KR102593949B1 - 이미지 센서 - Google Patents

이미지 센서 Download PDF

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Publication number
KR102593949B1
KR102593949B1 KR1020180086453A KR20180086453A KR102593949B1 KR 102593949 B1 KR102593949 B1 KR 102593949B1 KR 1020180086453 A KR1020180086453 A KR 1020180086453A KR 20180086453 A KR20180086453 A KR 20180086453A KR 102593949 B1 KR102593949 B1 KR 102593949B1
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South Korea
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photoelectric conversion
openings
image sensor
conversion elements
color filter
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KR1020180086453A
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English (en)
Korean (ko)
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KR20200011689A (ko
Inventor
이윤기
김범석
박종훈
박준성
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삼성전자주식회사
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Priority to KR1020180086453A priority Critical patent/KR102593949B1/ko
Priority to US16/400,094 priority patent/US11031424B2/en
Priority to CN201910640080.XA priority patent/CN110783352A/zh
Priority to JP2019136021A priority patent/JP7291561B2/ja
Publication of KR20200011689A publication Critical patent/KR20200011689A/ko
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    • H01L27/14645
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/182Colour image sensors
    • H01L27/14621
    • H01L27/14623
    • H01L27/14627
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/805Coatings
    • H10F39/8053Colour filters
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/805Coatings
    • H10F39/8057Optical shielding
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/806Optical elements or arrangements associated with the image sensors
    • H10F39/8063Microlenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/807Pixel isolation structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/40Optical elements or arrangements
    • H10F77/42Optical elements or arrangements directly associated or integrated with photovoltaic cells, e.g. light-reflecting means or light-concentrating means
    • H10F77/484Refractive light-concentrating means, e.g. lenses
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/52PV systems with concentrators

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Color Television Image Signal Generators (AREA)
KR1020180086453A 2018-07-25 2018-07-25 이미지 센서 Active KR102593949B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020180086453A KR102593949B1 (ko) 2018-07-25 2018-07-25 이미지 센서
US16/400,094 US11031424B2 (en) 2018-07-25 2019-05-01 Image sensor with selective light-shielding for reference pixels
CN201910640080.XA CN110783352A (zh) 2018-07-25 2019-07-16 具有用于参考像素的选择性光屏蔽的图像传感器
JP2019136021A JP7291561B2 (ja) 2018-07-25 2019-07-24 イメージセンサー

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020180086453A KR102593949B1 (ko) 2018-07-25 2018-07-25 이미지 센서

Publications (2)

Publication Number Publication Date
KR20200011689A KR20200011689A (ko) 2020-02-04
KR102593949B1 true KR102593949B1 (ko) 2023-10-27

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US (1) US11031424B2 (enExample)
JP (1) JP7291561B2 (enExample)
KR (1) KR102593949B1 (enExample)
CN (1) CN110783352A (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102577844B1 (ko) * 2016-08-09 2023-09-15 삼성전자주식회사 이미지 센서
KR102523851B1 (ko) * 2018-07-31 2023-04-21 에스케이하이닉스 주식회사 더미 픽셀들을 포함하는 이미지 센싱 장치
KR102677769B1 (ko) * 2018-12-20 2024-06-24 삼성전자주식회사 후면조사형 이미지 센서 및 이를 포함하는 전자 기기
KR102386104B1 (ko) 2018-12-21 2022-04-13 삼성전자주식회사 후면조사형 이미지 센서 및 이를 포함하는 전자 기기
US11475699B2 (en) 2020-01-22 2022-10-18 Asti Global Inc., Taiwan Display module and image display thereof
KR20210121852A (ko) * 2020-03-31 2021-10-08 에스케이하이닉스 주식회사 이미지 센싱 장치
KR102872412B1 (ko) 2020-04-28 2025-10-17 삼성디스플레이 주식회사 지문 센서와 그를 포함한 표시 장치
US12046071B2 (en) * 2020-05-08 2024-07-23 Visera Technologies Company Limited Optical imaging device
CN113764441B (zh) * 2020-06-03 2025-09-12 格科微电子(上海)有限公司 光学指纹器件
US11276793B2 (en) * 2020-06-04 2022-03-15 Visera Technologies Company Limited Semiconductor device
US20230230413A1 (en) * 2020-06-25 2023-07-20 Sony Semiconductor Solutions Corporation Electronic device
JP7633006B2 (ja) * 2020-07-27 2025-02-19 株式会社ジャパンディスプレイ 検出装置
CN113671525A (zh) * 2020-09-11 2021-11-19 神盾股份有限公司 Tof光学感测模块
CN116325780B (zh) * 2020-11-19 2024-06-11 华为技术有限公司 固态成像设备
CN114582256A (zh) * 2020-12-02 2022-06-03 台湾爱司帝科技股份有限公司 显示模块及其图像显示器
KR102805366B1 (ko) 2021-01-26 2025-05-12 삼성전자주식회사 광전 변환 소자
CN114823742A (zh) * 2021-01-27 2022-07-29 群创光电股份有限公司 感测装置以及电子装置
US11985438B2 (en) * 2021-03-18 2024-05-14 Taiwan Semiconductor Manufacturing Company, Ltd. Pixel array including dark pixel sensors
KR102872018B1 (ko) * 2021-03-23 2025-10-17 에스케이하이닉스 주식회사 이미지 센싱 장치
WO2022198681A1 (zh) 2021-03-26 2022-09-29 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
JP7610464B2 (ja) * 2021-04-28 2025-01-08 株式会社ジャパンディスプレイ 検出装置
TWI811854B (zh) * 2021-07-23 2023-08-11 友達光電股份有限公司 光學感測裝置
JP2025041357A (ja) * 2023-09-13 2025-03-26 ソニーセミコンダクタソリューションズ株式会社 撮像素子及び撮像装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008205940A (ja) * 2007-02-21 2008-09-04 Sony Corp 固体撮像装置および撮像装置
JP2017157804A (ja) * 2016-03-04 2017-09-07 キヤノン株式会社 撮像装置

Family Cites Families (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3159171B2 (ja) * 1998-06-05 2001-04-23 日本電気株式会社 固体撮像装置
JP3204216B2 (ja) * 1998-06-24 2001-09-04 日本電気株式会社 固体撮像装置およびその製造方法
JP4419238B2 (ja) * 1999-12-27 2010-02-24 ソニー株式会社 固体撮像素子及びその製造方法
JP4806197B2 (ja) * 2005-01-17 2011-11-02 パナソニック株式会社 固体撮像装置
US7719040B2 (en) * 2005-08-03 2010-05-18 Panasonic Corporation Solid-state imaging device
JP2007123414A (ja) 2005-10-26 2007-05-17 Fujifilm Corp 固体撮像素子
US7781715B2 (en) * 2006-09-20 2010-08-24 Fujifilm Corporation Backside illuminated imaging device, semiconductor substrate, imaging apparatus and method for manufacturing backside illuminated imaging device
JP5374916B2 (ja) 2008-04-23 2013-12-25 ソニー株式会社 固体撮像素子及びその製造方法、カメラ
KR100914785B1 (ko) * 2007-12-26 2009-08-31 엘지디스플레이 주식회사 액정표시장치
JP4735643B2 (ja) * 2007-12-28 2011-07-27 ソニー株式会社 固体撮像装置、カメラ及び電子機器
US8482639B2 (en) 2008-02-08 2013-07-09 Omnivision Technologies, Inc. Black reference pixel for backside illuminated image sensor
JP2009218341A (ja) * 2008-03-10 2009-09-24 Panasonic Corp 固体撮像装置とその製造方法
JP2010192705A (ja) * 2009-02-18 2010-09-02 Sony Corp 固体撮像装置、電子機器、および、その製造方法
JP5436114B2 (ja) 2009-09-18 2014-03-05 キヤノン株式会社 撮像システム
JP2012054321A (ja) * 2010-08-31 2012-03-15 Sony Corp 固体撮像素子及びその製造方法、並びに固体撮像装置及び撮像装置
JP5736755B2 (ja) * 2010-12-09 2015-06-17 ソニー株式会社 固体撮像装置とその製造方法、及び電子機器
JP5783741B2 (ja) * 2011-02-09 2015-09-24 キヤノン株式会社 固体撮像装置、及び固体撮像装置の製造方法
JP5742348B2 (ja) * 2011-03-23 2015-07-01 セイコーエプソン株式会社 撮像装置
JP2012222483A (ja) 2011-04-06 2012-11-12 Seiko Epson Corp センシング装置および電子機器
JP2012222484A (ja) 2011-04-06 2012-11-12 Seiko Epson Corp センシング装置および電子機器
JP6029266B2 (ja) * 2011-08-09 2016-11-24 キヤノン株式会社 撮像装置、撮像システムおよび撮像装置の製造方法
JP5950514B2 (ja) * 2011-08-12 2016-07-13 キヤノン株式会社 光電変換装置の製造方法
US8610234B2 (en) 2011-09-02 2013-12-17 Hoon Kim Unit pixel of image sensor and photo detector thereof
JP2013077740A (ja) * 2011-09-30 2013-04-25 Sony Corp 固体撮像素子、固体撮像素子の製造方法、及び、電子機器
JP5774502B2 (ja) * 2012-01-12 2015-09-09 株式会社東芝 固体撮像装置
JP5963448B2 (ja) 2012-01-13 2016-08-03 キヤノン株式会社 撮像装置
JP2013157442A (ja) * 2012-01-30 2013-08-15 Nikon Corp 撮像素子および焦点検出装置
JP6095268B2 (ja) * 2012-02-24 2017-03-15 キヤノン株式会社 固体撮像装置、及び撮像システム
JP6188679B2 (ja) * 2012-02-29 2017-08-30 江藤 剛治 固体撮像装置
KR101975028B1 (ko) * 2012-06-18 2019-08-23 삼성전자주식회사 이미지 센서
KR102129147B1 (ko) * 2012-06-29 2020-07-01 소니 세미컨덕터 솔루션즈 가부시키가이샤 고체 촬상 소자, 고체 촬상 소자의 제조 방법, 및, 전자기기
KR20140010553A (ko) 2012-07-13 2014-01-27 삼성전자주식회사 픽셀 어레이, 이를 포함하는 이미지 센서, 및 상기 이미지 센서의 로컬 다크 전류 보상 방법
JP6007694B2 (ja) * 2012-09-14 2016-10-12 ソニー株式会社 固体撮像装置及び電子機器
US9224782B2 (en) 2013-04-19 2015-12-29 Semiconductor Components Industries, Llc Imaging systems with reference pixels for image flare mitigation
JP6103301B2 (ja) * 2013-07-03 2017-03-29 ソニー株式会社 固体撮像装置およびその製造方法、並びに電子機器
JP6303803B2 (ja) * 2013-07-03 2018-04-04 ソニー株式会社 固体撮像装置およびその製造方法
JP2015029011A (ja) * 2013-07-30 2015-02-12 ソニー株式会社 固体撮像装置およびその製造方法、並びに電子機器
JP2015060855A (ja) * 2013-09-17 2015-03-30 ソニー株式会社 固体撮像装置およびその製造方法、並びに電子機器
CN105594198B (zh) 2013-10-02 2019-05-10 株式会社尼康 摄像元件以及摄像装置
CN106537890A (zh) * 2014-07-16 2017-03-22 索尼公司 复眼摄像装置
US9479745B2 (en) 2014-09-19 2016-10-25 Omnivision Technologies, Inc. Color filter array with reference pixel to reduce spectral crosstalk
JP6576025B2 (ja) * 2014-09-29 2019-09-18 キヤノン株式会社 光電変換装置、及び撮像システム
KR102410088B1 (ko) * 2014-12-11 2022-06-20 삼성전자주식회사 이미지 센서
US9829614B2 (en) 2015-02-02 2017-11-28 Synaptics Incorporated Optical sensor using collimator
US10181070B2 (en) 2015-02-02 2019-01-15 Synaptics Incorporated Low profile illumination in an optical fingerprint sensor
US10410033B2 (en) 2015-06-18 2019-09-10 Shenzhen GOODIX Technology Co., Ltd. Under-LCD screen optical sensor module for on-screen fingerprint sensing
US10042324B2 (en) 2015-06-30 2018-08-07 Synaptics Incorporated Optical fingerprint imaging using holography
JP2017038311A (ja) 2015-08-12 2017-02-16 株式会社東芝 固体撮像装置
WO2017045130A1 (en) 2015-09-15 2017-03-23 Shanghai Oxi Technology Co., Ltd Optical fingerprint imaging system and array sensor
US10185866B2 (en) 2015-09-18 2019-01-22 Synaptics Incorporated Optical fingerprint sensor package
WO2017073321A1 (ja) 2015-10-26 2017-05-04 ソニー株式会社 固体撮像装置およびその製造方法、並びに電子機器
KR101923335B1 (ko) 2015-11-02 2019-02-27 선전 구딕스 테크놀로지 컴퍼니, 리미티드 지문 위조 방지 광 감지를 갖는 다기능 지문 센서
US9934418B2 (en) 2015-12-03 2018-04-03 Synaptics Incorporated Display integrated optical fingerprint sensor with angle limiting reflector
US10169630B2 (en) 2015-12-03 2019-01-01 Synaptics Incorporated Optical sensor for integration over a display backplane
US10176355B2 (en) 2015-12-03 2019-01-08 Synaptics Incorporated Optical sensor for integration in a display
US10229316B2 (en) 2016-01-29 2019-03-12 Synaptics Incorporated Compound collimating system using apertures and collimators
US10282579B2 (en) 2016-01-29 2019-05-07 Synaptics Incorporated Initiating fingerprint capture with a touch screen
US9947700B2 (en) * 2016-02-03 2018-04-17 Semiconductor Energy Laboratory Co., Ltd. Imaging device and electronic device
WO2017159025A1 (ja) * 2016-03-15 2017-09-21 ソニー株式会社 光電変換素子および固体撮像装置
JP2017175102A (ja) * 2016-03-16 2017-09-28 ソニー株式会社 光電変換素子及びその製造方法並びに撮像装置
US10289891B2 (en) 2016-03-31 2019-05-14 Synaptics Incorpated Optical biometric sensor having diffractive optical elements
US10083338B2 (en) 2016-07-25 2018-09-25 Idspire Corporation Ltd. Optical fingerprint sensor with prism module
KR102577844B1 (ko) * 2016-08-09 2023-09-15 삼성전자주식회사 이미지 센서
US10380395B2 (en) 2016-09-30 2019-08-13 Synaptics Incorporated Optical sensor with angled reflectors
KR102654485B1 (ko) * 2016-12-30 2024-04-03 삼성전자주식회사 이미지 센서 및 그 제조 방법
KR102635858B1 (ko) * 2017-01-05 2024-02-15 삼성전자주식회사 이미지 센서
KR102350605B1 (ko) * 2017-04-17 2022-01-14 삼성전자주식회사 이미지 센서
JP2017188955A (ja) 2017-07-11 2017-10-12 株式会社ニコン 撮像素子および撮像装置
JP2019041142A (ja) * 2017-08-22 2019-03-14 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、固体撮像素子の製造方法、及び電子機器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008205940A (ja) * 2007-02-21 2008-09-04 Sony Corp 固体撮像装置および撮像装置
JP2017157804A (ja) * 2016-03-04 2017-09-07 キヤノン株式会社 撮像装置

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JP7291561B2 (ja) 2023-06-15
CN110783352A (zh) 2020-02-11
US11031424B2 (en) 2021-06-08
KR20200011689A (ko) 2020-02-04
US20200035729A1 (en) 2020-01-30
JP2020017955A (ja) 2020-01-30

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