膜都是AD膜或喷镀膜。特别是，AD法(包括等离子体AD法)适于高精度地形成微细的陶瓷粒子的薄的膜。另外，AD法由于能够通过冲击固化现象使陶瓷粒子成膜，因此不需要在高温下对陶瓷粒子进行烧结。绝缘薄膜的厚度优选为10μm以上且200μm以下。
在以上说明的本实施方式的带轴的陶瓷加热器中，RF供电棒和发热体供电棒中的位于陶瓷轴的内部空间的部分的外周面被绝缘薄膜覆盖，绝缘薄膜为AD膜或喷镀膜。因此，绝缘薄膜的厚度变得足够薄。因此，能够在确保供电棒间的绝缘性的同时提高供电棒的配置密度。其结果，能够增加能够收容于与以往相同直径的陶瓷轴的内部空间的供电棒的数量(参照图2)，或者能够将与以往相同数量的供电棒收容于比以往直径小的陶瓷轴的内部空间(参照图3)。
另外，绝缘薄膜的厚度优选为10μm以上且200μm以下。这样，能够更可靠地得到本实施方式的效果。
需要说明的是，陶瓷板中也可以埋设有静电电极。
本申请将2019年7月1日申请的日本专利申请第2019-122787号作为优先权主张的基础，通过引用将其全部内容包含在本说明书中。
产业上的利用可能性
本发明能够用于例如半导体晶片的传送、曝光、CVD等成膜工艺、清洗、蚀刻、切割等微细加工。

Claims (3)

1.一种带轴的陶瓷加热器，具备：
陶瓷板，其埋设有RF电极和电阻发热体；
中空的陶瓷轴，其设置于所述陶瓷板的与晶片载置面相反侧的面上；
RF供电棒，其收容于所述陶瓷轴的内部空间，从所述陶瓷板的与晶片载置面相反侧的面接合于所述RF电极；以及
发热体供电棒，其收容于所述陶瓷轴的内部空间，从所述陶瓷板的与晶片载置面相反侧的面接合于所述电阻发热体，
所述RF供电棒和所述发热体供电棒的至少一方中的位于所述陶瓷轴的内部空间的部分的外周面被绝缘薄膜覆盖，所述绝缘薄膜为气溶胶沉积膜或喷镀膜。
2.根据权利要求1所述的带轴的陶瓷加热器，所述绝缘薄膜的厚度为10μm以上且200μm以下。
3.根据权利要求1或2所述的带轴的陶瓷加热器，所述电阻发热体分别设置于所述陶瓷板的多个区域，
所述发热体供电棒针对每个所述电阻发热体设置。
CN202080047910.9A 2019-07-01 2020-06-10 带轴的陶瓷加热器 Pending CN114026956A (zh)

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