JP7284261B2 - ウエハ載置台及びその製法 - Google Patents
ウエハ載置台及びその製法 Download PDFInfo
- Publication number
- JP7284261B2 JP7284261B2 JP2021528133A JP2021528133A JP7284261B2 JP 7284261 B2 JP7284261 B2 JP 7284261B2 JP 2021528133 A JP2021528133 A JP 2021528133A JP 2021528133 A JP2021528133 A JP 2021528133A JP 7284261 B2 JP7284261 B2 JP 7284261B2
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- JP
- Japan
- Prior art keywords
- mounting table
- sintered body
- wafer mounting
- ceramic sintered
- convex portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/134—Plasma spraying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
Description
セラミック焼結体の表面にウエハを支持する複数の凸部を備えたウエハ載置台であって、
前記セラミック焼結体の前記表面のうち前記凸部のない部分は、表面粗さRaが0.1μm以下の鏡面であり、
前記凸部は、前記セラミック焼結体と同じ材質のエアロゾルデポジション(AD)膜又は溶射膜である、
ものである。
(a)セラミック焼結体の表面を鏡面仕上げする工程と、
(b)前記表面のうち凸部を形成したい部分にAD法又は溶射法により凸部を形成する工程と、
を含むものである。
Claims (4)
- セラミック焼結体の表面にウエハを支持する複数の凸部を備えたウエハ載置台であって、
前記セラミック焼結体の前記表面のうち前記凸部のない部分は、表面粗さRaが0.1μm以下の鏡面であり、
前記凸部は、前記セラミック焼結体と同じ材質のエアロゾルデポジション膜である、
ウエハ載置台。 - 前記凸部は、角が丸みを帯びている、
請求項1に記載のウエハ載置台。 - 前記凸部は、前記セラミック焼結体に比べて緻密性が低い、
請求項1又は2に記載のウエハ載置台。 - (a)セラミック焼結体の表面を鏡面仕上げする工程と、
(b)前記表面のうち凸部を形成したい部分にエアロゾルデポジション法により凸部を形成する工程と、
を含むウエハ載置台の製法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019121487 | 2019-06-28 | ||
JP2019121487 | 2019-06-28 | ||
PCT/JP2020/022830 WO2020261990A1 (ja) | 2019-06-28 | 2020-06-10 | ウエハ載置台及びその製法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020261990A1 JPWO2020261990A1 (ja) | 2020-12-30 |
JP7284261B2 true JP7284261B2 (ja) | 2023-05-30 |
Family
ID=74059855
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021528133A Active JP7284261B2 (ja) | 2019-06-28 | 2020-06-10 | ウエハ載置台及びその製法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20220102186A1 (ja) |
JP (1) | JP7284261B2 (ja) |
KR (1) | KR20220006617A (ja) |
CN (1) | CN114072901A (ja) |
WO (1) | WO2020261990A1 (ja) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030047283A1 (en) | 2001-09-10 | 2003-03-13 | Applied Materials, Inc. | Apparatus for supporting a substrate and method of fabricating same |
JP2005033221A (ja) | 2001-02-08 | 2005-02-03 | Tokyo Electron Ltd | 基板載置台および処理装置 |
JP2006287210A (ja) | 2005-03-07 | 2006-10-19 | Ngk Insulators Ltd | 静電チャック及びその製造方法 |
JP2011100844A (ja) | 2009-11-05 | 2011-05-19 | Shin-Etsu Chemical Co Ltd | 静電吸着機能を有する装置及びその製造方法 |
JP2015023168A (ja) | 2013-07-19 | 2015-02-02 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置、及びステージ製造方法 |
JP2018536287A (ja) | 2015-11-17 | 2018-12-06 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 堆積された表面フィーチャを有する基板支持アセンブリ |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH083191A (ja) * | 1994-06-15 | 1996-01-09 | Kuraray Co Ltd | 抗血栓性ペプチドおよびこれを固定化した医療用具 |
EP1238755B1 (en) * | 1999-06-15 | 2010-11-10 | Ibiden Co., Ltd. | Table of wafer polisher, method of polishing wafer, and method of manufacturing semiconductor wafer |
US8545583B2 (en) * | 2000-11-17 | 2013-10-01 | Wayne O. Duescher | Method of forming a flexible abrasive sheet article |
US8062098B2 (en) * | 2000-11-17 | 2011-11-22 | Duescher Wayne O | High speed flat lapping platen |
US7070480B2 (en) * | 2001-10-11 | 2006-07-04 | Applied Materials, Inc. | Method and apparatus for polishing substrates |
JP2006147724A (ja) | 2004-11-17 | 2006-06-08 | Ngk Insulators Ltd | 静電チャック及びその製造方法 |
CN101870086A (zh) * | 2009-04-27 | 2010-10-27 | 三菱综合材料株式会社 | Cmp修整器及其制造方法 |
JP5510411B2 (ja) * | 2010-08-11 | 2014-06-04 | Toto株式会社 | 静電チャック及び静電チャックの製造方法 |
JP6627936B1 (ja) * | 2018-08-30 | 2020-01-08 | 住友大阪セメント株式会社 | 静電チャック装置および静電チャック装置の製造方法 |
CN111668148A (zh) * | 2019-03-05 | 2020-09-15 | Toto株式会社 | 静电吸盘及处理装置 |
-
2020
- 2020-06-10 WO PCT/JP2020/022830 patent/WO2020261990A1/ja active Application Filing
- 2020-06-10 CN CN202080047761.6A patent/CN114072901A/zh active Pending
- 2020-06-10 JP JP2021528133A patent/JP7284261B2/ja active Active
- 2020-06-10 KR KR1020217040469A patent/KR20220006617A/ko not_active Application Discontinuation
-
2021
- 2021-12-10 US US17/643,600 patent/US20220102186A1/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005033221A (ja) | 2001-02-08 | 2005-02-03 | Tokyo Electron Ltd | 基板載置台および処理装置 |
US20030047283A1 (en) | 2001-09-10 | 2003-03-13 | Applied Materials, Inc. | Apparatus for supporting a substrate and method of fabricating same |
JP2006287210A (ja) | 2005-03-07 | 2006-10-19 | Ngk Insulators Ltd | 静電チャック及びその製造方法 |
JP2011100844A (ja) | 2009-11-05 | 2011-05-19 | Shin-Etsu Chemical Co Ltd | 静電吸着機能を有する装置及びその製造方法 |
JP2015023168A (ja) | 2013-07-19 | 2015-02-02 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置、及びステージ製造方法 |
JP2018536287A (ja) | 2015-11-17 | 2018-12-06 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 堆積された表面フィーチャを有する基板支持アセンブリ |
Also Published As
Publication number | Publication date |
---|---|
WO2020261990A1 (ja) | 2020-12-30 |
CN114072901A (zh) | 2022-02-18 |
US20220102186A1 (en) | 2022-03-31 |
KR20220006617A (ko) | 2022-01-17 |
JPWO2020261990A1 (ja) | 2020-12-30 |
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