KR102518086B1 - 도금 장치 - Google Patents

도금 장치 Download PDF

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Publication number
KR102518086B1
KR102518086B1 KR1020227029232A KR20227029232A KR102518086B1 KR 102518086 B1 KR102518086 B1 KR 102518086B1 KR 1020227029232 A KR1020227029232 A KR 1020227029232A KR 20227029232 A KR20227029232 A KR 20227029232A KR 102518086 B1 KR102518086 B1 KR 102518086B1
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KR
South Korea
Prior art keywords
plating
substrate
film thickness
module
plated
Prior art date
Application number
KR1020227029232A
Other languages
English (en)
Korean (ko)
Other versions
KR20220164696A (ko
Inventor
마사시 시모야마
야스유키 마스다
가즈히토 즈지
료스케 히와타시
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR20220164696A publication Critical patent/KR20220164696A/ko
Application granted granted Critical
Publication of KR102518086B1 publication Critical patent/KR102518086B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020227029232A 2021-06-04 2021-06-04 도금 장치 KR102518086B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/021358 WO2022254690A1 (fr) 2021-06-04 2021-06-04 Dispositif de placage

Publications (2)

Publication Number Publication Date
KR20220164696A KR20220164696A (ko) 2022-12-13
KR102518086B1 true KR102518086B1 (ko) 2023-04-06

Family

ID=81731724

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227029232A KR102518086B1 (ko) 2021-06-04 2021-06-04 도금 장치

Country Status (5)

Country Link
US (1) US20240218553A1 (fr)
JP (1) JP7074937B1 (fr)
KR (1) KR102518086B1 (fr)
CN (1) CN115698389B (fr)
WO (1) WO2022254690A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024042700A1 (fr) * 2022-08-26 2024-02-29 株式会社荏原製作所 Dispositif de mesure d'état de substrat, dispositif de placage, et procédé de mesure d'état de substrat
CN117500960B (zh) * 2022-12-16 2024-08-20 株式会社荏原制作所 镀覆装置
JP7373684B1 (ja) * 2023-03-02 2023-11-02 株式会社荏原製作所 めっき装置
JP7305075B1 (ja) * 2023-03-17 2023-07-07 株式会社荏原製作所 めっき装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003306793A (ja) 2002-04-16 2003-10-31 Ebara Corp めっき装置及び方法
JP2004083932A (ja) 2002-08-22 2004-03-18 Ebara Corp 電解処理装置

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JPH05186898A (ja) * 1992-01-09 1993-07-27 Fujitsu Ltd メッキ方法及びメッキ装置
JP2950016B2 (ja) * 1992-05-22 1999-09-20 三菱電機株式会社 湿式プロセスにおけるめっき膜厚およびエッチング溝深さの測定方法
JP3346744B2 (ja) * 1999-01-11 2002-11-18 沖電気工業株式会社 メッキ成長装置及びメッキ成長方法
JP2001177238A (ja) * 1999-12-20 2001-06-29 Ibiden Co Ltd プリント基板の製造方法
JP3797860B2 (ja) 2000-09-27 2006-07-19 株式会社荏原製作所 めっき装置及びめっき方法
WO2002047139A2 (fr) * 2000-12-04 2002-06-13 Ebara Corporation Procede de traitement de substrat
JP3661657B2 (ja) * 2002-03-14 2005-06-15 住友金属鉱山株式会社 電気めっき方法および電気めっき装置
KR20050092130A (ko) * 2003-01-23 2005-09-20 가부시키가이샤 에바라 세이사꾸쇼 도금장치 및 도금방법
KR20060009387A (ko) * 2003-06-13 2006-01-31 가부시키가이샤 에바라 세이사꾸쇼 측정장치
JP4852333B2 (ja) * 2006-03-31 2012-01-11 株式会社荏原製作所 分極曲線測定方法及び電解処理装置
JP2008019496A (ja) 2006-07-14 2008-01-31 Matsushita Electric Ind Co Ltd 電解めっき装置および電解めっき方法
JP2008121062A (ja) * 2006-11-10 2008-05-29 Ebara Corp めっき装置及びめっき方法
JP2008208421A (ja) * 2007-02-26 2008-09-11 Ebara Corp めっき方法及びめっき装置
US8106651B2 (en) * 2008-04-17 2012-01-31 Novellus Systems, Inc. Methods and apparatuses for determining thickness of a conductive layer
JP5124756B1 (ja) * 2011-09-08 2013-01-23 ユケン工業株式会社 めっき電流密度分布測定装置およびめっき電流密度分布の測定方法
US20140231245A1 (en) * 2013-02-18 2014-08-21 Globalfoundries Inc. Adjustable current shield for electroplating processes
CN105209670A (zh) * 2013-05-13 2015-12-30 株式会社杰希优 基板镀敷装置
JP6335763B2 (ja) * 2014-11-20 2018-05-30 株式会社荏原製作所 めっき装置及びめっき方法
JP2017052986A (ja) * 2015-09-08 2017-03-16 株式会社荏原製作所 調整板、これを備えためっき装置、及びめっき方法
JP2017115170A (ja) * 2015-12-21 2017-06-29 株式会社荏原製作所 めっき装置及びめっき方法
JP6756540B2 (ja) * 2016-08-08 2020-09-16 株式会社荏原製作所 めっき装置、めっき装置の制御方法、及び、めっき装置の制御方法をコンピュータに実行させるためのプログラムを格納した記憶媒体
JP2019002065A (ja) * 2017-06-20 2019-01-10 株式会社荏原製作所 めっき装置、及びプログラムを記録した記録媒体
JP6861610B2 (ja) * 2017-11-07 2021-04-21 株式会社荏原製作所 めっき解析方法、めっき解析システム、及びめっき解析のためのコンピュータプログラム
JP6933963B2 (ja) * 2017-11-22 2021-09-08 株式会社荏原製作所 電気めっき装置における給電点の配置の決定方法および矩形の基板をめっきするための電気めっき装置
JP7256708B2 (ja) * 2019-07-09 2023-04-12 株式会社荏原製作所 めっき装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003306793A (ja) 2002-04-16 2003-10-31 Ebara Corp めっき装置及び方法
JP2004083932A (ja) 2002-08-22 2004-03-18 Ebara Corp 電解処理装置

Also Published As

Publication number Publication date
JPWO2022254690A1 (fr) 2022-12-08
CN115698389B (zh) 2023-06-16
JP7074937B1 (ja) 2022-05-24
KR20220164696A (ko) 2022-12-13
US20240218553A1 (en) 2024-07-04
CN115698389A (zh) 2023-02-03
WO2022254690A1 (fr) 2022-12-08

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