KR102399146B1 - 수지 조성물 - Google Patents

수지 조성물 Download PDF

Info

Publication number
KR102399146B1
KR102399146B1 KR1020170124584A KR20170124584A KR102399146B1 KR 102399146 B1 KR102399146 B1 KR 102399146B1 KR 1020170124584 A KR1020170124584 A KR 1020170124584A KR 20170124584 A KR20170124584 A KR 20170124584A KR 102399146 B1 KR102399146 B1 KR 102399146B1
Authority
KR
South Korea
Prior art keywords
resin
resin composition
component
group
manufactured
Prior art date
Application number
KR1020170124584A
Other languages
English (en)
Korean (ko)
Other versions
KR20180035164A (ko
Inventor
히로유키 사카우치
Original Assignee
아지노모토 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아지노모토 가부시키가이샤 filed Critical 아지노모토 가부시키가이샤
Publication of KR20180035164A publication Critical patent/KR20180035164A/ko
Application granted granted Critical
Publication of KR102399146B1 publication Critical patent/KR102399146B1/ko

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C08L75/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/54—Polycondensates of aldehydes
    • C08G18/542—Polycondensates of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/69—Polymers of conjugated dienes
    • C08G18/698—Mixtures with compounds of group C08G18/40
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/04—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
    • C08L27/06—Homopolymers or copolymers of vinyl chloride
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • C09D175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
KR1020170124584A 2016-09-28 2017-09-26 수지 조성물 KR102399146B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-190274 2016-09-28
JP2016190274A JP7102093B2 (ja) 2016-09-28 2016-09-28 樹脂組成物、樹脂シート、回路基板及び半導体チップパッケージ

Publications (2)

Publication Number Publication Date
KR20180035164A KR20180035164A (ko) 2018-04-05
KR102399146B1 true KR102399146B1 (ko) 2022-05-19

Family

ID=61833863

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170124584A KR102399146B1 (ko) 2016-09-28 2017-09-26 수지 조성물

Country Status (4)

Country Link
JP (1) JP7102093B2 (zh)
KR (1) KR102399146B1 (zh)
CN (1) CN108299817B (zh)
TW (2) TWI745425B (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108219371B (zh) * 2017-12-29 2020-08-18 广东生益科技股份有限公司 环氧树脂组合物、预浸料、层压板和印刷电路板
JP7214981B2 (ja) 2018-05-31 2023-01-31 味の素株式会社 樹脂組成物、シート状積層材料、プリント配線板及び半導体装置
JP7316551B2 (ja) * 2018-08-09 2023-07-28 三菱瓦斯化学株式会社 プリント配線板用樹脂組成物、プリプレグ、積層板、金属箔張積層板、プリント配線板及び多層プリント配線板
JP7087912B2 (ja) * 2018-10-25 2022-06-21 味の素株式会社 樹脂組成物
JP7124657B2 (ja) * 2018-11-14 2022-08-24 味の素株式会社 樹脂組成物、樹脂シート、プリント配線板及び半導体装置
JP2020090570A (ja) * 2018-12-03 2020-06-11 味の素株式会社 樹脂組成物
US20220025171A1 (en) * 2018-12-12 2022-01-27 Panasonic Intellectual Property Management Co., Ltd. Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board
JP2020128501A (ja) 2019-02-08 2020-08-27 味の素株式会社 樹脂組成物
JP2020138996A (ja) * 2019-02-26 2020-09-03 味の素株式会社 樹脂組成物
JP7151550B2 (ja) * 2019-02-26 2022-10-12 味の素株式会社 樹脂組成物
CN109943072A (zh) * 2019-02-26 2019-06-28 南亚新材料科技股份有限公司 一种热固性树脂组合物
CN109971175B (zh) * 2019-03-18 2021-09-21 苏州生益科技有限公司 改性马来酰亚胺树脂组合物及其制备的半固化片和层压板
JP7282011B2 (ja) * 2019-10-28 2023-05-26 サンスター技研株式会社 硬化性組成物及び硬化物
KR20220131239A (ko) * 2020-01-23 2022-09-27 쇼와덴코머티리얼즈가부시끼가이샤 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법
JP7298518B2 (ja) * 2020-03-06 2023-06-27 味の素株式会社 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板及び半導体装置
JP7424167B2 (ja) * 2020-03-31 2024-01-30 味の素株式会社 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置
CN114561170B (zh) * 2022-03-28 2023-08-08 深圳市纽菲斯新材料科技有限公司 一种绝缘胶膜及其制备方法和应用
WO2024062923A1 (ja) * 2022-09-21 2024-03-28 東レ株式会社 フィルム、積層体、プラズマ処理装置、及び積層体の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005036126A (ja) * 2003-07-16 2005-02-10 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びそれを用いたフレキシブル印刷配線板材料。
WO2016072404A1 (ja) * 2014-11-06 2016-05-12 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、及びプリント配線板
WO2016125664A1 (ja) * 2015-02-05 2016-08-11 味の素株式会社 樹脂組成物

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6346598B1 (en) * 1998-11-06 2002-02-12 Tomoegawa Paper Co., Ltd. Thermosetting low-dielectric resin composition and use thereof
TWI332521B (en) * 2000-03-31 2010-11-01 Hitachi Chemical Co Ltd Adhesive films for semiconductor
TWI239342B (en) * 2000-08-08 2005-09-11 Toray Industries Flame-retarded resin composition and shaped article made from thereof
KR100837645B1 (ko) * 2003-12-10 2008-06-13 산요가세이고교 가부시키가이샤 토너용 폴리에스테르 수지 및 토너 조성물
TW200602427A (en) * 2004-03-30 2006-01-16 Taiyo Ink Mfg Co Ltd Thermosetting resin composition and multilayered printed wiring board comprising the same
JP4929623B2 (ja) 2004-06-21 2012-05-09 味の素株式会社 変性ポリイミド樹脂を含有する熱硬化性樹脂組成物
SG156623A1 (en) * 2004-11-30 2009-11-26 Sumitomo Bakelite Co Epoxy resin composition and semiconductor device
JP5609110B2 (ja) * 2007-06-14 2014-10-22 味の素株式会社 多層プリント配線板の層間絶縁用樹脂組成物
WO2009040921A1 (ja) * 2007-09-27 2009-04-02 Panasonic Electric Works Co., Ltd. エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ及び金属張積層板
AU2010253022B2 (en) * 2009-05-28 2015-04-09 Mitsubishi Chemical Corporation EVOH resin composition, and molded article and multilayer structure both comprising same
TWI548696B (zh) * 2009-12-30 2016-09-11 Taiwan Union Technology Corp Electronic material composition
JP5439254B2 (ja) * 2010-03-31 2014-03-12 太陽ホールディングス株式会社 感光性樹脂組成物
JP2015038162A (ja) * 2010-04-20 2015-02-26 日本ビー・ケミカル株式会社 ポリエステル樹脂及びその用途
TW201213441A (en) * 2010-05-10 2012-04-01 Ajinomoto Kk Resin composition
US9472317B2 (en) * 2010-10-13 2016-10-18 Teijin Limited Resin compostion for wire coating and insulated wire comprising the same
JP5767916B2 (ja) 2011-09-06 2015-08-26 日清紡ホールディングス株式会社 電気絶縁性樹脂組成物および金属基板
JP6026095B2 (ja) 2011-10-31 2016-11-16 太陽インキ製造株式会社 熱硬化性樹脂組成物及びその硬化物、並びにそれを用いたプリント配線板
JP6028349B2 (ja) 2012-03-14 2016-11-16 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ及び積層板
KR101987280B1 (ko) * 2012-12-20 2019-06-10 삼성전기주식회사 인쇄회로기판용 수지 조성물, 절연필름, 프리프레그 및 인쇄회로기판
TWI564316B (zh) * 2013-07-08 2017-01-01 旭化成化學股份有限公司 經改質之樹脂及樹脂組成物
JP2015151483A (ja) 2014-02-17 2015-08-24 三菱瓦斯化学株式会社 レジンシート、金属箔張積層板及びプリント配線板
JP5778304B2 (ja) * 2014-02-28 2015-09-16 古河電気工業株式会社 電子デバイス封止用樹脂組成物および電子デバイス
TW201542670A (zh) * 2014-03-04 2015-11-16 Frx Polymers Inc 環氧組成物
JP6409362B2 (ja) * 2014-06-25 2018-10-24 味の素株式会社 樹脂組成物
JP6672616B2 (ja) * 2014-06-30 2020-03-25 味の素株式会社 樹脂組成物、接着フィルム、プリント配線板及び半導体装置
JP5904256B2 (ja) * 2014-11-05 2016-04-13 味の素株式会社 樹脂組成物
WO2016114286A1 (ja) * 2015-01-13 2016-07-21 日立化成株式会社 樹脂組成物、樹脂層付き支持体、プリプレグ、積層板、多層プリント配線板及びミリ波レーダー用プリント配線板
TWI589628B (zh) * 2015-12-09 2017-07-01 中山台光電子材料有限公司 樹脂組合物
CN108476589B (zh) 2016-01-13 2021-10-26 太阳油墨制造株式会社 干膜和印刷电路板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005036126A (ja) * 2003-07-16 2005-02-10 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びそれを用いたフレキシブル印刷配線板材料。
WO2016072404A1 (ja) * 2014-11-06 2016-05-12 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、及びプリント配線板
WO2016125664A1 (ja) * 2015-02-05 2016-08-11 味の素株式会社 樹脂組成物

Also Published As

Publication number Publication date
KR20180035164A (ko) 2018-04-05
CN108299817A (zh) 2018-07-20
TW201826450A (zh) 2018-07-16
JP2018053092A (ja) 2018-04-05
TW202206553A (zh) 2022-02-16
TWI800019B (zh) 2023-04-21
TWI745425B (zh) 2021-11-11
JP7102093B2 (ja) 2022-07-19
CN108299817B (zh) 2021-10-29

Similar Documents

Publication Publication Date Title
KR102399146B1 (ko) 수지 조성물
JP7405182B2 (ja) 樹脂組成物
KR102573941B1 (ko) 수지 조성물
KR102610333B1 (ko) 수지 조성물
JP7067111B2 (ja) 樹脂組成物
KR102400677B1 (ko) 수지 조성물
KR102400207B1 (ko) 수지 조성물
KR20190029460A (ko) 수지 조성물
JP2022027768A (ja) 樹脂組成物
JP7066975B2 (ja) 樹脂組成物、樹脂シート、回路基板及び半導体チップパッケージ
JP7067656B2 (ja) 樹脂組成物
JP6874309B2 (ja) 樹脂組成物
JP2020172653A (ja) 樹脂組成物
JP7131593B2 (ja) 樹脂組成物
JP6690355B2 (ja) 樹脂組成物
JP7067594B2 (ja) 樹脂組成物
JP7264194B2 (ja) 樹脂組成物

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right