TWI661988B - 運輸輥及其用途、含有運輸輥之水平運輸系統、用於溼處理之處理裝置、及處理一基板之方法 - Google Patents
運輸輥及其用途、含有運輸輥之水平運輸系統、用於溼處理之處理裝置、及處理一基板之方法 Download PDFInfo
- Publication number
- TWI661988B TWI661988B TW106136031A TW106136031A TWI661988B TW I661988 B TWI661988 B TW I661988B TW 106136031 A TW106136031 A TW 106136031A TW 106136031 A TW106136031 A TW 106136031A TW I661988 B TWI661988 B TW I661988B
- Authority
- TW
- Taiwan
- Prior art keywords
- transport roller
- transport
- contact
- substrate
- roller
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 117
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000012545 processing Methods 0.000 claims abstract description 43
- 239000007788 liquid Substances 0.000 claims description 48
- 239000000463 material Substances 0.000 claims description 25
- 239000007787 solid Substances 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 229920000642 polymer Polymers 0.000 claims description 6
- 239000002657 fibrous material Substances 0.000 claims description 4
- 239000006260 foam Substances 0.000 claims description 4
- 230000001976 improved effect Effects 0.000 abstract description 6
- 229920000620 organic polymer Polymers 0.000 description 18
- 230000009286 beneficial effect Effects 0.000 description 15
- -1 polyethylene Polymers 0.000 description 13
- 238000000576 coating method Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 8
- 238000001465 metallisation Methods 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 239000004698 Polyethylene Substances 0.000 description 7
- 229920000573 polyethylene Polymers 0.000 description 7
- 239000004743 Polypropylene Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 229920001155 polypropylene Polymers 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 229920002943 EPDM rubber Polymers 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 239000011162 core material Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000000608 laser ablation Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002679 ablation Methods 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000000053 physical method Methods 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000013519 translation Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000010146 3D printing Methods 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000002848 electrochemical method Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002739 metals Chemical group 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 238000000110 selective laser sintering Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H5/00—Feeding articles separated from piles; Feeding articles to machines
- B65H5/06—Feeding articles separated from piles; Feeding articles to machines by rollers or balls, e.g. between rollers
- B65H5/062—Feeding articles separated from piles; Feeding articles to machines by rollers or balls, e.g. between rollers between rollers or balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Rollers For Roller Conveyors For Transfer (AREA)
- Rolls And Other Rotary Bodies (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Delivering By Means Of Belts And Rollers (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ??16199129.4 | 2016-11-16 | ||
| EP16199129.4A EP3324426B1 (en) | 2016-11-16 | 2016-11-16 | Transport roller |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201819269A TW201819269A (zh) | 2018-06-01 |
| TWI661988B true TWI661988B (zh) | 2019-06-11 |
Family
ID=57348489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106136031A TWI661988B (zh) | 2016-11-16 | 2017-10-20 | 運輸輥及其用途、含有運輸輥之水平運輸系統、用於溼處理之處理裝置、及處理一基板之方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US11097913B2 (enExample) |
| EP (1) | EP3324426B1 (enExample) |
| JP (1) | JP7308752B2 (enExample) |
| KR (1) | KR102413016B1 (enExample) |
| CN (1) | CN109937472B (enExample) |
| MY (1) | MY193744A (enExample) |
| PH (1) | PH12019501083A1 (enExample) |
| TW (1) | TWI661988B (enExample) |
| WO (1) | WO2018091174A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022037791A1 (en) * | 2020-08-21 | 2022-02-24 | Applied Materials, Inc. | Vacuum deposition system, substrate transport system, and method of transporting a substrate through a vacuum chamber |
| CN113003223B (zh) * | 2021-04-23 | 2023-06-30 | 成都京东方显示科技有限公司 | 传送装置 |
| WO2025038243A1 (en) * | 2023-08-15 | 2025-02-20 | Parata Systems, Llc | Roller used in device for pharmaceutical pouch packaging |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6012193A (en) * | 1997-05-21 | 2000-01-11 | Speedfam Co., Ltd. | Apparatus for washing disc-shaped workpieces |
| JP2004299984A (ja) * | 2003-03-31 | 2004-10-28 | Nichias Corp | ディスクロール及びその製造方法 |
| CN101742980A (zh) * | 2007-08-06 | 2010-06-16 | 花王株式会社 | 液体涂敷装置 |
| CN101868204A (zh) * | 2007-11-19 | 2010-10-20 | 宝洁公司 | 用于一次性吸收制品的外覆盖件 |
| CN202606424U (zh) * | 2012-03-30 | 2012-12-19 | 明基材料有限公司 | 清洁装置 |
| TW201531584A (zh) * | 2013-12-20 | 2015-08-16 | Atotech Deutschland Gmbh | 在用於電流或溼式化學金屬沉積之水平處理裝置之處理區域內積聚處理液之裝置 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3708605A1 (de) * | 1987-03-17 | 1988-09-29 | Boettcher Gmbh & Co Felix | Presswalze fuer die entwaesserung von stoffbahnen |
| JPH04129218A (ja) * | 1990-09-19 | 1992-04-30 | Mitsubishi Electric Corp | 水切り装置 |
| JPH08102582A (ja) * | 1994-09-30 | 1996-04-16 | Mitsubishi Paper Mills Ltd | プリント配線基板処理装置 |
| EP0993023A1 (en) * | 1998-10-05 | 2000-04-12 | Agfa-Gevaert N.V. | Method for transferring a web-or sheet-like material into a clean room |
| AU5296600A (en) * | 1999-05-27 | 2000-12-18 | Lam Research Corporation | Wafer cascade scrubber |
| DE102005062528A1 (de) * | 2005-12-16 | 2007-06-21 | Gebr. Schmid Gmbh & Co. | Vorrichtung und Verfahren zur Oberflächenbehandlung von Substraten |
| DE102007061581A1 (de) * | 2007-12-18 | 2009-06-25 | Felix Kunze-Concewitz | Vorrichtung und Verfahren zum Reinigen von Substraten für mikroelektronische Anwendungen durch rotierende Walzen |
| JP5431863B2 (ja) * | 2009-10-19 | 2014-03-05 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| US8684169B2 (en) * | 2010-08-31 | 2014-04-01 | Itoh Denki Co., Ltd. | Transfer device |
| JP5712589B2 (ja) * | 2010-12-07 | 2015-05-07 | セイコーエプソン株式会社 | 印刷装置 |
| KR20130006987A (ko) * | 2011-06-28 | 2013-01-18 | 삼성전기주식회사 | 기판 이송용 롤러 |
| EP2886685A1 (en) * | 2013-12-20 | 2015-06-24 | ATOTECH Deutschland GmbH | Device for accumulating a treatment liquid inside of a treatment area of a horizontal processing apparatus for a galvanic or wet-chemical metal deposition |
| GB201509080D0 (en) | 2015-05-27 | 2015-07-08 | Landa Labs 2012 Ltd | Coating apparatus |
| DE102016210883A1 (de) | 2016-06-17 | 2017-12-21 | Singulus Technologies Ag | Vorrichtung und Verfahren zur Behandlung von Substraten unter Verwendung einer Auflagerolle mit porösem Material |
-
2016
- 2016-11-16 EP EP16199129.4A patent/EP3324426B1/en active Active
-
2017
- 2017-09-21 CN CN201780070258.0A patent/CN109937472B/zh active Active
- 2017-09-21 KR KR1020197015807A patent/KR102413016B1/ko active Active
- 2017-09-21 WO PCT/EP2017/073933 patent/WO2018091174A1/en not_active Ceased
- 2017-09-21 MY MYPI2019002379A patent/MY193744A/en unknown
- 2017-09-21 US US16/345,747 patent/US11097913B2/en active Active
- 2017-09-21 JP JP2019546975A patent/JP7308752B2/ja active Active
- 2017-10-20 TW TW106136031A patent/TWI661988B/zh active
-
2019
- 2019-05-15 PH PH12019501083A patent/PH12019501083A1/en unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6012193A (en) * | 1997-05-21 | 2000-01-11 | Speedfam Co., Ltd. | Apparatus for washing disc-shaped workpieces |
| JP2004299984A (ja) * | 2003-03-31 | 2004-10-28 | Nichias Corp | ディスクロール及びその製造方法 |
| CN101742980A (zh) * | 2007-08-06 | 2010-06-16 | 花王株式会社 | 液体涂敷装置 |
| CN101868204A (zh) * | 2007-11-19 | 2010-10-20 | 宝洁公司 | 用于一次性吸收制品的外覆盖件 |
| CN202606424U (zh) * | 2012-03-30 | 2012-12-19 | 明基材料有限公司 | 清洁装置 |
| TW201531584A (zh) * | 2013-12-20 | 2015-08-16 | Atotech Deutschland Gmbh | 在用於電流或溼式化學金屬沉積之水平處理裝置之處理區域內積聚處理液之裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190082838A (ko) | 2019-07-10 |
| EP3324426A1 (en) | 2018-05-23 |
| EP3324426B1 (en) | 2021-05-05 |
| KR102413016B1 (ko) | 2022-06-23 |
| US20200055684A1 (en) | 2020-02-20 |
| TW201819269A (zh) | 2018-06-01 |
| CN109937472A (zh) | 2019-06-25 |
| PH12019501083A1 (en) | 2019-08-19 |
| WO2018091174A1 (en) | 2018-05-24 |
| JP2019536715A (ja) | 2019-12-19 |
| US11097913B2 (en) | 2021-08-24 |
| MY193744A (en) | 2022-10-27 |
| CN109937472B (zh) | 2023-03-31 |
| JP7308752B2 (ja) | 2023-07-14 |
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