WO2000026995A1 - Structure de connexion de borne d'entree electrique - Google Patents

Structure de connexion de borne d'entree electrique Download PDF

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Publication number
WO2000026995A1
WO2000026995A1 PCT/JP1999/006037 JP9906037W WO0026995A1 WO 2000026995 A1 WO2000026995 A1 WO 2000026995A1 JP 9906037 W JP9906037 W JP 9906037W WO 0026995 A1 WO0026995 A1 WO 0026995A1
Authority
WO
WIPO (PCT)
Prior art keywords
ceramic solid
terminal
fitting member
hole
electric lead
Prior art date
Application number
PCT/JP1999/006037
Other languages
English (en)
Japanese (ja)
Inventor
Masanori Ono
Original Assignee
Applied Materials Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc. filed Critical Applied Materials Inc.
Priority to EP99951160A priority Critical patent/EP1126547A1/fr
Publication of WO2000026995A1 publication Critical patent/WO2000026995A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/62—Connections between conductors of different materials; Connections between or with aluminium or steel-core aluminium conductors

Definitions

  • the present invention relates to a structure in which a conductive element such as an electrode is embedded in a ceramic solid, such as a heater or an electrostatic chuck used in a semiconductor manufacturing apparatus or the like.
  • the present invention relates to a technique for connecting an introduction terminal.
  • ceramic ceramics in which electric heating elements (heaters) are embedded in ceramic solids, and electrostatic chucks in which electrodes are embedded in ceramic solids are used in many fields, including semiconductor manufacturing equipment.
  • an electricity introduction terminal 1 is fitted into a hole 3 provided in a ceramic solid 2 and a hole 3 is formed. It is in contact with the conductive element 4 exposed on the inner wall surface.
  • an electrostatic chuck or the like in a semiconductor manufacturing apparatus may be exposed to a high temperature environment of, for example, 600 ° C. or more.
  • a high temperature environment of, for example, 600 ° C. or more.
  • a difference in thermal expansion between the ceramic solid body and the electric lead-in terminal becomes a problem.
  • a refractory metal having a coefficient of thermal expansion close to that of a ceramic solid for example, tungsten (W), molybdenum (Mo), tantalum (Ta), or the like has been used. It is generally used.
  • refractory metals such as W, Mo, and Ta have low oxidation resistance, and there is a problem that the portion exposed from the ceramic solid is likely to deteriorate when exposed to the atmosphere.
  • the above problem of low oxidation resistance can be solved by using an electric lead-in terminal made of nickel-iron (Ni-Fe) alloy coated with nickel (Ni).
  • Ni-Fe nickel-iron
  • Ni nickel
  • this alloy has a sudden increase in thermal expansion coefficient from 400 ° C or higher. Therefore, when the temperature changes from a low temperature range to a high temperature range, a large thermal stress is generated between the ceramic solid and the electric introduction terminal due to a difference in thermal expansion, which may impair the reliability of the electrical connection.
  • an object of the present invention is to provide a means for reducing the thermal stress generated between a ceramic solid and an electric lead-in terminal. Disclosure of the invention
  • the present invention provides a connection structure of an electric lead-in terminal for connecting an electric lead-in terminal to a conductive element embedded in a ceramic solid, wherein a hole is provided in the ceramic solid so as to cross the conductive element.
  • the lead-in terminal is made of a high-melting-point metal having a thermal expansion coefficient close to that of a ceramic solid, and has substantially the same shape as the internal space of the hole.
  • a terminal member having: a fitting member fitted in the ceramic solid hole, and a conductive element exposed on the inner wall surface of the hole and the fitting member are electrically connected.
  • the terminal member is preferably made of a Ni-coated Ni-Fe alloy in consideration of oxidation resistance.
  • a male screw portion provided at one end of the fitting member or the terminal member, and a female screw portion provided at the other end of the fitting member or the terminal member. Can be considered. It is effective to interpose a conductive bonding agent between the male and female threads to reduce the electrical resistance.
  • a conductive bonding agent is interposed between the inner wall surface (the inner peripheral surface and the bottom surface) of the hole and the fitting member, and a boundary between the outer surface of the fitting member and the outer surface of the terminal member; By disposing a conductive bonding agent at the boundary between the boundary and the surface of the ceramic solid, the fitting member can be shielded from the atmosphere.
  • the conductive bonding agent is preferably a conductive brazing material such as silver brazing or copper brazing.
  • FIG. 1 is an enlarged cross-sectional view showing a conventional connection structure between an electric introduction terminal and an electrode.
  • FIG. 2 is a schematic diagram of a semiconductor manufacturing apparatus having an electrostatic chuck to which the present invention can be applied.
  • FIG. 3 is an enlarged cross-sectional view showing a connection structure between an electric lead-in terminal and an electrode in the electrostatic chuck of FIG. BEST MODE FOR CARRYING OUT THE INVENTION
  • FIG. 2 is a schematic view showing a semiconductor manufacturing apparatus 14 such as a CVD apparatus or a PVD apparatus in which an electrostatic chuck 10 to which the present invention can be applied is disposed in a processing chamber 12.
  • the electrostatic chuck 10 is used for holding and fixing the silicon wafer 16.
  • the electrostatic chuck 10 is basically composed of a ceramic solid 18 which is a dielectric, and an electrode film 20 disposed inside the ceramic solid 18 in parallel with the upper surface of the ceramic solid 18. It is based on the principle that a voltage is applied to 20 to induce charging of opposite polarity to the silicon wafer 16 and the electrode film 20. That is, the electrostatic attraction during the charging of the opposite polarity pulls the silicon wafer 16 against the electrostatic chuck 10, thereby fixing the silicon wafer 16.
  • the electrode film 20 is thin and located at a portion very close to the upper surface of the ceramic solid 18. Therefore, in the illustrated embodiment, the electric introduction terminal 22 is electrically connected to the electrode film 20 and is connected to the electrode 24 extending to the lower part of the ceramic solid 18.
  • FIG. 3 is an enlarged cross-sectional view clearly showing a connection structure between the electrode 24 embedded in the ceramic solid 18 and the electricity introducing terminal 22 in the electrostatic check 10 of FIG.
  • a hole 26 is formed in the ceramic solid 18 so as to penetrate the buried electrode 24 so that the electric lead-in terminal 22 is fitted into the hole 26. It has become.
  • the electric lead-in terminal 22 has substantially the same shape as the hole 26 and is fitted to the hole 26. And a terminal member 30 that enables connection to a connection terminal or the like (not shown) of a power supply circuit. Since the fitting member 28 has the same shape as the hole 26, there is no portion protruding from the surface (lower surface) of the ceramic solid 18. Further, the terminal member 60 is entirely disposed outside the surface (lower surface) of the ceramic solid 18.
  • the fitting member 28 is made of a refractory metal having a coefficient of thermal expansion close to that of the ceramic solid 18 such as W, Mo or Ta.
  • the terminal member 30 is made of a material having excellent chemical durability, for example, a Ni—Fe alloy, preferably Kovar (registered trademark) in terms of oxidation resistance, and more preferably Ni Consists of coated ones.
  • a male screw part 32 is formed at one end of the fitting member 28, and a female screw part 34 for receiving the male screw part 32 is formed at one end of the terminal member 30. And the terminal member 30 are connected.
  • the screw portion indicated by reference numeral 36 is for facilitating connection with a connection terminal (not shown) of a power supply circuit.
  • Such an electric lead-in terminal 22 is formed by sealing a suitable conductive bonding agent 38, for example, a conductive brazing material such as silver brazing or copper brazing, between the male screw member 32 and the female screw portion 34.
  • the terminal member 30 and the fitting member 28 are connected to each other. The reason why the conductive bonding agent 38 is interposed between the fitting member 28 and the terminal member 30 is to increase the contact area between the two members 28 and 30 and to reduce the electrical resistance as much as possible. is there.
  • the electric introduction terminal 22 is fitted and attached to the hole 26 formed in the ceramic solid 18. Only the fitting member 28 of the electric lead-in terminal 22 is located inside the hole 26, and the surface (lower surface) of the ceramic solid 18 and the end face of the fitting member 28 are almost flush with each other. . Furthermore, a suitable conductive bonding agent 40, for example, a conductive brazing material such as silver brazing or copper brazing, is provided between the fitting member 28 and the inner wall surface (inner peripheral surface and bottom surface) of the hole 26. Intervened. Thereby, the electrical connection between the electrode 24 buried in the ceramic solid 18 and exposed from the inner wall surface of the hole 26 and the fitting member 28 is reliably performed.
  • a suitable conductive bonding agent 40 for example, a conductive brazing material such as silver brazing or copper brazing
  • the same conductive bonding agent 42 as described above may be disposed on the boundary between the outer surface of the fitting member 28 and the outer surface of the terminal member 30 and on the surface of the ceramic solid 18 around the boundary. It is valid.
  • the bonding agent 42 completely covers the surface of the fitting member 28 in the hole 26 and functions as a protective film against oxidation and the like.
  • the terminal member 30 is coated with Ni, the bondability with the brazing material is improved.
  • a connection terminal of a power supply circuit (not shown) is connected to the screw portion 36 of the terminal member 30 and the power is turned on, a voltage is applied to the electrode film 20 via the electrode 24 and the electrostatic chuck 1
  • the silicon wafer 16 on 0 is electrostatically fixed.
  • the material of the terminal member 30 is a Ni—Fe alloy such as Kovar (registered trademark) coated with Ni, so that it is sufficiently resistant to oxidation and the like.
  • the present invention is not limited to the above embodiments.
  • the above-described embodiment is an example in which the present invention is applied to an electrostatic chuck.
  • the electric introduction terminal is connected to an electric heating element of a ceramic heater.
  • the present invention can be applied to such cases.
  • a thermal stress generated between the ceramic solid and the electric lead-in terminal can be reduced.
  • the reliability of connectivity can be improved.
  • the portion of the electric lead-in terminal exposed to the outside can have chemical durability, the durability against gas in the surrounding environment can be improved.
  • the present invention is particularly effective when applied to an electrostatic chuck or a heater used in an environment where heat fluctuation is large, such as a semiconductor manufacturing apparatus.

Landscapes

  • Resistance Heating (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Structure de connexion de borne d'entrée électrique destinée à la connexion d'une borne d'entrée électrique avec un élément conducteur enterré dans une structure solide en céramique dans laquelle est ménagé un trou qui traverse l'élément conducteur. La borne d'entrée électrique, qui est constituée d'un métal à point de fusion élevé dont le coefficient de dilatation thermique est proche de celui de la structure solide en céramique, comporte un élément de raccord dont la forme est pratiquement identique à celle de l'espace interne du trou et un élément résistant aux agents chimiques joint à l'élément de raccord. L'élément de raccord est introduit dans le trou ménagé dans la structure solide en céramique en vue de la connexion électrique avec l'élément conducteur mis à nu sur la surface de la paroi interne du trou. Dans la construction décrite, seul l'élément de raccord peut se trouver en contact avec la structure solide en céramique, ce qui réduit la contrainte thermique entre la borne d'entrée électrique et la structure solide en céramique.
PCT/JP1999/006037 1998-10-30 1999-10-29 Structure de connexion de borne d'entree electrique WO2000026995A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP99951160A EP1126547A1 (fr) 1998-10-30 1999-10-29 Structure de connexion de borne d'entree electrique

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10/310638 1998-10-30
JP10310638A JP3142520B2 (ja) 1998-10-30 1998-10-30 電気導入端子の接続構造

Publications (1)

Publication Number Publication Date
WO2000026995A1 true WO2000026995A1 (fr) 2000-05-11

Family

ID=18007671

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1999/006037 WO2000026995A1 (fr) 1998-10-30 1999-10-29 Structure de connexion de borne d'entree electrique

Country Status (3)

Country Link
EP (1) EP1126547A1 (fr)
JP (1) JP3142520B2 (fr)
WO (1) WO2000026995A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004030411A1 (fr) * 2002-09-27 2004-04-08 Sumitomo Electric Industries, Ltd. Support de tranches et systeme de fabrication de semi-conducteurs
JP2007157661A (ja) * 2005-12-08 2007-06-21 Shin Etsu Chem Co Ltd セラミックスヒーターおよびセラミックスヒーターの製造方法
JP2007250403A (ja) * 2006-03-17 2007-09-27 Shin Etsu Chem Co Ltd セラミックスヒーターおよびヒーター給電部品

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6326981A (ja) * 1986-07-19 1988-02-04 株式会社デンソー セラミツク質発熱体と金属製電極との接合方法
US4803345A (en) * 1986-07-11 1989-02-07 Nippondenso Co., Ltd. Ceramic heater apparatus with metal electrodes
JPH0221586A (ja) * 1988-07-08 1990-01-24 Hitachi Ltd 摺動集電体
US5306895A (en) * 1991-03-26 1994-04-26 Ngk Insulators, Ltd. Corrosion-resistant member for chemical apparatus using halogen series corrosive gas

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4803345A (en) * 1986-07-11 1989-02-07 Nippondenso Co., Ltd. Ceramic heater apparatus with metal electrodes
JPS6326981A (ja) * 1986-07-19 1988-02-04 株式会社デンソー セラミツク質発熱体と金属製電極との接合方法
JPH0221586A (ja) * 1988-07-08 1990-01-24 Hitachi Ltd 摺動集電体
US5306895A (en) * 1991-03-26 1994-04-26 Ngk Insulators, Ltd. Corrosion-resistant member for chemical apparatus using halogen series corrosive gas

Also Published As

Publication number Publication date
EP1126547A1 (fr) 2001-08-22
JP3142520B2 (ja) 2001-03-07
JP2000133339A (ja) 2000-05-12

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