KR102593949B1 - 이미지 센서 - Google Patents
이미지 센서 Download PDFInfo
- Publication number
- KR102593949B1 KR102593949B1 KR1020180086453A KR20180086453A KR102593949B1 KR 102593949 B1 KR102593949 B1 KR 102593949B1 KR 1020180086453 A KR1020180086453 A KR 1020180086453A KR 20180086453 A KR20180086453 A KR 20180086453A KR 102593949 B1 KR102593949 B1 KR 102593949B1
- Authority
- KR
- South Korea
- Prior art keywords
- photoelectric conversion
- openings
- image sensor
- conversion elements
- color filter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H01L27/14645—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/182—Colour image sensors
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- H01L27/14621—
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- H01L27/14623—
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- H01L27/14627—
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8053—Colour filters
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8057—Optical shielding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
- H10F39/8063—Microlenses
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/807—Pixel isolation structures
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
- H10F77/42—Optical elements or arrangements directly associated or integrated with photovoltaic cells, e.g. light-reflecting means or light-concentrating means
- H10F77/484—Refractive light-concentrating means, e.g. lenses
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/52—PV systems with concentrators
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Color Television Image Signal Generators (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020180086453A KR102593949B1 (ko) | 2018-07-25 | 2018-07-25 | 이미지 센서 |
| US16/400,094 US11031424B2 (en) | 2018-07-25 | 2019-05-01 | Image sensor with selective light-shielding for reference pixels |
| CN201910640080.XA CN110783352A (zh) | 2018-07-25 | 2019-07-16 | 具有用于参考像素的选择性光屏蔽的图像传感器 |
| JP2019136021A JP7291561B2 (ja) | 2018-07-25 | 2019-07-24 | イメージセンサー |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020180086453A KR102593949B1 (ko) | 2018-07-25 | 2018-07-25 | 이미지 센서 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20200011689A KR20200011689A (ko) | 2020-02-04 |
| KR102593949B1 true KR102593949B1 (ko) | 2023-10-27 |
Family
ID=69178676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020180086453A Active KR102593949B1 (ko) | 2018-07-25 | 2018-07-25 | 이미지 센서 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11031424B2 (enExample) |
| JP (1) | JP7291561B2 (enExample) |
| KR (1) | KR102593949B1 (enExample) |
| CN (1) | CN110783352A (enExample) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102577844B1 (ko) * | 2016-08-09 | 2023-09-15 | 삼성전자주식회사 | 이미지 센서 |
| KR102523851B1 (ko) * | 2018-07-31 | 2023-04-21 | 에스케이하이닉스 주식회사 | 더미 픽셀들을 포함하는 이미지 센싱 장치 |
| KR102677769B1 (ko) * | 2018-12-20 | 2024-06-24 | 삼성전자주식회사 | 후면조사형 이미지 센서 및 이를 포함하는 전자 기기 |
| KR102386104B1 (ko) | 2018-12-21 | 2022-04-13 | 삼성전자주식회사 | 후면조사형 이미지 센서 및 이를 포함하는 전자 기기 |
| US11475699B2 (en) | 2020-01-22 | 2022-10-18 | Asti Global Inc., Taiwan | Display module and image display thereof |
| KR20210121852A (ko) * | 2020-03-31 | 2021-10-08 | 에스케이하이닉스 주식회사 | 이미지 센싱 장치 |
| KR102872412B1 (ko) | 2020-04-28 | 2025-10-17 | 삼성디스플레이 주식회사 | 지문 센서와 그를 포함한 표시 장치 |
| US12046071B2 (en) * | 2020-05-08 | 2024-07-23 | Visera Technologies Company Limited | Optical imaging device |
| CN113764441B (zh) * | 2020-06-03 | 2025-09-12 | 格科微电子(上海)有限公司 | 光学指纹器件 |
| US11276793B2 (en) * | 2020-06-04 | 2022-03-15 | Visera Technologies Company Limited | Semiconductor device |
| US20230230413A1 (en) * | 2020-06-25 | 2023-07-20 | Sony Semiconductor Solutions Corporation | Electronic device |
| JP7633006B2 (ja) * | 2020-07-27 | 2025-02-19 | 株式会社ジャパンディスプレイ | 検出装置 |
| CN113671525A (zh) * | 2020-09-11 | 2021-11-19 | 神盾股份有限公司 | Tof光学感测模块 |
| CN116325780B (zh) * | 2020-11-19 | 2024-06-11 | 华为技术有限公司 | 固态成像设备 |
| CN114582256A (zh) * | 2020-12-02 | 2022-06-03 | 台湾爱司帝科技股份有限公司 | 显示模块及其图像显示器 |
| KR102805366B1 (ko) | 2021-01-26 | 2025-05-12 | 삼성전자주식회사 | 광전 변환 소자 |
| CN114823742A (zh) * | 2021-01-27 | 2022-07-29 | 群创光电股份有限公司 | 感测装置以及电子装置 |
| US11985438B2 (en) * | 2021-03-18 | 2024-05-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pixel array including dark pixel sensors |
| KR102872018B1 (ko) * | 2021-03-23 | 2025-10-17 | 에스케이하이닉스 주식회사 | 이미지 센싱 장치 |
| WO2022198681A1 (zh) | 2021-03-26 | 2022-09-29 | 深圳市汇顶科技股份有限公司 | 指纹识别装置和电子设备 |
| JP7610464B2 (ja) * | 2021-04-28 | 2025-01-08 | 株式会社ジャパンディスプレイ | 検出装置 |
| TWI811854B (zh) * | 2021-07-23 | 2023-08-11 | 友達光電股份有限公司 | 光學感測裝置 |
| JP2025041357A (ja) * | 2023-09-13 | 2025-03-26 | ソニーセミコンダクタソリューションズ株式会社 | 撮像素子及び撮像装置 |
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| JP2017157804A (ja) * | 2016-03-04 | 2017-09-07 | キヤノン株式会社 | 撮像装置 |
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| KR102350605B1 (ko) * | 2017-04-17 | 2022-01-14 | 삼성전자주식회사 | 이미지 센서 |
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2018
- 2018-07-25 KR KR1020180086453A patent/KR102593949B1/ko active Active
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2019
- 2019-05-01 US US16/400,094 patent/US11031424B2/en active Active
- 2019-07-16 CN CN201910640080.XA patent/CN110783352A/zh active Pending
- 2019-07-24 JP JP2019136021A patent/JP7291561B2/ja active Active
Patent Citations (2)
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| JP2008205940A (ja) * | 2007-02-21 | 2008-09-04 | Sony Corp | 固体撮像装置および撮像装置 |
| JP2017157804A (ja) * | 2016-03-04 | 2017-09-07 | キヤノン株式会社 | 撮像装置 |
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| Publication number | Publication date |
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| JP7291561B2 (ja) | 2023-06-15 |
| CN110783352A (zh) | 2020-02-11 |
| US11031424B2 (en) | 2021-06-08 |
| KR20200011689A (ko) | 2020-02-04 |
| US20200035729A1 (en) | 2020-01-30 |
| JP2020017955A (ja) | 2020-01-30 |
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