JP2019536715A - 搬送ローラー - Google Patents
搬送ローラー Download PDFInfo
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- JP2019536715A JP2019536715A JP2019546975A JP2019546975A JP2019536715A JP 2019536715 A JP2019536715 A JP 2019536715A JP 2019546975 A JP2019546975 A JP 2019546975A JP 2019546975 A JP2019546975 A JP 2019546975A JP 2019536715 A JP2019536715 A JP 2019536715A
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- transport roller
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H5/00—Feeding articles separated from piles; Feeding articles to machines
- B65H5/06—Feeding articles separated from piles; Feeding articles to machines by rollers or balls, e.g. between rollers
- B65H5/062—Feeding articles separated from piles; Feeding articles to machines by rollers or balls, e.g. between rollers between rollers or balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Rollers For Roller Conveyors For Transfer (AREA)
- Rolls And Other Rotary Bodies (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Delivering By Means Of Belts And Rollers (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
本明細書では、接触体は表面積を提供し、前記表面積の一部は接触領域と接触せず、接触領域と接触しない表面積は、接触体の表面積に基づいて、10%〜95%、好ましくは30%〜80%、より好ましくは35%〜70%の範囲である。例えば、保持ローラー対のために本発明の搬送ローラーを利用するような特定の目的のためには、接触領域と接触しない表面積は、2%〜50%、より好ましくは3.5%〜35%、さらにより好ましくは4%〜22%の範囲であることが有益であることが典型的に判明した。
2 水平搬送システム
3 基板
4 改質表面
5、5’、5’、5’’ 接触領域
6、6’、6’、6’’ 凹部
7 基板と接触しない表面
8 処理液
9 処理液の移動
10 搬送ローラーの移動方向
11 堰
12 搬送ローラー中央部分
13 コーティング材
14、14’、14’’、14’’’、14’’’’、14’’’’ 線状凹部
15 改質表面のない搬送ローラー
Claims (13)
- 基板(3)を搬送するための水平搬送システム(2)の搬送ローラー(1,1’)であって、前記搬送ローラー(1,1’)は、基本的に中実体ローラーの形状を有し、
前記搬送ローラー(1,1’)は、前記基板(3)との非均一な接触を提供する改質表面(4)をさらに含み、
前記改質表面(4)が前記基板(3)と接触する接触領域(5,5’,5’’,5’’’)、および前記基板に接触しない、前記接触領域(5,5’,5’’,5’’’)の間の凹部(6,6’,6’’,6’’’)を含み、
前記改質表面(4)は、前記搬送ローラー(1,1’)によって移送される間、前記搬送ローラー(1,1’)の両側における液体または気体交換を提供するよう適合され、前記改質表面(4)は、ポリマーまたは金属などの基本的に均質な材料から構成され、前記均質な材料は、繊維状材料または発泡体から作られていないことを特徴とする、搬送ローラー(1,1’)。 - 前記改質表面(4)が線状凹部(6,6’,6’’,6’’’)を提供する、請求項1に記載の搬送ローラー(1,1’)。
- 各凹部(6,6’,6’’,6’’’)が表面を提供し、断面において面積は、各凹部(6,6’,6’’,6’’’)の前記表面および接触ラインまたは接触円の間に囲まれ、前記搬送ローラー(1,1’)の軸に沿った断面における前記面積は、最大5mm2であり、前記搬送ローラー(1,1’)の前記軸に垂直の断面における前記面積は、最大12mm2、またはその両方であり、合計で、対応する断面における前記凹部(6,6’,6’’,6’’’)全面積の合計の少なくとも90%である、請求項1または2に記載の搬送ローラー(1,1’)。
- 対応する断面における前記接触領域の数に基づき、前記改質表面(4)の前記接触領域(5,5’,5’’,5’’’)の少なくとも90%が、前記搬送ローラー(1,1’)の軸に沿った断面において最大1.3cmの長さ、前記搬送ローラー(1,1’)の前記軸に垂直の断面において最大0.8cmの長さを有するか、またはその両方である、請求項1〜3のいずれか一項に記載の搬送ローラー(1,1’)。
- 前記改質表面(4)が接触ラインを提供し、各凹部(6,6’,6’’,6’’’)が表面を提供し、前記搬送ローラー(1,1’),の軸に沿った断面において面積は、各凹部(6,6’,6’’,6’’’)の前記表面および前記接触ラインの間に囲まれ、前記面積は合計で、前記接触ラインの長さに基づき、1m長当たり最大40mm2である、請求項1〜4のいずれか一項に記載の搬送ローラー(1,1’)。
- 前記改質表面(4)が、接触ラインに沿って1cm毎に、接触円に沿って1cm毎に、またはその両方において、少なくとも1つの接触領域(5,5’,5’’,5’’’)を含む、請求項1〜5のいずれか一項に記載の搬送ローラー(1,1’)。
- 前記接触領域(5,5’,5’’,5’’’)の任意の接触点が、最大0.8cmの次の凹部(6,6’,6’’,6’’’)までの距離を提供する、請求項1〜6のいずれか一項に記載の搬送ローラー(1,1’)。
- 隣接する接触領域が最大7mmの距離を有し、かつ
隣接する凹部(6,6’,6’’,6’’’)が最大6mmの距離を有する、請求項1〜7のいずれか一項に記載の搬送ローラー(1,1’)。 - 搬送ローラーを含む水平搬送システムであって、少なくとも1つの搬送ローラーが請求項1〜8のいずれか一項に記載の搬送ローラー(1,1’)である、水平搬送システム。
- 請求項1〜8のいずれか一項に記載の少なくとも2つの搬送ローラー(1,1’)が保持ローラー対として配置されている、請求項9に記載の水平搬送システム。
- 湿式処理のための処理装置であって、請求項1〜8のいずれか一項に記載の少なくとも1つの搬送ローラー(1,1’)、または請求項9または10に記載の少なくとも1つの水平搬送システムを含む、処理装置。
- 基板(3)を処理する方法であって、前記方法は、請求項1〜8のいずれか一項に記載の搬送ローラー(1,1’)、請求項9または10に記載の水平搬送システム、または請求項11に記載の処理装置を用いて前記基板(3)を搬送するステップを含む、方法。
- 基板(3)を水平に搬送するための、請求項1〜8のいずれか一項に記載の搬送ローラー(1,1’)の使用。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP16199129.4A EP3324426B1 (en) | 2016-11-16 | 2016-11-16 | Transport roller |
EP16199129.4 | 2016-11-16 | ||
PCT/EP2017/073933 WO2018091174A1 (en) | 2016-11-16 | 2017-09-21 | Transport roller |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2019536715A true JP2019536715A (ja) | 2019-12-19 |
JP2019536715A5 JP2019536715A5 (ja) | 2020-10-15 |
JP7308752B2 JP7308752B2 (ja) | 2023-07-14 |
Family
ID=57348489
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019546975A Active JP7308752B2 (ja) | 2016-11-16 | 2017-09-21 | 搬送ローラー |
Country Status (9)
Country | Link |
---|---|
US (1) | US11097913B2 (ja) |
EP (1) | EP3324426B1 (ja) |
JP (1) | JP7308752B2 (ja) |
KR (1) | KR102413016B1 (ja) |
CN (1) | CN109937472B (ja) |
MY (1) | MY193744A (ja) |
PH (1) | PH12019501083A1 (ja) |
TW (1) | TWI661988B (ja) |
WO (1) | WO2018091174A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113003223B (zh) * | 2021-04-23 | 2023-06-30 | 成都京东方显示科技有限公司 | 传送装置 |
Citations (3)
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JPS63295789A (ja) * | 1987-03-17 | 1988-12-02 | フエリツクス・ベトヒヤー・ゲゼルシヤフト・ミト・ベシユレンクテル・ハフツング・ウント・コムパニー | 帯状材の脱水用圧搾ロール |
JPH04129218A (ja) * | 1990-09-19 | 1992-04-30 | Mitsubishi Electric Corp | 水切り装置 |
JPH08102582A (ja) * | 1994-09-30 | 1996-04-16 | Mitsubishi Paper Mills Ltd | プリント配線基板処理装置 |
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JPH10314684A (ja) * | 1997-05-21 | 1998-12-02 | Speedfam Co Ltd | ディスク形ワークの洗浄方法及び装置 |
EP0993023A1 (en) * | 1998-10-05 | 2000-04-12 | Agfa-Gevaert N.V. | Method for transferring a web-or sheet-like material into a clean room |
TW445506B (en) * | 1999-05-27 | 2001-07-11 | Lam Res Corp | Wafer cascade scrubber |
JP2004299984A (ja) * | 2003-03-31 | 2004-10-28 | Nichias Corp | ディスクロール及びその製造方法 |
DE102005062528A1 (de) * | 2005-12-16 | 2007-06-21 | Gebr. Schmid Gmbh & Co. | Vorrichtung und Verfahren zur Oberflächenbehandlung von Substraten |
US8535474B2 (en) * | 2007-08-06 | 2013-09-17 | Kao Corporation | Liquid applicator |
BRPI0819812A2 (pt) * | 2007-11-19 | 2015-05-26 | Procter & Gamble | Aparelho para ativar uma manta |
DE102007061581A1 (de) * | 2007-12-18 | 2009-06-25 | Felix Kunze-Concewitz | Vorrichtung und Verfahren zum Reinigen von Substraten für mikroelektronische Anwendungen durch rotierende Walzen |
JP5431863B2 (ja) * | 2009-10-19 | 2014-03-05 | 大日本スクリーン製造株式会社 | 基板処理装置 |
US8684169B2 (en) * | 2010-08-31 | 2014-04-01 | Itoh Denki Co., Ltd. | Transfer device |
JP5712589B2 (ja) * | 2010-12-07 | 2015-05-07 | セイコーエプソン株式会社 | 印刷装置 |
KR20130006987A (ko) * | 2011-06-28 | 2013-01-18 | 삼성전기주식회사 | 기판 이송용 롤러 |
CN202606424U (zh) * | 2012-03-30 | 2012-12-19 | 明基材料有限公司 | 清洁装置 |
TW201531584A (zh) * | 2013-12-20 | 2015-08-16 | Atotech Deutschland Gmbh | 在用於電流或溼式化學金屬沉積之水平處理裝置之處理區域內積聚處理液之裝置 |
EP2886685A1 (en) * | 2013-12-20 | 2015-06-24 | ATOTECH Deutschland GmbH | Device for accumulating a treatment liquid inside of a treatment area of a horizontal processing apparatus for a galvanic or wet-chemical metal deposition |
GB201509080D0 (en) | 2015-05-27 | 2015-07-08 | Landa Labs 2012 Ltd | Coating apparatus |
DE102016210883A1 (de) | 2016-06-17 | 2017-12-21 | Singulus Technologies Ag | Vorrichtung und Verfahren zur Behandlung von Substraten unter Verwendung einer Auflagerolle mit porösem Material |
-
2016
- 2016-11-16 EP EP16199129.4A patent/EP3324426B1/en active Active
-
2017
- 2017-09-21 WO PCT/EP2017/073933 patent/WO2018091174A1/en active Application Filing
- 2017-09-21 US US16/345,747 patent/US11097913B2/en active Active
- 2017-09-21 JP JP2019546975A patent/JP7308752B2/ja active Active
- 2017-09-21 KR KR1020197015807A patent/KR102413016B1/ko active IP Right Grant
- 2017-09-21 MY MYPI2019002379A patent/MY193744A/en unknown
- 2017-09-21 CN CN201780070258.0A patent/CN109937472B/zh active Active
- 2017-10-20 TW TW106136031A patent/TWI661988B/zh active
-
2019
- 2019-05-15 PH PH12019501083A patent/PH12019501083A1/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63295789A (ja) * | 1987-03-17 | 1988-12-02 | フエリツクス・ベトヒヤー・ゲゼルシヤフト・ミト・ベシユレンクテル・ハフツング・ウント・コムパニー | 帯状材の脱水用圧搾ロール |
JPH04129218A (ja) * | 1990-09-19 | 1992-04-30 | Mitsubishi Electric Corp | 水切り装置 |
JPH08102582A (ja) * | 1994-09-30 | 1996-04-16 | Mitsubishi Paper Mills Ltd | プリント配線基板処理装置 |
Also Published As
Publication number | Publication date |
---|---|
US11097913B2 (en) | 2021-08-24 |
WO2018091174A1 (en) | 2018-05-24 |
TWI661988B (zh) | 2019-06-11 |
JP7308752B2 (ja) | 2023-07-14 |
CN109937472A (zh) | 2019-06-25 |
MY193744A (en) | 2022-10-27 |
TW201819269A (zh) | 2018-06-01 |
EP3324426B1 (en) | 2021-05-05 |
KR102413016B1 (ko) | 2022-06-23 |
PH12019501083A1 (en) | 2019-08-19 |
EP3324426A1 (en) | 2018-05-23 |
CN109937472B (zh) | 2023-03-31 |
KR20190082838A (ko) | 2019-07-10 |
US20200055684A1 (en) | 2020-02-20 |
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