JP4659788B2 - 裏面照射型撮像素子 - Google Patents
裏面照射型撮像素子 Download PDFInfo
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- JP4659788B2 JP4659788B2 JP2007165018A JP2007165018A JP4659788B2 JP 4659788 B2 JP4659788 B2 JP 4659788B2 JP 2007165018 A JP2007165018 A JP 2007165018A JP 2007165018 A JP2007165018 A JP 2007165018A JP 4659788 B2 JP4659788 B2 JP 4659788B2
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- charge storage
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- image sensor
- semiconductor substrate
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- 238000003860 storage Methods 0.000 claims description 67
- 239000000758 substrate Substances 0.000 claims description 42
- 238000009825 accumulation Methods 0.000 claims description 26
- 239000004065 semiconductor Substances 0.000 claims description 23
- 238000003384 imaging method Methods 0.000 claims description 14
- 230000000875 corresponding effect Effects 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 238000005286 illumination Methods 0.000 claims description 8
- 230000002596 correlated effect Effects 0.000 claims description 3
- 230000003595 spectral effect Effects 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1464—Back illuminated imager structures
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
- H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
- H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
- H04N25/133—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements including elements passing panchromatic light, e.g. filters passing white light
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
- H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
- H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
- H04N25/135—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements based on four or more different wavelength filter elements
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
図1に示す裏面照射型撮像素子は、半導体基板内の行方向Xとこれに直交する列方向Yに正方格子状に配列された多数の電荷蓄積領域(6r,6g,6b)からなる第1のグループと、半導体基板内の行方向Xと列方向Yに正方格子状に配列された多数の電荷蓄積領域(6w)からなる第2のグループとを備える。第1のグループを構成する電荷蓄積領域と第2のグループを構成する電荷蓄積領域との数は同一となっている。
図2に示すように、裏面照射型撮像素子は、p型のシリコンからなるp型の半導体基板(以下、p基板という)4を備える。この裏面照射型撮像素子は、図中下方から上方に向かって光を入射させて撮像を行うものである。本明細書では、p基板4の光入射方向に対して垂直な2つの面のうち、光入射側の面を裏面といい、その反対面を表面という。又、p基板4の裏面及び表面に直交する方向を垂直方向、p基板4の裏面及び表面に平行な方向を水平方向と定義する。又、p基板4の裏面よりも光入射側にある構成要素は、各構成要素を基準にしたときに、入射光が進む方向と反対方向を、その構成要素の上方と定義し、p基板4の裏面よりも光入射側とは反対側にある構成要素は、各構成要素を基準にしたときに、入射光が進む方向を、その構成要素の上方と定義する。
6r,6g,6b,6w 電荷蓄積領域
21 Gカラーフィルタ
22 Rカラーフィルタ
23 Bカラーフィルタ
24 輝度フィルタ
Claims (3)
- 半導体基板の裏面側から光を照射し、前記光に応じて前記半導体基板内で発生した電荷を、前記半導体基板の表面側から読み出して撮像を行う裏面照射型撮像素子であって、
前記半導体基板内に形成された前記電荷を蓄積するための多数の電荷蓄積領域と、
前記多数の電荷蓄積領域の各々に対応させて前記半導体基板の裏面上方に形成されたフィルタとを備え、
多数の前記フィルタが、それぞれ異なる光の色成分を透過する複数種類のカラーフィルタと、光の輝度成分と相関のある分光特性を持つ輝度フィルタとを含み、
前記輝度フィルタに対応する電荷蓄積領域のうち、少なくとも前記裏面照射型撮像素子の周辺部にある前記電荷蓄積領域の前記半導体基板の裏面側の端部が、当該電荷蓄積領域に隣接する、前記カラーフィルタに対応する電荷蓄積領域の前記裏面側の端部よりも前記裏面に平行な方向に広がっている裏面照射型撮像素子。 - 請求項1記載の裏面照射型撮像素子であって、
前記複数種類のカラーフィルタに対応する電荷蓄積領域の前記裏面側の端部の広がりは、全て同じである裏面照射型撮像素子。 - 請求項1又は2記載の裏面照射型撮像素子であって、
前記輝度フィルタに対応する電荷蓄積領域の前記裏面側の端部の広がりが、前記裏面照射型撮像素子の中心部から周辺部に向かうほど、大きくなる裏面照射型撮像素子。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007165018A JP4659788B2 (ja) | 2007-06-22 | 2007-06-22 | 裏面照射型撮像素子 |
US12/142,569 US8072007B2 (en) | 2007-06-22 | 2008-06-19 | Backside-illuminated imaging device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007165018A JP4659788B2 (ja) | 2007-06-22 | 2007-06-22 | 裏面照射型撮像素子 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009004615A JP2009004615A (ja) | 2009-01-08 |
JP2009004615A5 JP2009004615A5 (ja) | 2010-08-26 |
JP4659788B2 true JP4659788B2 (ja) | 2011-03-30 |
Family
ID=40320666
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007165018A Expired - Fee Related JP4659788B2 (ja) | 2007-06-22 | 2007-06-22 | 裏面照射型撮像素子 |
Country Status (2)
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US (1) | US8072007B2 (ja) |
JP (1) | JP4659788B2 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5394814B2 (ja) | 2009-05-01 | 2014-01-22 | 三星電子株式会社 | 光検出素子及び撮像装置 |
US8358365B2 (en) * | 2009-05-01 | 2013-01-22 | Samsung Electronics Co., Ltd. | Photo detecting device and image pickup device and method thereon |
US8334195B2 (en) | 2009-09-09 | 2012-12-18 | International Business Machines Corporation | Pixel sensors of multiple pixel size and methods of implant dose control |
US8450688B2 (en) | 2009-11-05 | 2013-05-28 | The Aerospace Corporation | Refraction assisted illumination for imaging |
US8461532B2 (en) * | 2009-11-05 | 2013-06-11 | The Aerospace Corporation | Refraction assisted illumination for imaging |
US8138476B2 (en) | 2009-11-05 | 2012-03-20 | The Aerospace Corporation | Refraction assisted illumination for imaging |
JP5478217B2 (ja) * | 2009-11-25 | 2014-04-23 | パナソニック株式会社 | 固体撮像装置 |
JP5358747B2 (ja) | 2011-03-25 | 2013-12-04 | 富士フイルム株式会社 | 裏面照射型固体撮像素子及びその製造方法並びに撮像装置 |
US9007454B2 (en) | 2012-10-31 | 2015-04-14 | The Aerospace Corporation | Optimized illumination for imaging |
JP2014179413A (ja) * | 2013-03-14 | 2014-09-25 | Toshiba Corp | 固体撮像装置 |
CN109599408B (zh) * | 2018-12-26 | 2022-05-03 | 中国电子科技集团公司第四十四研究所 | 一种cmos图像传感器像素结构及其制备、使用方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004304706A (ja) * | 2003-04-01 | 2004-10-28 | Fuji Photo Film Co Ltd | 固体撮像装置およびその補間処理方法 |
JP2006073682A (ja) * | 2004-08-31 | 2006-03-16 | Sony Corp | 固体撮像素子、カメラモジュール及び電子機器モジュール |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11355790A (ja) | 1998-06-09 | 1999-12-24 | Fuji Film Microdevices Co Ltd | 二次元カラー撮像素子 |
KR100485892B1 (ko) * | 2002-11-14 | 2005-04-29 | 매그나칩 반도체 유한회사 | 시모스 이미지센서 및 그 제조방법 |
JP4046067B2 (ja) * | 2003-11-04 | 2008-02-13 | ソニー株式会社 | 固体撮像素子の製造方法 |
US7456384B2 (en) * | 2004-12-10 | 2008-11-25 | Sony Corporation | Method and apparatus for acquiring physical information, method for manufacturing semiconductor device including array of plurality of unit components for detecting physical quantity distribution, light-receiving device and manufacturing method therefor, and solid-state imaging device and manufacturing method therefor |
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2007
- 2007-06-22 JP JP2007165018A patent/JP4659788B2/ja not_active Expired - Fee Related
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2008
- 2008-06-19 US US12/142,569 patent/US8072007B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004304706A (ja) * | 2003-04-01 | 2004-10-28 | Fuji Photo Film Co Ltd | 固体撮像装置およびその補間処理方法 |
JP2006073682A (ja) * | 2004-08-31 | 2006-03-16 | Sony Corp | 固体撮像素子、カメラモジュール及び電子機器モジュール |
Also Published As
Publication number | Publication date |
---|---|
US20090045415A1 (en) | 2009-02-19 |
US8072007B2 (en) | 2011-12-06 |
JP2009004615A (ja) | 2009-01-08 |
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