KR102484442B1 - 부품 실장기 - Google Patents

부품 실장기 Download PDF

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Publication number
KR102484442B1
KR102484442B1 KR1020160166892A KR20160166892A KR102484442B1 KR 102484442 B1 KR102484442 B1 KR 102484442B1 KR 1020160166892 A KR1020160166892 A KR 1020160166892A KR 20160166892 A KR20160166892 A KR 20160166892A KR 102484442 B1 KR102484442 B1 KR 102484442B1
Authority
KR
South Korea
Prior art keywords
unit
substrate
area
board
normal
Prior art date
Application number
KR1020160166892A
Other languages
English (en)
Korean (ko)
Other versions
KR20180065705A (ko
Inventor
신대건
Original Assignee
한화정밀기계 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한화정밀기계 주식회사 filed Critical 한화정밀기계 주식회사
Priority to KR1020160166892A priority Critical patent/KR102484442B1/ko
Priority to PCT/KR2017/006327 priority patent/WO2018105838A1/ko
Priority to CN201780074445.6A priority patent/CN110024510B/zh
Publication of KR20180065705A publication Critical patent/KR20180065705A/ko
Application granted granted Critical
Publication of KR102484442B1 publication Critical patent/KR102484442B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0411—Pick-and-place heads or apparatus, e.g. with jaws having multiple mounting heads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR1020160166892A 2016-12-08 2016-12-08 부품 실장기 KR102484442B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020160166892A KR102484442B1 (ko) 2016-12-08 2016-12-08 부품 실장기
PCT/KR2017/006327 WO2018105838A1 (ko) 2016-12-08 2017-06-16 부품 마운팅 및 본딩 장치와, 이를 이용한 부품 마운팅 방법
CN201780074445.6A CN110024510B (zh) 2016-12-08 2017-06-16 部件贴装及键合装置和利用该装置的部件贴装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160166892A KR102484442B1 (ko) 2016-12-08 2016-12-08 부품 실장기

Publications (2)

Publication Number Publication Date
KR20180065705A KR20180065705A (ko) 2018-06-18
KR102484442B1 true KR102484442B1 (ko) 2023-01-02

Family

ID=62491918

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160166892A KR102484442B1 (ko) 2016-12-08 2016-12-08 부품 실장기

Country Status (3)

Country Link
KR (1) KR102484442B1 (zh)
CN (1) CN110024510B (zh)
WO (1) WO2018105838A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110913682A (zh) * 2019-11-29 2020-03-24 深圳市智微智能软件开发有限公司 Smt换料方法及系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002026599A (ja) 2000-07-11 2002-01-25 Matsushita Electric Ind Co Ltd 電子部品実装方法、装置、及び電子部品実装システム、並びにこれらに用いる記録媒体
JP2003273594A (ja) 2002-03-15 2003-09-26 Matsushita Electric Ind Co Ltd 部品実装方法および部品実装機
JP3466153B2 (ja) 2000-11-30 2003-11-10 松下電器産業株式会社 部品実装順序最適化方法、その装置及び部品実装機

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10145098A (ja) * 1996-11-07 1998-05-29 Matsushita Electric Ind Co Ltd 部品取扱い方法とその作業装置およびそのための記憶媒体
JP4308099B2 (ja) * 2004-07-14 2009-08-05 本田技研工業株式会社 部品の生産計画方法
JP4020900B2 (ja) * 2004-09-06 2007-12-12 松下電器産業株式会社 部品実装品質分析方法及び部品実装品質分析装置
JP5000479B2 (ja) * 2007-12-27 2012-08-15 シャープ株式会社 面光源、表示装置及びその製造方法
JP5187201B2 (ja) * 2009-01-14 2013-04-24 パナソニック株式会社 部品実装装置および部品実装方法
JP5543960B2 (ja) * 2009-03-23 2014-07-09 東レエンジニアリング株式会社 実装装置および実装方法
KR101667662B1 (ko) 2011-08-11 2016-10-20 한화테크윈 주식회사 기판의 피듀셜 마크를 이용한 갠트리의 협업 판단 방법 및 장치
JP6022763B2 (ja) * 2011-12-07 2016-11-09 富士機械製造株式会社 対回路基板作業機
KR101690725B1 (ko) 2011-12-28 2017-01-10 한화테크윈 주식회사 실장기의 부품 실장 최적화 방법 및 장치
JP6066587B2 (ja) * 2012-05-25 2017-01-25 富士機械製造株式会社 基板の検査方法、検査プログラム、および検査装置
WO2014033960A1 (ja) * 2012-09-03 2014-03-06 富士機械製造株式会社 生産ラインの管理方法および管理システム
CN103111845A (zh) * 2013-02-26 2013-05-22 深圳市神拓机电设备有限公司 圆盘式托辊密封组装设备
EP2778892B1 (en) * 2013-03-11 2022-08-10 Esko Software BV Method and system for inspecting variable-data printing
CN103280414B (zh) * 2013-04-28 2015-03-11 合肥京东方光电科技有限公司 一种异物不良点监控方法及监控装置
US9374905B2 (en) * 2013-09-30 2016-06-21 Illinois Tool Works Inc. Method and apparatus for automatically adjusting dispensing units of a dispenser
JP6435099B2 (ja) * 2014-02-26 2018-12-05 Juki株式会社 電子部品実装装置及び電子部品実装方法
CN104701222B (zh) * 2015-03-12 2018-10-23 上海理工大学 一种面阵凸点植球工艺的补球装置及方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002026599A (ja) 2000-07-11 2002-01-25 Matsushita Electric Ind Co Ltd 電子部品実装方法、装置、及び電子部品実装システム、並びにこれらに用いる記録媒体
JP3466153B2 (ja) 2000-11-30 2003-11-10 松下電器産業株式会社 部品実装順序最適化方法、その装置及び部品実装機
JP2003273594A (ja) 2002-03-15 2003-09-26 Matsushita Electric Ind Co Ltd 部品実装方法および部品実装機

Also Published As

Publication number Publication date
WO2018105838A1 (ko) 2018-06-14
CN110024510B (zh) 2020-12-04
CN110024510A (zh) 2019-07-16
KR20180065705A (ko) 2018-06-18

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