JP6618521B2 - 弾性波デバイスと、これを使用したアンテナデュプレクサ、モジュール及び通信機器 - Google Patents

弾性波デバイスと、これを使用したアンテナデュプレクサ、モジュール及び通信機器 Download PDF

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JP6618521B2
JP6618521B2 JP2017500405A JP2017500405A JP6618521B2 JP 6618521 B2 JP6618521 B2 JP 6618521B2 JP 2017500405 A JP2017500405 A JP 2017500405A JP 2017500405 A JP2017500405 A JP 2017500405A JP 6618521 B2 JP6618521 B2 JP 6618521B2
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wiring electrode
region
electrode
wave device
dielectric film
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Japanese (ja)
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JP2017520195A5 (enExample
JP2017520195A (ja
Inventor
光則 宮成
光則 宮成
陽介 濱岡
陽介 濱岡
徹 山路
徹 山路
中西　秀和
秀和 中西
中村　弘幸
弘幸 中村
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スカイワークスフィルターソリューションズジャパン株式会社
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02992—Details of bus bars, contact pads or other electrical connections for finger electrodes
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02897—Means for compensation or elimination of undesirable effects of strain or mechanical damage, e.g. strain due to bending influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02984—Protection measures against damaging
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
    • H03H9/0576—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including surface acoustic wave [SAW] devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14538—Formation
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
    • H03H9/72—Networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
    • H03H9/72—Networks using surface acoustic waves
    • H03H9/725—Duplexers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02834—Means for compensation or elimination of undesirable effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02937—Means for compensation or elimination of undesirable effects of chemical damage, e.g. corrosion

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2017500405A 2014-07-07 2015-06-26 弾性波デバイスと、これを使用したアンテナデュプレクサ、モジュール及び通信機器 Active JP6618521B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014139343 2014-07-07
JP2014139343 2014-07-07
PCT/JP2015/003223 WO2016006189A1 (en) 2014-07-07 2015-06-26 Acoustic wave devices, and antenna duplexers, modules, and communication devices using same

Publications (3)

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JP2017520195A JP2017520195A (ja) 2017-07-20
JP2017520195A5 JP2017520195A5 (enExample) 2018-08-02
JP6618521B2 true JP6618521B2 (ja) 2019-12-11

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JP2017500405A Active JP6618521B2 (ja) 2014-07-07 2015-06-26 弾性波デバイスと、これを使用したアンテナデュプレクサ、モジュール及び通信機器

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Country Link
US (2) US9628047B2 (enExample)
JP (1) JP6618521B2 (enExample)
KR (1) KR102393782B1 (enExample)
CN (1) CN106489239B (enExample)
WO (1) WO2016006189A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106489239B (zh) * 2014-07-07 2020-03-03 天工滤波方案日本有限公司 声波器件、以及使用该声波器件的天线双工器、模块和通信装置
JP2017522822A (ja) * 2014-07-28 2017-08-10 スカイワークスフィルターソリューションズジャパン株式会社 弾性波素子、アンテナデュプレクサ、モジュール及びこれらを使用する電子機器
KR101953219B1 (ko) * 2016-11-24 2019-02-28 가부시키가이샤 무라타 세이사쿠쇼 탄성파 장치, 고주파 프론트 엔드 회로 및 통신 장치
US10129623B2 (en) * 2017-03-15 2018-11-13 Microsoft Technology Licensing, Llc Electronic device having covering substrate carrying acoustic transducer and related technology
WO2019044310A1 (ja) * 2017-08-31 2019-03-07 株式会社村田製作所 弾性波装置およびそれを備えた弾性波モジュール
CN109192671A (zh) * 2018-09-25 2019-01-11 深圳市麦捷微电子科技股份有限公司 一种三维立体芯片生产工艺方法及其走线结构
US12500570B2 (en) 2021-09-29 2025-12-16 Skyworks Solutions, Inc. Shear horizontal mode acoustic wave device with multilayer interdigital transducer electrode
US12506464B2 (en) 2021-12-06 2025-12-23 Skyworks Solutions, Inc. Multi-band surface acoustic wave filters
US12648470B2 (en) 2022-03-30 2026-06-02 Skyworks Solutions, Inc. Package with integrated device die at least disposed within carrier

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JPH1141054A (ja) * 1997-07-16 1999-02-12 Toshiba Corp 弾性表面波素子、弾性表面波素子の製造方法および接続装置
JPH1168504A (ja) * 1997-08-11 1999-03-09 Murata Mfg Co Ltd 表面波装置
JP2004129224A (ja) * 2002-07-31 2004-04-22 Murata Mfg Co Ltd 圧電部品およびその製造方法
CN1788415B (zh) * 2004-01-19 2012-09-12 株式会社村田制作所 边界声波装置
JP2005210475A (ja) * 2004-01-23 2005-08-04 Murata Mfg Co Ltd 電子部品及びその製造方法
CN1842961B (zh) * 2004-07-23 2010-10-20 株式会社村田制作所 声表面波器件
JP4670578B2 (ja) * 2005-10-11 2011-04-13 沖電気工業株式会社 傾斜面の形成方法、配線構造体及びその形成方法、段差構造の被覆層、並びに、半導体装置
JP2007142491A (ja) * 2005-11-14 2007-06-07 Murata Mfg Co Ltd 弾性表面波装置の製造方法及び弾性表面波装置
JP4811409B2 (ja) * 2005-11-14 2011-11-09 株式会社村田製作所 弾性表面波装置の製造方法
JP5110611B2 (ja) * 2007-07-26 2012-12-26 京セラ株式会社 弾性表面波装置及び通信装置
JP5166053B2 (ja) 2008-01-29 2013-03-21 太陽誘電株式会社 弾性波デバイス及びその製造方法
JP2009232241A (ja) * 2008-03-24 2009-10-08 Fujitsu Ltd 弾性波素子、フィルタ、通信装置、および弾性波素子の製造方法
JP4521451B2 (ja) * 2008-03-24 2010-08-11 富士通メディアデバイス株式会社 弾性表面波デバイス及びその製造方法
WO2011089906A1 (ja) * 2010-01-20 2011-07-28 パナソニック株式会社 弾性波装置
JP5402841B2 (ja) * 2010-06-14 2014-01-29 株式会社村田製作所 弾性表面波デバイス
WO2011161987A1 (ja) * 2010-06-22 2011-12-29 株式会社村田製作所 ラダー型弾性波フィルタ装置及び分波器
JP5585389B2 (ja) * 2010-10-29 2014-09-10 株式会社村田製作所 弾性波素子及びその製造方法
WO2013094517A1 (ja) * 2011-12-21 2013-06-27 株式会社村田製作所 弾性境界波装置及びその製造方法
JP6092535B2 (ja) * 2012-07-04 2017-03-08 太陽誘電株式会社 ラム波デバイスおよびその製造方法
JP5880529B2 (ja) * 2013-11-29 2016-03-09 株式会社村田製作所 弾性表面波フィルタ
CN106489239B (zh) * 2014-07-07 2020-03-03 天工滤波方案日本有限公司 声波器件、以及使用该声波器件的天线双工器、模块和通信装置

Also Published As

Publication number Publication date
WO2016006189A1 (en) 2016-01-14
US20160006410A1 (en) 2016-01-07
KR102393782B1 (ko) 2022-05-03
US10284171B2 (en) 2019-05-07
CN106489239A (zh) 2017-03-08
CN106489239B (zh) 2020-03-03
US9628047B2 (en) 2017-04-18
JP2017520195A (ja) 2017-07-20
US20170179921A1 (en) 2017-06-22
KR20170045194A (ko) 2017-04-26

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