KR102472595B1 - 기판 처리 장치 및 기판 처리 방법 - Google Patents
기판 처리 장치 및 기판 처리 방법 Download PDFInfo
- Publication number
- KR102472595B1 KR102472595B1 KR1020227020887A KR20227020887A KR102472595B1 KR 102472595 B1 KR102472595 B1 KR 102472595B1 KR 1020227020887 A KR1020227020887 A KR 1020227020887A KR 20227020887 A KR20227020887 A KR 20227020887A KR 102472595 B1 KR102472595 B1 KR 102472595B1
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- South Korea
- Prior art keywords
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H26/00—Warning or safety devices, e.g. automatic fault detectors, stop-motions, for web-advancing mechanisms
- B65H26/02—Warning or safety devices, e.g. automatic fault detectors, stop-motions, for web-advancing mechanisms responsive to presence of irregularities in running webs
- B65H26/04—Warning or safety devices, e.g. automatic fault detectors, stop-motions, for web-advancing mechanisms responsive to presence of irregularities in running webs for variation in tension
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H20/00—Advancing webs
- B65H20/02—Advancing webs by friction roller
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H23/00—Registering, tensioning, smoothing or guiding webs
- B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
- B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
- B65H23/188—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in connection with running-web
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H23/00—Registering, tensioning, smoothing or guiding webs
- B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
- B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
- B65H23/188—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in connection with running-web
- B65H23/1888—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in connection with running-web and controlling web tension
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H26/00—Warning or safety devices, e.g. automatic fault detectors, stop-motions, for web-advancing mechanisms
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/24—Curved surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/10—Handled articles or webs
- B65H2701/19—Specific article or web
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Controlling Rewinding, Feeding, Winding, Or Abnormalities Of Webs (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2016-155810 | 2016-08-08 | ||
JP2016155810 | 2016-08-08 | ||
PCT/JP2017/028634 WO2018030357A1 (ja) | 2016-08-08 | 2017-08-07 | 基板処理装置および基板処理方法 |
KR1020197006822A KR102412451B1 (ko) | 2016-08-08 | 2017-08-07 | 기판 처리 장치 및 기판 처리 방법 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020197006822A Division KR102412451B1 (ko) | 2016-08-08 | 2017-08-07 | 기판 처리 장치 및 기판 처리 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20220093004A KR20220093004A (ko) | 2022-07-04 |
KR102472595B1 true KR102472595B1 (ko) | 2022-12-01 |
Family
ID=61162228
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020197006822A KR102412451B1 (ko) | 2016-08-08 | 2017-08-07 | 기판 처리 장치 및 기판 처리 방법 |
KR1020227020884A KR102500771B1 (ko) | 2016-08-08 | 2017-08-07 | 기판 처리 장치 및 기판 처리 방법 |
KR1020227020887A KR102472595B1 (ko) | 2016-08-08 | 2017-08-07 | 기판 처리 장치 및 기판 처리 방법 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020197006822A KR102412451B1 (ko) | 2016-08-08 | 2017-08-07 | 기판 처리 장치 및 기판 처리 방법 |
KR1020227020884A KR102500771B1 (ko) | 2016-08-08 | 2017-08-07 | 기판 처리 장치 및 기판 처리 방법 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6965884B2 (zh) |
KR (3) | KR102412451B1 (zh) |
CN (4) | CN109562902B (zh) |
TW (1) | TWI801347B (zh) |
WO (1) | WO2018030357A1 (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020142026A1 (en) * | 2018-12-31 | 2020-07-09 | YILDIZ ARIFOGLU, Habibe | A coating machine |
DE112019005363T5 (de) * | 2019-01-08 | 2021-07-15 | Ulvac, Inc. | Vakuumbearbeitungsvorrichtung |
JP7306025B2 (ja) * | 2019-04-01 | 2023-07-11 | セイコーエプソン株式会社 | 印刷装置及び印刷方法 |
JP2020187334A (ja) * | 2019-05-17 | 2020-11-19 | キヤノン株式会社 | 露光装置、および物品製造方法 |
JP7291577B2 (ja) * | 2019-08-28 | 2023-06-15 | 芝浦メカトロニクス株式会社 | 移送装置および実装装置 |
DE102019128198B3 (de) * | 2019-10-18 | 2021-02-25 | Laser Imaging Systems Gmbh | Vorrichtung zur Mustereinbringung mittels Strahlung an einem aufgewickelten Endlossubstrat |
JP7304297B2 (ja) * | 2020-01-17 | 2023-07-06 | 三菱重工機械システム株式会社 | 印刷装置および輪転印刷機並びに版交換方法 |
KR20220034947A (ko) * | 2020-09-11 | 2022-03-21 | 삼성디스플레이 주식회사 | 표시 모듈 및 이를 포함하는 전자 장치 |
CN112757770A (zh) * | 2021-01-09 | 2021-05-07 | 南京闻煜智能科技有限公司 | 一种丝网印刷机 |
CN113281724A (zh) * | 2021-05-11 | 2021-08-20 | 田斌 | 一种激光雷达及准直调试装置 |
TWI766697B (zh) * | 2021-05-24 | 2022-06-01 | 聯毅科技股份有限公司 | 監控裝置及方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000246868A (ja) | 1999-02-26 | 2000-09-12 | Dainippon Printing Co Ltd | 転写方法および転写装置 |
JP2004144862A (ja) * | 2002-10-23 | 2004-05-20 | Dainippon Printing Co Ltd | カラーフィルターの製造方法及びカラーフィルターの製造装置 |
JP2005148353A (ja) | 2003-11-14 | 2005-06-09 | Dainippon Printing Co Ltd | カラーフィルタ製造装置、及びカラーフィルタ製造方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06227720A (ja) * | 1993-01-29 | 1994-08-16 | Toppan Moore Co Ltd | 連続用紙移送処理装置におけるテンション緩和装置 |
JP3363278B2 (ja) * | 1995-01-26 | 2003-01-08 | 日本たばこ産業株式会社 | 帯状材の安定走行装置 |
JP3307295B2 (ja) * | 1997-09-29 | 2002-07-24 | ウシオ電機株式会社 | 帯状ワークの搬送・位置決め方法および装置 |
JP3417313B2 (ja) * | 1998-09-28 | 2003-06-16 | ウシオ電機株式会社 | 帯状ワークの露光装置 |
JP3672028B2 (ja) * | 2002-05-14 | 2005-07-13 | 東レエンジニアリング株式会社 | 帯状ワークの露光装置 |
JP2007230136A (ja) * | 2006-03-02 | 2007-09-13 | Daisey Machinery Co Ltd | サーマルヘッドによる印字方法及び印字装置 |
JP4790451B2 (ja) * | 2006-03-08 | 2011-10-12 | 住友精密工業株式会社 | 基板処理装置 |
JP4763527B2 (ja) * | 2006-06-22 | 2011-08-31 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP4712880B2 (ja) * | 2009-03-19 | 2011-06-29 | シャープ株式会社 | シート材巻き出し装置及びシート材巻き出し方法 |
JP5226037B2 (ja) * | 2010-06-04 | 2013-07-03 | 東京エレクトロン株式会社 | 熱処理装置及び熱処理方法 |
CN103065998A (zh) * | 2011-10-21 | 2013-04-24 | 东京毅力科创株式会社 | 处理台装置及使用该处理台装置的涂布处理装置 |
TWI641915B (zh) * | 2012-01-12 | 2018-11-21 | 尼康股份有限公司 | 基板處理裝置、基板處理方法、及圓筒狀光罩 |
CN105467627A (zh) * | 2012-05-23 | 2016-04-06 | 株式会社尼康 | 基板处理装置及基板处理方法 |
CN103569699B (zh) * | 2012-07-27 | 2016-09-28 | 亚智科技股份有限公司 | 基板传送装置 |
WO2016035842A1 (ja) * | 2014-09-04 | 2016-03-10 | 株式会社ニコン | 処理システムおよびデバイス製造方法 |
JP6409518B2 (ja) * | 2014-11-14 | 2018-10-24 | 株式会社ニコン | パターン形成装置 |
-
2017
- 2017-08-07 KR KR1020197006822A patent/KR102412451B1/ko active IP Right Grant
- 2017-08-07 KR KR1020227020884A patent/KR102500771B1/ko active IP Right Grant
- 2017-08-07 KR KR1020227020887A patent/KR102472595B1/ko active IP Right Grant
- 2017-08-07 CN CN201780048591.1A patent/CN109562902B/zh active Active
- 2017-08-07 CN CN202210005576.1A patent/CN114229474B/zh active Active
- 2017-08-07 JP JP2018533466A patent/JP6965884B2/ja active Active
- 2017-08-07 CN CN202210080392.1A patent/CN114408654B/zh active Active
- 2017-08-07 CN CN202010235350.1A patent/CN111470362B/zh active Active
- 2017-08-07 WO PCT/JP2017/028634 patent/WO2018030357A1/ja active Application Filing
- 2017-08-07 TW TW106126506A patent/TWI801347B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000246868A (ja) | 1999-02-26 | 2000-09-12 | Dainippon Printing Co Ltd | 転写方法および転写装置 |
JP2004144862A (ja) * | 2002-10-23 | 2004-05-20 | Dainippon Printing Co Ltd | カラーフィルターの製造方法及びカラーフィルターの製造装置 |
JP2005148353A (ja) | 2003-11-14 | 2005-06-09 | Dainippon Printing Co Ltd | カラーフィルタ製造装置、及びカラーフィルタ製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20190035879A (ko) | 2019-04-03 |
CN111470362A (zh) | 2020-07-31 |
KR20220093004A (ko) | 2022-07-04 |
KR102500771B1 (ko) | 2023-02-17 |
CN114229474A (zh) | 2022-03-25 |
CN109562902B (zh) | 2020-08-21 |
CN114408654B (zh) | 2024-06-04 |
CN111470362B (zh) | 2022-04-01 |
TWI801347B (zh) | 2023-05-11 |
KR102412451B1 (ko) | 2022-06-24 |
CN114408654A (zh) | 2022-04-29 |
TW201820671A (zh) | 2018-06-01 |
CN114229474B (zh) | 2023-05-05 |
CN109562902A (zh) | 2019-04-02 |
KR20220093003A (ko) | 2022-07-04 |
JP6965884B2 (ja) | 2021-11-10 |
JPWO2018030357A1 (ja) | 2019-06-13 |
WO2018030357A1 (ja) | 2018-02-15 |
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