KR102472595B1 - 기판 처리 장치 및 기판 처리 방법 - Google Patents

기판 처리 장치 및 기판 처리 방법 Download PDF

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Publication number
KR102472595B1
KR102472595B1 KR1020227020887A KR20227020887A KR102472595B1 KR 102472595 B1 KR102472595 B1 KR 102472595B1 KR 1020227020887 A KR1020227020887 A KR 1020227020887A KR 20227020887 A KR20227020887 A KR 20227020887A KR 102472595 B1 KR102472595 B1 KR 102472595B1
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KR
South Korea
Prior art keywords
sheet substrate
substrate
time
exposure
sheet
Prior art date
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KR1020227020887A
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English (en)
Korean (ko)
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KR20220093004A (ko
Inventor
요시아키 기토
마사키 가토
게이 나라
마사카즈 호리
도루 기우치
Original Assignee
가부시키가이샤 니콘
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Publication of KR20220093004A publication Critical patent/KR20220093004A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H26/00—Warning or safety devices, e.g. automatic fault detectors, stop-motions, for web-advancing mechanisms
    • B65H26/02—Warning or safety devices, e.g. automatic fault detectors, stop-motions, for web-advancing mechanisms responsive to presence of irregularities in running webs
    • B65H26/04—Warning or safety devices, e.g. automatic fault detectors, stop-motions, for web-advancing mechanisms responsive to presence of irregularities in running webs for variation in tension
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H20/00—Advancing webs
    • B65H20/02—Advancing webs by friction roller
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
    • B65H23/188—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in connection with running-web
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
    • B65H23/188—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in connection with running-web
    • B65H23/1888—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in connection with running-web and controlling web tension
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H26/00—Warning or safety devices, e.g. automatic fault detectors, stop-motions, for web-advancing mechanisms
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/19—Specific article or web

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Controlling Rewinding, Feeding, Winding, Or Abnormalities Of Webs (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
KR1020227020887A 2016-08-08 2017-08-07 기판 처리 장치 및 기판 처리 방법 KR102472595B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2016-155810 2016-08-08
JP2016155810 2016-08-08
PCT/JP2017/028634 WO2018030357A1 (ja) 2016-08-08 2017-08-07 基板処理装置および基板処理方法
KR1020197006822A KR102412451B1 (ko) 2016-08-08 2017-08-07 기판 처리 장치 및 기판 처리 방법

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020197006822A Division KR102412451B1 (ko) 2016-08-08 2017-08-07 기판 처리 장치 및 기판 처리 방법

Publications (2)

Publication Number Publication Date
KR20220093004A KR20220093004A (ko) 2022-07-04
KR102472595B1 true KR102472595B1 (ko) 2022-12-01

Family

ID=61162228

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020197006822A KR102412451B1 (ko) 2016-08-08 2017-08-07 기판 처리 장치 및 기판 처리 방법
KR1020227020884A KR102500771B1 (ko) 2016-08-08 2017-08-07 기판 처리 장치 및 기판 처리 방법
KR1020227020887A KR102472595B1 (ko) 2016-08-08 2017-08-07 기판 처리 장치 및 기판 처리 방법

Family Applications Before (2)

Application Number Title Priority Date Filing Date
KR1020197006822A KR102412451B1 (ko) 2016-08-08 2017-08-07 기판 처리 장치 및 기판 처리 방법
KR1020227020884A KR102500771B1 (ko) 2016-08-08 2017-08-07 기판 처리 장치 및 기판 처리 방법

Country Status (5)

Country Link
JP (1) JP6965884B2 (zh)
KR (3) KR102412451B1 (zh)
CN (4) CN109562902B (zh)
TW (1) TWI801347B (zh)
WO (1) WO2018030357A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020142026A1 (en) * 2018-12-31 2020-07-09 YILDIZ ARIFOGLU, Habibe A coating machine
DE112019005363T5 (de) * 2019-01-08 2021-07-15 Ulvac, Inc. Vakuumbearbeitungsvorrichtung
JP7306025B2 (ja) * 2019-04-01 2023-07-11 セイコーエプソン株式会社 印刷装置及び印刷方法
JP2020187334A (ja) * 2019-05-17 2020-11-19 キヤノン株式会社 露光装置、および物品製造方法
JP7291577B2 (ja) * 2019-08-28 2023-06-15 芝浦メカトロニクス株式会社 移送装置および実装装置
DE102019128198B3 (de) * 2019-10-18 2021-02-25 Laser Imaging Systems Gmbh Vorrichtung zur Mustereinbringung mittels Strahlung an einem aufgewickelten Endlossubstrat
JP7304297B2 (ja) * 2020-01-17 2023-07-06 三菱重工機械システム株式会社 印刷装置および輪転印刷機並びに版交換方法
KR20220034947A (ko) * 2020-09-11 2022-03-21 삼성디스플레이 주식회사 표시 모듈 및 이를 포함하는 전자 장치
CN112757770A (zh) * 2021-01-09 2021-05-07 南京闻煜智能科技有限公司 一种丝网印刷机
CN113281724A (zh) * 2021-05-11 2021-08-20 田斌 一种激光雷达及准直调试装置
TWI766697B (zh) * 2021-05-24 2022-06-01 聯毅科技股份有限公司 監控裝置及方法

Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2000246868A (ja) 1999-02-26 2000-09-12 Dainippon Printing Co Ltd 転写方法および転写装置
JP2004144862A (ja) * 2002-10-23 2004-05-20 Dainippon Printing Co Ltd カラーフィルターの製造方法及びカラーフィルターの製造装置
JP2005148353A (ja) 2003-11-14 2005-06-09 Dainippon Printing Co Ltd カラーフィルタ製造装置、及びカラーフィルタ製造方法

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JPH06227720A (ja) * 1993-01-29 1994-08-16 Toppan Moore Co Ltd 連続用紙移送処理装置におけるテンション緩和装置
JP3363278B2 (ja) * 1995-01-26 2003-01-08 日本たばこ産業株式会社 帯状材の安定走行装置
JP3307295B2 (ja) * 1997-09-29 2002-07-24 ウシオ電機株式会社 帯状ワークの搬送・位置決め方法および装置
JP3417313B2 (ja) * 1998-09-28 2003-06-16 ウシオ電機株式会社 帯状ワークの露光装置
JP3672028B2 (ja) * 2002-05-14 2005-07-13 東レエンジニアリング株式会社 帯状ワークの露光装置
JP2007230136A (ja) * 2006-03-02 2007-09-13 Daisey Machinery Co Ltd サーマルヘッドによる印字方法及び印字装置
JP4790451B2 (ja) * 2006-03-08 2011-10-12 住友精密工業株式会社 基板処理装置
JP4763527B2 (ja) * 2006-06-22 2011-08-31 大日本スクリーン製造株式会社 基板処理装置
JP4712880B2 (ja) * 2009-03-19 2011-06-29 シャープ株式会社 シート材巻き出し装置及びシート材巻き出し方法
JP5226037B2 (ja) * 2010-06-04 2013-07-03 東京エレクトロン株式会社 熱処理装置及び熱処理方法
CN103065998A (zh) * 2011-10-21 2013-04-24 东京毅力科创株式会社 处理台装置及使用该处理台装置的涂布处理装置
TWI641915B (zh) * 2012-01-12 2018-11-21 尼康股份有限公司 基板處理裝置、基板處理方法、及圓筒狀光罩
CN105467627A (zh) * 2012-05-23 2016-04-06 株式会社尼康 基板处理装置及基板处理方法
CN103569699B (zh) * 2012-07-27 2016-09-28 亚智科技股份有限公司 基板传送装置
WO2016035842A1 (ja) * 2014-09-04 2016-03-10 株式会社ニコン 処理システムおよびデバイス製造方法
JP6409518B2 (ja) * 2014-11-14 2018-10-24 株式会社ニコン パターン形成装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000246868A (ja) 1999-02-26 2000-09-12 Dainippon Printing Co Ltd 転写方法および転写装置
JP2004144862A (ja) * 2002-10-23 2004-05-20 Dainippon Printing Co Ltd カラーフィルターの製造方法及びカラーフィルターの製造装置
JP2005148353A (ja) 2003-11-14 2005-06-09 Dainippon Printing Co Ltd カラーフィルタ製造装置、及びカラーフィルタ製造方法

Also Published As

Publication number Publication date
KR20190035879A (ko) 2019-04-03
CN111470362A (zh) 2020-07-31
KR20220093004A (ko) 2022-07-04
KR102500771B1 (ko) 2023-02-17
CN114229474A (zh) 2022-03-25
CN109562902B (zh) 2020-08-21
CN114408654B (zh) 2024-06-04
CN111470362B (zh) 2022-04-01
TWI801347B (zh) 2023-05-11
KR102412451B1 (ko) 2022-06-24
CN114408654A (zh) 2022-04-29
TW201820671A (zh) 2018-06-01
CN114229474B (zh) 2023-05-05
CN109562902A (zh) 2019-04-02
KR20220093003A (ko) 2022-07-04
JP6965884B2 (ja) 2021-11-10
JPWO2018030357A1 (ja) 2019-06-13
WO2018030357A1 (ja) 2018-02-15

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