JP2007123414A - 固体撮像素子 - Google Patents
固体撮像素子 Download PDFInfo
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- JP2007123414A JP2007123414A JP2005311358A JP2005311358A JP2007123414A JP 2007123414 A JP2007123414 A JP 2007123414A JP 2005311358 A JP2005311358 A JP 2005311358A JP 2005311358 A JP2005311358 A JP 2005311358A JP 2007123414 A JP2007123414 A JP 2007123414A
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- 239000007787 solid Substances 0.000 title abstract 3
- 238000003384 imaging method Methods 0.000 claims description 37
- 238000001514 detection method Methods 0.000 claims description 23
- 238000006243 chemical reaction Methods 0.000 claims description 12
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 3
- 238000012546 transfer Methods 0.000 description 17
- 239000010410 layer Substances 0.000 description 15
- 238000012937 correction Methods 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 239000002784 hot electron Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
- H04N25/63—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to dark current
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14623—Optical shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14645—Colour imagers
- H01L27/14647—Multicolour imagers having a stacked pixel-element structure, e.g. npn, npnpn or MQW elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
- H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
- H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
- H04N25/134—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements based on three different wavelength filter elements
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
- H04N25/67—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to fixed-pattern noise, e.g. non-uniformity of response
- H04N25/671—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to fixed-pattern noise, e.g. non-uniformity of response for non-uniformity detection or correction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
- H01L27/14831—Area CCD imagers
- H01L27/14837—Frame-interline transfer
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
- H04N25/68—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to defects
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
- H04N25/68—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to defects
- H04N25/69—SSIS comprising testing or correcting structures for circuits other than pixel cells
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
【解決手段】本発明の固体撮像素子は、フォトダイオード30を含む画素部を多数有する固体撮像素子であって、多数の画素部の一部が黒レベル検出用の画素部であり、黒レベル検出用の画素部は、多数の画素部が配置される領域内で点在するように配置されている。
【選択図】図2
Description
図1は、本発明の実施形態を説明するための固体撮像素子の平面模式図である。図2は、図1のA−A線断面模式図である。
図1,2に示す固体撮像素子は、n型のシリコン基板1表面部に光電変換素子であるフォトダイオード30が多数形成され、各フォトダイオード30で発生した信号電荷を列方向(図1中のY方向)に転送するための電荷転送部(図示せず)が、列方向に配設された複数のフォトダイオード30からなる複数のフォトダイオード列の間を蛇行して形成される。
2 pウェル層
3 電荷転送電極
5 開口部
6 遮光膜
7 絶縁膜
8 層内レンズ
9 平坦化層
10B,10G カラーフィルタ
11 マイクロレンズ
30 フォトダイオード
Claims (6)
- 光電変換素子を含む画素部を多数有する固体撮像素子であって、
前記多数の画素部の一部が黒レベル検出用の画素部であり、
前記黒レベル検出用の画素部は、前記多数の画素部が配置される領域内で点在するように配置されている固体撮像素子。 - 請求項1記載の固体撮像素子であって、
前記多数の画素部は、それぞれ前記光電変換素子に入射する光を制限する開口部を含み、
前記黒レベル検出用の画素部は、前記開口部を塞いだものである固体撮像素子。 - 請求項2記載の固体撮像素子であって、
前記多数の画素部は、それぞれ前記光電変換素子に光を集光するマイクロレンズを含み、
前記黒レベル検出用の画素部は、前記マイクロレンズを省略したものである固体撮像素子。 - 請求項2又は3記載の固体撮像素子であって、
前記多数の画素部は、それぞれ前記光電変換素子に光を集光する層内レンズを含み、
前記黒レベル検出用の画素部は、前記層内レンズを省略したものである固体撮像素子。 - 請求項2〜4のいずれか記載の固体撮像素子であって、
前記黒レベル検出用の画素部は、前記塞がれた開口部の上方に周辺回路を構成する材料の膜を残したものである固体撮像素子。 - 請求項1〜5のいずれか記載の固体撮像素子であって、
前記黒レベル検出用の画素部は、前記光電変換素子から読み出されて転送された電荷に応じた信号を出力する出力アンプの近傍に相対的に多く配置される固体撮像素子。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005311358A JP2007123414A (ja) | 2005-10-26 | 2005-10-26 | 固体撮像素子 |
US11/585,822 US20070097227A1 (en) | 2005-10-26 | 2006-10-25 | Solid-state imaging device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005311358A JP2007123414A (ja) | 2005-10-26 | 2005-10-26 | 固体撮像素子 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2007123414A true JP2007123414A (ja) | 2007-05-17 |
Family
ID=37995743
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005311358A Abandoned JP2007123414A (ja) | 2005-10-26 | 2005-10-26 | 固体撮像素子 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20070097227A1 (ja) |
JP (1) | JP2007123414A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009089219A (ja) * | 2007-10-02 | 2009-04-23 | Olympus Corp | 固体撮像素子及びそれを用いた固体撮像システム |
JP2009177402A (ja) * | 2008-01-23 | 2009-08-06 | Fujifilm Corp | 撮像装置及びその撮像画像信号補正方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7910961B2 (en) * | 2008-10-08 | 2011-03-22 | Omnivision Technologies, Inc. | Image sensor with low crosstalk and high red sensitivity |
US20120320627A1 (en) | 2011-05-17 | 2012-12-20 | Pixi Lighting Llc | Flat panel lighting device and driving circuitry |
US9476552B2 (en) | 2013-04-17 | 2016-10-25 | Pixi Lighting, Inc. | LED light fixture and assembly method therefor |
US9500328B2 (en) | 2013-04-17 | 2016-11-22 | Pixi Lighting, Inc. | Lighting assembly |
US9546781B2 (en) | 2013-04-17 | 2017-01-17 | Ever Venture Solutions, Inc. | Field-serviceable flat panel lighting device |
US9557022B2 (en) | 2015-04-30 | 2017-01-31 | Ever Venture Solutions, Inc. | Non-round retrofit recessed LED lighting fixture |
KR102593949B1 (ko) | 2018-07-25 | 2023-10-27 | 삼성전자주식회사 | 이미지 센서 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0434977A (ja) * | 1990-05-31 | 1992-02-05 | Sony Corp | 固体撮像素子 |
JPH06151802A (ja) * | 1992-11-13 | 1994-05-31 | Sony Corp | 固体撮像装置のアルミニウム系金属パターンの形成方法 |
JPH0787284A (ja) * | 1993-09-17 | 1995-03-31 | Fuji Xerox Co Ltd | 2次元イメ−ジセンサ及び画素信号の補間方法 |
JPH11126894A (ja) * | 1997-08-12 | 1999-05-11 | Hewlett Packard Co <Hp> | Cmosイメージセンサの暗電流補正方法 |
JP2004015712A (ja) * | 2002-06-11 | 2004-01-15 | Sony Corp | 固体撮像装置及びその固定パターン雑音除去方法 |
JP2004120723A (ja) * | 2002-09-26 | 2004-04-15 | Honda Motor Co Ltd | イメージセンサ |
JP2004153677A (ja) * | 2002-10-31 | 2004-05-27 | Canon Inc | 撮像装置 |
JP2004222021A (ja) * | 2003-01-16 | 2004-08-05 | Nikon Corp | 撮像装置 |
JP2005012189A (ja) * | 2003-05-28 | 2005-01-13 | Canon Inc | 光電変換装置およびその製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6525769B1 (en) * | 1998-12-30 | 2003-02-25 | Intel Corporation | Method and apparatus to compensate for dark current in an imaging device |
US6888568B1 (en) * | 1999-08-19 | 2005-05-03 | Dialog Semiconductor Gmbh | Method and apparatus for controlling pixel sensor elements |
JP2002250860A (ja) * | 2001-02-26 | 2002-09-06 | Canon Inc | 撮像素子、撮像装置及び情報処理装置 |
JP4123415B2 (ja) * | 2002-05-20 | 2008-07-23 | ソニー株式会社 | 固体撮像装置 |
JP4018456B2 (ja) * | 2002-06-03 | 2007-12-05 | 富士フイルム株式会社 | 撮像装置 |
JP4782989B2 (ja) * | 2004-05-10 | 2011-09-28 | パナソニック株式会社 | 固体撮像装置 |
-
2005
- 2005-10-26 JP JP2005311358A patent/JP2007123414A/ja not_active Abandoned
-
2006
- 2006-10-25 US US11/585,822 patent/US20070097227A1/en not_active Abandoned
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0434977A (ja) * | 1990-05-31 | 1992-02-05 | Sony Corp | 固体撮像素子 |
JPH06151802A (ja) * | 1992-11-13 | 1994-05-31 | Sony Corp | 固体撮像装置のアルミニウム系金属パターンの形成方法 |
JPH0787284A (ja) * | 1993-09-17 | 1995-03-31 | Fuji Xerox Co Ltd | 2次元イメ−ジセンサ及び画素信号の補間方法 |
JPH11126894A (ja) * | 1997-08-12 | 1999-05-11 | Hewlett Packard Co <Hp> | Cmosイメージセンサの暗電流補正方法 |
JP2004015712A (ja) * | 2002-06-11 | 2004-01-15 | Sony Corp | 固体撮像装置及びその固定パターン雑音除去方法 |
JP2004120723A (ja) * | 2002-09-26 | 2004-04-15 | Honda Motor Co Ltd | イメージセンサ |
JP2004153677A (ja) * | 2002-10-31 | 2004-05-27 | Canon Inc | 撮像装置 |
JP2004222021A (ja) * | 2003-01-16 | 2004-08-05 | Nikon Corp | 撮像装置 |
JP2005012189A (ja) * | 2003-05-28 | 2005-01-13 | Canon Inc | 光電変換装置およびその製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009089219A (ja) * | 2007-10-02 | 2009-04-23 | Olympus Corp | 固体撮像素子及びそれを用いた固体撮像システム |
US8610802B2 (en) | 2007-10-02 | 2013-12-17 | Olympus Corporation | Solid-state imaging device with noise extracing pixels in the effective pixel region and solid-state imaging system using the same |
JP2009177402A (ja) * | 2008-01-23 | 2009-08-06 | Fujifilm Corp | 撮像装置及びその撮像画像信号補正方法 |
US8269871B2 (en) | 2008-01-23 | 2012-09-18 | Fujifilm Corporation | Image pickup apparatus and method of correcting a picked-up image signal of the same |
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US20070097227A1 (en) | 2007-05-03 |
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