KR102548231B1 - 반도체 모듈 및 이에 사용되는 반도체 장치 - Google Patents

반도체 모듈 및 이에 사용되는 반도체 장치 Download PDF

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KR102548231B1
KR102548231B1 KR1020217029748A KR20217029748A KR102548231B1 KR 102548231 B1 KR102548231 B1 KR 102548231B1 KR 1020217029748 A KR1020217029748 A KR 1020217029748A KR 20217029748 A KR20217029748 A KR 20217029748A KR 102548231 B1 KR102548231 B1 KR 102548231B1
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semiconductor device
semiconductor
heat
heat dissipation
lead frame
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KR20210127229A (ko
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세이고 오사와
야스시 오쿠라
다카히로 나카노
나오히토 미즈노
마사유키 다케나카
요시히로 이누츠카
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가부시키가이샤 덴소
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    • H01L23/36—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H01L23/12—
    • H01L23/29—
    • H01L23/31—
    • H01L25/07—
    • H01L25/18—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/442—Shapes or dispositions of multiple leadframes in a single chip
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H01L2224/18—
    • H01L2224/33181—
    • H01L2924/181—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
KR1020217029748A 2019-03-19 2020-03-12 반도체 모듈 및 이에 사용되는 반도체 장치 Active KR102548231B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019051516 2019-03-19
JPJP-P-2019-051516 2019-03-19
JP2020027188A JP7088224B2 (ja) 2019-03-19 2020-02-20 半導体モジュールおよびこれに用いられる半導体装置
JPJP-P-2020-027188 2020-02-20
PCT/JP2020/010845 WO2020189508A1 (ja) 2019-03-19 2020-03-12 半導体モジュールおよびこれに用いられる半導体装置

Publications (2)

Publication Number Publication Date
KR20210127229A KR20210127229A (ko) 2021-10-21
KR102548231B1 true KR102548231B1 (ko) 2023-06-27

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JP (1) JP7088224B2 (https=)
KR (1) KR102548231B1 (https=)
CN (1) CN113632214B (https=)

Families Citing this family (4)

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Publication number Priority date Publication date Assignee Title
JP2022152703A (ja) * 2021-03-29 2022-10-12 株式会社デンソー 半導体装置
CN117999650A (zh) * 2021-09-30 2024-05-07 罗姆股份有限公司 半导体装置
CN117542820A (zh) * 2022-08-02 2024-02-09 力特半导体（无锡）有限公司 用于电视装置的封装结构组件
CN115602656B (zh) * 2022-12-12 2023-10-27 英诺赛科(苏州)半导体有限公司 半导体组件及其制备方法、半导体装置

Citations (4)

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JP2006222121A (ja) 2005-02-08 2006-08-24 Renesas Technology Corp 半導体装置の製造方法
JP2010287651A (ja) 2009-06-10 2010-12-24 Nissan Motor Co Ltd 半導体装置
JP2016105523A (ja) 2016-03-10 2016-06-09 三菱電機株式会社 半導体装置及びその製造方法
JP2019029410A (ja) 2017-07-26 2019-02-21 トヨタ自動車株式会社 半導体モジュール

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JP3525832B2 (ja) 1999-11-24 2004-05-10 株式会社デンソー 半導体装置
TWI317991B (en) * 2003-12-19 2009-12-01 Advanced Semiconductor Eng Semiconductor package with flip chip on leadframe
US7830011B2 (en) * 2004-03-15 2010-11-09 Yamaha Corporation Semiconductor element and wafer level chip size package therefor
JP5118982B2 (ja) * 2007-01-31 2013-01-16 三洋電機株式会社 半導体モジュールおよびその製造方法
JP2011065544A (ja) * 2009-09-18 2011-03-31 Hitachi Information Systems Ltd 検査項目作成システム
JP5126201B2 (ja) * 2009-10-23 2013-01-23 株式会社デンソー 半導体モジュールおよびその製造方法
JP5709218B2 (ja) * 2009-11-27 2015-04-30 日本電気株式会社 半導体装置、３次元実装型半導体装置、半導体モジュール、電子機器、及びその製造方法
JP5126278B2 (ja) 2010-02-04 2013-01-23 株式会社デンソー 半導体装置およびその製造方法
JP2011165793A (ja) * 2010-02-08 2011-08-25 Renesas Electronics Corp 半導体装置及びその製造方法、並びに電子装置
US8507940B2 (en) * 2010-04-05 2013-08-13 Taiwan Semiconductor Manufacturing Company, Ltd. Heat dissipation by through silicon plugs
JP5383717B2 (ja) * 2011-01-04 2014-01-08 三菱電機株式会社 半導体装置
JP5729126B2 (ja) 2011-05-18 2015-06-03 株式会社デンソー 半導体装置の製造方法
JP5637156B2 (ja) 2012-02-22 2014-12-10 トヨタ自動車株式会社 半導体モジュール
JP2014063844A (ja) * 2012-09-20 2014-04-10 Sony Corp 半導体装置、半導体装置の製造方法及び電子機器
JP2014157927A (ja) 2013-02-15 2014-08-28 Denso Corp 半導体装置及びその製造方法
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WO2015029511A1 (ja) 2013-08-28 2015-03-05 三菱電機株式会社 半導体装置およびその製造方法
JP6953859B2 (ja) * 2017-07-25 2021-10-27 株式会社デンソー 半導体装置
JP7204174B2 (ja) 2018-07-19 2023-01-16 マイクロモジュールテクノロジー株式会社 半導体装置及び半導体装置の製造方法
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Publication number Priority date Publication date Assignee Title
JP2006222121A (ja) 2005-02-08 2006-08-24 Renesas Technology Corp 半導体装置の製造方法
JP2010287651A (ja) 2009-06-10 2010-12-24 Nissan Motor Co Ltd 半導体装置
JP2016105523A (ja) 2016-03-10 2016-06-09 三菱電機株式会社 半導体装置及びその製造方法
JP2019029410A (ja) 2017-07-26 2019-02-21 トヨタ自動車株式会社 半導体モジュール

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JP2020161807A (ja) 2020-10-01
CN113632214A (zh) 2021-11-09
JP7088224B2 (ja) 2022-06-21
CN113632214B (zh) 2023-12-08
KR20210127229A (ko) 2021-10-21

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