KR102393782B1 - 음향파 디바이스, 및 이를 이용한 안테나 듀플렉서, 모듈, 및 통신 디바이스 - Google Patents

음향파 디바이스, 및 이를 이용한 안테나 듀플렉서, 모듈, 및 통신 디바이스 Download PDF

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KR102393782B1
KR102393782B1 KR1020177000510A KR20177000510A KR102393782B1 KR 102393782 B1 KR102393782 B1 KR 102393782B1 KR 1020177000510 A KR1020177000510 A KR 1020177000510A KR 20177000510 A KR20177000510 A KR 20177000510A KR 102393782 B1 KR102393782 B1 KR 102393782B1
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wiring electrode
region
dielectric film
substrate
electrode
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KR20170045194A (ko
Inventor
미쯔노리 미야나리
요스께 하마오까
또루 야마지
히데까즈 나까니시
히로유끼 나까무라
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스카이워크스 필터 솔루션즈 재팬 씨오., 엘티디.
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02992—Details of bus bars, contact pads or other electrical connections for finger electrodes
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02897—Means for compensation or elimination of undesirable effects of strain or mechanical damage, e.g. strain due to bending influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02984—Protection measures against damaging
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
    • H03H9/0576—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including surface acoustic wave [SAW] devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14538—Formation
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
    • H03H9/72—Networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
    • H03H9/72—Networks using surface acoustic waves
    • H03H9/725—Duplexers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02834—Means for compensation or elimination of undesirable effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02937—Means for compensation or elimination of undesirable effects of chemical damage, e.g. corrosion

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
KR1020177000510A 2014-07-07 2015-06-26 음향파 디바이스, 및 이를 이용한 안테나 듀플렉서, 모듈, 및 통신 디바이스 Active KR102393782B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2014-139343 2014-07-07
JP2014139343 2014-07-07
PCT/JP2015/003223 WO2016006189A1 (en) 2014-07-07 2015-06-26 Acoustic wave devices, and antenna duplexers, modules, and communication devices using same

Publications (2)

Publication Number Publication Date
KR20170045194A KR20170045194A (ko) 2017-04-26
KR102393782B1 true KR102393782B1 (ko) 2022-05-03

Family

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Family Applications (1)

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KR1020177000510A Active KR102393782B1 (ko) 2014-07-07 2015-06-26 음향파 디바이스, 및 이를 이용한 안테나 듀플렉서, 모듈, 및 통신 디바이스

Country Status (5)

Country Link
US (2) US9628047B2 (enExample)
JP (1) JP6618521B2 (enExample)
KR (1) KR102393782B1 (enExample)
CN (1) CN106489239B (enExample)
WO (1) WO2016006189A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106489239B (zh) * 2014-07-07 2020-03-03 天工滤波方案日本有限公司 声波器件、以及使用该声波器件的天线双工器、模块和通信装置
JP2017522822A (ja) * 2014-07-28 2017-08-10 スカイワークスフィルターソリューションズジャパン株式会社 弾性波素子、アンテナデュプレクサ、モジュール及びこれらを使用する電子機器
KR101953219B1 (ko) * 2016-11-24 2019-02-28 가부시키가이샤 무라타 세이사쿠쇼 탄성파 장치, 고주파 프론트 엔드 회로 및 통신 장치
US10129623B2 (en) * 2017-03-15 2018-11-13 Microsoft Technology Licensing, Llc Electronic device having covering substrate carrying acoustic transducer and related technology
WO2019044310A1 (ja) * 2017-08-31 2019-03-07 株式会社村田製作所 弾性波装置およびそれを備えた弾性波モジュール
CN109192671A (zh) * 2018-09-25 2019-01-11 深圳市麦捷微电子科技股份有限公司 一种三维立体芯片生产工艺方法及其走线结构
US12500570B2 (en) 2021-09-29 2025-12-16 Skyworks Solutions, Inc. Shear horizontal mode acoustic wave device with multilayer interdigital transducer electrode
US12506464B2 (en) 2021-12-06 2025-12-23 Skyworks Solutions, Inc. Multi-band surface acoustic wave filters
US12648470B2 (en) 2022-03-30 2026-06-02 Skyworks Solutions, Inc. Package with integrated device die at least disposed within carrier

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JPH1141054A (ja) * 1997-07-16 1999-02-12 Toshiba Corp 弾性表面波素子、弾性表面波素子の製造方法および接続装置
JPH1168504A (ja) * 1997-08-11 1999-03-09 Murata Mfg Co Ltd 表面波装置
JP2004129224A (ja) * 2002-07-31 2004-04-22 Murata Mfg Co Ltd 圧電部品およびその製造方法
CN1788415B (zh) * 2004-01-19 2012-09-12 株式会社村田制作所 边界声波装置
JP2005210475A (ja) * 2004-01-23 2005-08-04 Murata Mfg Co Ltd 電子部品及びその製造方法
CN1842961B (zh) * 2004-07-23 2010-10-20 株式会社村田制作所 声表面波器件
JP4670578B2 (ja) * 2005-10-11 2011-04-13 沖電気工業株式会社 傾斜面の形成方法、配線構造体及びその形成方法、段差構造の被覆層、並びに、半導体装置
JP2007142491A (ja) * 2005-11-14 2007-06-07 Murata Mfg Co Ltd 弾性表面波装置の製造方法及び弾性表面波装置
JP4811409B2 (ja) * 2005-11-14 2011-11-09 株式会社村田製作所 弾性表面波装置の製造方法
JP5110611B2 (ja) * 2007-07-26 2012-12-26 京セラ株式会社 弾性表面波装置及び通信装置
JP5166053B2 (ja) 2008-01-29 2013-03-21 太陽誘電株式会社 弾性波デバイス及びその製造方法
JP2009232241A (ja) * 2008-03-24 2009-10-08 Fujitsu Ltd 弾性波素子、フィルタ、通信装置、および弾性波素子の製造方法
JP4521451B2 (ja) * 2008-03-24 2010-08-11 富士通メディアデバイス株式会社 弾性表面波デバイス及びその製造方法
WO2011089906A1 (ja) * 2010-01-20 2011-07-28 パナソニック株式会社 弾性波装置
JP5402841B2 (ja) * 2010-06-14 2014-01-29 株式会社村田製作所 弾性表面波デバイス
WO2011161987A1 (ja) * 2010-06-22 2011-12-29 株式会社村田製作所 ラダー型弾性波フィルタ装置及び分波器
JP5585389B2 (ja) * 2010-10-29 2014-09-10 株式会社村田製作所 弾性波素子及びその製造方法
WO2013094517A1 (ja) * 2011-12-21 2013-06-27 株式会社村田製作所 弾性境界波装置及びその製造方法
JP6092535B2 (ja) * 2012-07-04 2017-03-08 太陽誘電株式会社 ラム波デバイスおよびその製造方法
JP5880529B2 (ja) * 2013-11-29 2016-03-09 株式会社村田製作所 弾性表面波フィルタ
CN106489239B (zh) * 2014-07-07 2020-03-03 天工滤波方案日本有限公司 声波器件、以及使用该声波器件的天线双工器、模块和通信装置

Also Published As

Publication number Publication date
WO2016006189A1 (en) 2016-01-14
JP6618521B2 (ja) 2019-12-11
US20160006410A1 (en) 2016-01-07
US10284171B2 (en) 2019-05-07
CN106489239A (zh) 2017-03-08
CN106489239B (zh) 2020-03-03
US9628047B2 (en) 2017-04-18
JP2017520195A (ja) 2017-07-20
US20170179921A1 (en) 2017-06-22
KR20170045194A (ko) 2017-04-26

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