CN114026957A - 带轴的陶瓷加热器 - Google Patents

带轴的陶瓷加热器 Download PDF

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CN114026957A
CN114026957A CN202080047869.5A CN202080047869A CN114026957A CN 114026957 A CN114026957 A CN 114026957A CN 202080047869 A CN202080047869 A CN 202080047869A CN 114026957 A CN114026957 A CN 114026957A
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shaft
ceramic
embedded
ceramic heater
heating element
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相川贤一郎
竹林央史
久野达也
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NGK Insulators Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/06—Heater elements structurally combined with coupling elements or holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/18—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Resistance Heating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

带轴的陶瓷加热器具备：陶瓷板，其埋设有电阻发热体；中空的陶瓷轴，其上端接合于陶瓷板的与晶片载置面相反侧的面上；以及轴加热部，其埋设于陶瓷轴的上端侧的侧壁中。

Description

带轴的陶瓷加热器
技术领域
本发明涉及带轴的陶瓷加热器。
背景技术
以往，在半导体晶片的传送、曝光、CVD等成膜工艺、清洗、蚀刻、切割等微细加工中，使用保持晶片的带轴的陶瓷加热器。作为这样的带轴的陶瓷加热器，如专利文献1所示，公开了一种陶瓷加热器，其具备埋设有电阻发热体的陶瓷板、设置于陶瓷板的与晶片载置面相反侧的面上的中空的陶瓷轴、以及收容于陶瓷轴的内部空间的发热体供电棒。发热体供电棒从陶瓷板的与晶片载置面相反侧的面接合于电阻发热体。
现有技术文献
专利文献
专利文献1：日本特开2007-51317号公报
发明内容
发明所要解决的课题
在这样的带轴的陶瓷加热器的陶瓷板中，陶瓷轴接合部分和除此以外的部分的散热量不同。即，陶瓷轴接合部分与除此以外的部分相比热容量大，因此容易成为低温。因此，在以使陶瓷板整体均匀成为预定的设定温度(例如500℃)的方式设计电阻发热体时，在以比该设定温度高的温度(例如700℃)使用的情况下，有时陶瓷轴接合部分的发热量过多而成为高温，均热性被破坏。另一方面，在比该设定温度低的温度(例如300℃)使用的情况下，有时陶瓷轴接合部分的发热量不足而成为低温，均热性会被破坏。另外，在使陶瓷板升温或降温时，均热性有时也会被破坏。
本发明是为了解决这样的课题而完成的，其主要目的在于抑制带轴的陶瓷加热器中陶瓷轴接合部分与除此以外的部分的温度偏差。
用于解决课题的方案
本发明的带轴的陶瓷加热器具备：
陶瓷板，其埋设有电阻发热体；
中空的陶瓷轴，其上端接合于所述陶瓷板的与晶片载置面相反侧的面上；以及
轴加热部，其埋设于所述陶瓷轴的上端侧的侧壁中。
在该带轴的陶瓷加热器中，能够与埋设于陶瓷板中的电阻发热体独立地控制埋设于陶瓷轴上端侧的侧壁中的轴加热部。因此，能够抑制陶瓷轴接合部分与除此以外的部分的温度偏差。
在本发明的带轴的陶瓷加热器中，也可以是，所述陶瓷轴具有筒状的轴主体和覆盖所述轴主体的上端侧的侧面的绝缘膜，所述轴加热部设置于所述轴主体的上端侧的侧面，通过被所述绝缘膜覆盖而埋设于所述陶瓷轴中。
在本发明的带轴的陶瓷加热器中，优选的是，所述绝缘膜是气溶胶沉积(AD)膜或喷镀膜。
附图说明
图1是本实施方式的带轴的陶瓷加热器的纵剖视图。
具体实施方式
以下，参照附图对本发明的优选实施方式进行说明。图1是本实施方式的带轴的陶瓷加热器的纵剖视图。
如图1所示，带轴的陶瓷加热器具备陶瓷板、陶瓷轴和轴加热部。在陶瓷板中埋设有电阻发热体。电阻发热体以在通电时陶瓷板整体中的陶瓷轴接合部分的温度低于其以外的部分的方式设计。电阻发热体经由收容于陶瓷轴的内部空间的供电棒来通电。电阻发热体也可以分别设置于陶瓷板的多个区域。陶瓷轴是通过直接接合而接合于陶瓷板的与晶片载置面相反侧的面上的中空轴。陶瓷轴具有筒状的轴主体和覆盖轴主体上端侧的侧面的绝缘膜。轴加热部是埋设于陶瓷轴上端侧的侧壁中的电阻发热体。在此，轴加热部通过印刷、镀覆而设置于轴主体上端侧的侧面，通过被绝缘膜(例如氧化铝膜)覆盖而埋设于陶瓷轴中。绝缘膜优选为气溶胶沉积(AD)膜或喷镀膜。特别是，AD法(包括等离子体AD法)适于高精度地形成微细的陶瓷粒子的薄的膜。另外，AD法由于能够通过冲击固化现象使陶瓷粒子成膜，因此不需要在高温下对陶瓷粒子进行烧结。轴加热部可以经由收容于陶瓷轴的内部空间的供电棒通电，也可以经由埋设于陶瓷轴的侧壁的供电棒通电。
在以上说明的本实施方式的带轴的陶瓷加热器中，能够与埋设于陶瓷板中的电阻发热体独立地控制埋设于陶瓷轴上端侧的侧壁中的轴加热部。因此，能够抑制陶瓷轴接合部分与除此以外的部分的温度偏差。
需要说明的是，在陶瓷板中也可以埋设有静电电极以及RF电极中的至少一方。
本申请将2019年7月1日申请的日本专利申请第2019-122788号作为优先权主张的基础，通过引用将其全部内容包含在本说明书中。
产业上的利用可能性
本发明能够用于例如半导体晶片的传送、曝光、CVD等成膜工艺、清洗、蚀刻、切割等微细加工。

Claims (3)

1.一种带轴的陶瓷加热器，具备：
陶瓷板，其埋设有电阻发热体；
中空的陶瓷轴，其上端接合于所述陶瓷板的与晶片载置面相反侧的面上；以及
轴加热部，其埋设于所述陶瓷轴的上端侧的侧壁中。
2.根据权利要求1所述的带轴的陶瓷加热器，所述陶瓷轴具有筒状的轴主体和覆盖所述轴主体的上端侧的侧面的绝缘膜，
所述轴加热部设置于所述轴主体的上端侧的侧面，通过被所述绝缘膜覆盖而埋设于所述陶瓷轴中。
3.根据权利要求2所述的带轴的陶瓷加热器，所述绝缘膜为气溶胶沉积膜或喷镀膜。
CN202080047869.5A 2019-07-01 2020-06-10 带轴的陶瓷加热器 Pending CN114026957A (zh)

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JP2019-122788 2019-07-01
JP2019122788 2019-07-01
PCT/JP2020/022836 WO2021002169A1 (ja) 2019-07-01 2020-06-10 シャフト付きセラミックヒータ

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WO (1) WO2021002169A1 (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237051A (ja) * 2000-02-24 2001-08-31 Kyocera Corp 筒状体を有するセラミックヒーター及びこれを用いた加熱装置
JP2005340043A (ja) * 2004-05-28 2005-12-08 Sumitomo Electric Ind Ltd 加熱装置
JP2008218752A (ja) * 2007-03-05 2008-09-18 Fujitsu Ltd 電子部品および電子部品の製造方法
TW201208496A (en) * 2010-05-13 2012-02-16 Applied Materials Inc Heater with independent center zone control
CN105556656A (zh) * 2013-09-16 2016-05-04 应用材料公司 具有温度分布控制的加热式基板支撑件

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4662725B2 (ja) * 2004-02-25 2011-03-30 日本碍子株式会社 基板加熱装置とその製造方法
US7126092B2 (en) 2005-01-13 2006-10-24 Watlow Electric Manufacturing Company Heater for wafer processing and methods of operating and manufacturing the same
JP2007051317A (ja) 2005-08-16 2007-03-01 Ngk Insulators Ltd 加熱装置
US10953483B2 (en) * 2017-11-15 2021-03-23 General Electric Company Tool electrode for and methods of electrical discharge machining

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237051A (ja) * 2000-02-24 2001-08-31 Kyocera Corp 筒状体を有するセラミックヒーター及びこれを用いた加熱装置
JP2005340043A (ja) * 2004-05-28 2005-12-08 Sumitomo Electric Ind Ltd 加熱装置
JP2008218752A (ja) * 2007-03-05 2008-09-18 Fujitsu Ltd 電子部品および電子部品の製造方法
TW201208496A (en) * 2010-05-13 2012-02-16 Applied Materials Inc Heater with independent center zone control
CN105556656A (zh) * 2013-09-16 2016-05-04 应用材料公司 具有温度分布控制的加热式基板支撑件

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KR102638093B1 (ko) 2024-02-16
JP7303302B2 (ja) 2023-07-04
US20220053611A1 (en) 2022-02-17
WO2021002169A1 (ja) 2021-01-07
KR20220003024A (ko) 2022-01-07
JPWO2021002169A1 (zh) 2021-01-07
US12108499B2 (en) 2024-10-01

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