KR102413016B1 - 이송 롤러 - Google Patents

이송 롤러 Download PDF

Info

Publication number
KR102413016B1
KR102413016B1 KR1020197015807A KR20197015807A KR102413016B1 KR 102413016 B1 KR102413016 B1 KR 102413016B1 KR 1020197015807 A KR1020197015807 A KR 1020197015807A KR 20197015807 A KR20197015807 A KR 20197015807A KR 102413016 B1 KR102413016 B1 KR 102413016B1
Authority
KR
South Korea
Prior art keywords
conveying
contact
conveying roller
roller
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020197015807A
Other languages
English (en)
Korean (ko)
Other versions
KR20190082838A (ko
Inventor
페르디난트 비너
슈테판 그뤼쓰너
Original Assignee
아토테크 도이칠란트 게엠베하 운트 콤파니 카게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 filed Critical 아토테크 도이칠란트 게엠베하 운트 콤파니 카게
Publication of KR20190082838A publication Critical patent/KR20190082838A/ko
Application granted granted Critical
Publication of KR102413016B1 publication Critical patent/KR102413016B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H5/00—Feeding articles separated from piles; Feeding articles to machines
    • B65H5/06—Feeding articles separated from piles; Feeding articles to machines by rollers or balls, e.g. between rollers
    • B65H5/062—Feeding articles separated from piles; Feeding articles to machines by rollers or balls, e.g. between rollers between rollers or balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Rollers For Roller Conveyors For Transfer (AREA)
  • Rolls And Other Rotary Bodies (AREA)
  • Delivering By Means Of Belts And Rollers (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020197015807A 2016-11-16 2017-09-21 이송 롤러 Active KR102413016B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP16199129.4A EP3324426B1 (en) 2016-11-16 2016-11-16 Transport roller
EP16199129.4 2016-11-16
PCT/EP2017/073933 WO2018091174A1 (en) 2016-11-16 2017-09-21 Transport roller

Publications (2)

Publication Number Publication Date
KR20190082838A KR20190082838A (ko) 2019-07-10
KR102413016B1 true KR102413016B1 (ko) 2022-06-23

Family

ID=57348489

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197015807A Active KR102413016B1 (ko) 2016-11-16 2017-09-21 이송 롤러

Country Status (9)

Country Link
US (1) US11097913B2 (enExample)
EP (1) EP3324426B1 (enExample)
JP (1) JP7308752B2 (enExample)
KR (1) KR102413016B1 (enExample)
CN (1) CN109937472B (enExample)
MY (1) MY193744A (enExample)
PH (1) PH12019501083A1 (enExample)
TW (1) TWI661988B (enExample)
WO (1) WO2018091174A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115885374A (zh) * 2020-08-21 2023-03-31 应用材料公司 真空沉积系统、基板运输系统和运输基板通过真空腔室的方法
CN113003223B (zh) * 2021-04-23 2023-06-30 成都京东方显示科技有限公司 传送装置
WO2025038243A1 (en) * 2023-08-15 2025-02-20 Parata Systems, Llc Roller used in device for pharmaceutical pouch packaging

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190122914A1 (en) 2016-06-17 2019-04-25 Singulus Technologies Ag Device and method for treating substrates using a support roller having a porous material

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3708605A1 (de) * 1987-03-17 1988-09-29 Boettcher Gmbh & Co Felix Presswalze fuer die entwaesserung von stoffbahnen
JPH04129218A (ja) * 1990-09-19 1992-04-30 Mitsubishi Electric Corp 水切り装置
JPH08102582A (ja) * 1994-09-30 1996-04-16 Mitsubishi Paper Mills Ltd プリント配線基板処理装置
JPH10314684A (ja) * 1997-05-21 1998-12-02 Speedfam Co Ltd ディスク形ワークの洗浄方法及び装置
EP0993023A1 (en) * 1998-10-05 2000-04-12 Agfa-Gevaert N.V. Method for transferring a web-or sheet-like material into a clean room
WO2000074115A1 (en) * 1999-05-27 2000-12-07 Lam Research Corporation Wafer cascade scrubber
JP2004299984A (ja) * 2003-03-31 2004-10-28 Nichias Corp ディスクロール及びその製造方法
DE102005062528A1 (de) * 2005-12-16 2007-06-21 Gebr. Schmid Gmbh & Co. Vorrichtung und Verfahren zur Oberflächenbehandlung von Substraten
KR20100049103A (ko) * 2007-08-06 2010-05-11 가오 가부시키가이샤 액체 도공장치
CA2705566A1 (en) * 2007-11-19 2009-05-28 The Procter & Gamble Company Outer cover for a disposable absorbent article
DE102007061581A1 (de) * 2007-12-18 2009-06-25 Felix Kunze-Concewitz Vorrichtung und Verfahren zum Reinigen von Substraten für mikroelektronische Anwendungen durch rotierende Walzen
JP5431863B2 (ja) * 2009-10-19 2014-03-05 大日本スクリーン製造株式会社 基板処理装置
US8684169B2 (en) * 2010-08-31 2014-04-01 Itoh Denki Co., Ltd. Transfer device
JP5712589B2 (ja) * 2010-12-07 2015-05-07 セイコーエプソン株式会社 印刷装置
KR20130006987A (ko) * 2011-06-28 2013-01-18 삼성전기주식회사 기판 이송용 롤러
CN202606424U (zh) * 2012-03-30 2012-12-19 明基材料有限公司 清洁装置
TW201531584A (zh) * 2013-12-20 2015-08-16 Atotech Deutschland Gmbh 在用於電流或溼式化學金屬沉積之水平處理裝置之處理區域內積聚處理液之裝置
EP2886685A1 (en) * 2013-12-20 2015-06-24 ATOTECH Deutschland GmbH Device for accumulating a treatment liquid inside of a treatment area of a horizontal processing apparatus for a galvanic or wet-chemical metal deposition
GB201509080D0 (en) * 2015-05-27 2015-07-08 Landa Labs 2012 Ltd Coating apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190122914A1 (en) 2016-06-17 2019-04-25 Singulus Technologies Ag Device and method for treating substrates using a support roller having a porous material

Also Published As

Publication number Publication date
JP7308752B2 (ja) 2023-07-14
US20200055684A1 (en) 2020-02-20
CN109937472B (zh) 2023-03-31
US11097913B2 (en) 2021-08-24
KR20190082838A (ko) 2019-07-10
TW201819269A (zh) 2018-06-01
EP3324426B1 (en) 2021-05-05
PH12019501083A1 (en) 2019-08-19
WO2018091174A1 (en) 2018-05-24
TWI661988B (zh) 2019-06-11
EP3324426A1 (en) 2018-05-23
JP2019536715A (ja) 2019-12-19
CN109937472A (zh) 2019-06-25
MY193744A (en) 2022-10-27

Similar Documents

Publication Publication Date Title
KR102413016B1 (ko) 이송 롤러
TW201110838A (en) Method and assembly for treating a planar material to be treated and device for removing or holding off treatment liquid
KR20150133692A (ko) 스위퍼 롤러, 이것을 사용한 플라스틱 필름의 제조 장치 및 제조 방법
KR20170074984A (ko) 중합체를 기재에 고정시키는 장치 및 방법
JP2005517613A (ja) コンベヤ処理ラインで平坦な加工物を搬送するための装置および方法
JP2006237587A5 (enExample)
JP2012528058A (ja) 物品を搬送する搬送ローラ
CN105592944B (zh) 对基板进行的空间有限的加工
WO2018090303A1 (zh) 传送装置和玻璃清洗装置
EP3124125B1 (en) Coating device, coating method, and method for producing resin film having coating film
KR102339204B1 (ko) 정전기 방전 유닛
JP2019536715A5 (enExample)
JP4652794B2 (ja) 連続設備で平坦な材料を接触せずに搬送および処理する方法および装置
TW201323094A (zh) 基板表面處理之裝置
JP5648593B2 (ja) 塗工装置、及び塗工方法
JP4695452B2 (ja) 洗浄用具の製造方法及び製造装置
JP3591165B2 (ja) 金属ストリップ搬送方法および搬送設備
JP6227373B2 (ja) ゴムシートへの離型剤塗布装置
JP2017054680A (ja) 電極の製造方法
CN115331963A (zh) 电极箔加工装置、电极箔加工工艺及电极箔
CN107776186B (zh) 转印涂布装置
CN107408523B (zh) 用于半导体晶片的湿化学处理的直排湿式工作台装置及方法
JP2002012999A (ja) 板状ワークの水平搬送式表面処理装置
TWM566904U (zh) 運送滾輪、運送裝置、及基板處理設備
JP2010083596A (ja) 搬送ローラおよびこれを用いたシート状基板の搬送方法

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000