KR102381358B1 - 레이저 구멍내기 가공 조건의 설정 방법 및 레이저 가공기 - Google Patents

레이저 구멍내기 가공 조건의 설정 방법 및 레이저 가공기 Download PDF

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KR102381358B1
KR102381358B1 KR1020150187406A KR20150187406A KR102381358B1 KR 102381358 B1 KR102381358 B1 KR 102381358B1 KR 1020150187406 A KR1020150187406 A KR 1020150187406A KR 20150187406 A KR20150187406 A KR 20150187406A KR 102381358 B1 KR102381358 B1 KR 102381358B1
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hole
laser
image
conditions
processing
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Korean (ko)
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KR20160111321A (ko
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유키 사에키
야스히코 키타
유 미노시마
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비아 메카닉스 가부시키가이샤
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
KR1020150187406A 2015-03-16 2015-12-28 레이저 구멍내기 가공 조건의 설정 방법 및 레이저 가공기 Active KR102381358B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015052041 2015-03-16
JPJP-P-2015-052041 2015-03-16
JPJP-P-2015-164599 2015-08-24
JP2015164599A JP6570921B2 (ja) 2015-03-16 2015-08-24 レーザ穴あけ加工条件の設定方法及びレーザ加工機

Publications (2)

Publication Number Publication Date
KR20160111321A KR20160111321A (ko) 2016-09-26
KR102381358B1 true KR102381358B1 (ko) 2022-03-30

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KR1020150187406A Active KR102381358B1 (ko) 2015-03-16 2015-12-28 레이저 구멍내기 가공 조건의 설정 방법 및 레이저 가공기

Country Status (4)

Country Link
JP (1) JP6570921B2 (enExample)
KR (1) KR102381358B1 (enExample)
CN (1) CN105983788B (enExample)
TW (1) TWI689366B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7066368B2 (ja) * 2017-10-24 2022-05-13 住友重機械工業株式会社 レーザ加工機の制御装置、レーザ加工方法、及びレーザ加工機
CN110455233B (zh) * 2019-08-08 2024-06-04 广州广合科技股份有限公司 一种pcb激光钻孔精度测试装置及方法
JP7305273B2 (ja) * 2019-09-19 2023-07-10 株式会社ディスコ レーザー加工方法及びレーザー加工装置
JP6841390B1 (ja) * 2020-05-29 2021-03-10 三菱電機株式会社 レーザ加工装置およびレーザ加工方法
CN115704678A (zh) * 2021-08-13 2023-02-17 深圳市大族数控科技股份有限公司 钻孔均匀性的检测方法、检测装置及存储介质

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002137074A (ja) * 2000-10-31 2002-05-14 Hitachi Via Mechanics Ltd レーザ加工方法およびレーザ加工機
JP2012148308A (ja) * 2011-01-19 2012-08-09 Keyence Corp 印字品質評価システム、レーザマーキング装置、印字条件設定装置、印字品質評価装置、印字条件設定プログラム、印字品質評価プログラム、コンピュータで読み取り可能な記録媒体

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10258375A (ja) * 1997-03-14 1998-09-29 Amada Co Ltd レーザ加工機およびその加工機を用いた真円度測定方法並びに駆動系検査方法
JP3614680B2 (ja) 1998-09-01 2005-01-26 松下電器産業株式会社 レーザ加工方法及び装置
JP2004223561A (ja) * 2003-01-22 2004-08-12 Sumitomo Heavy Ind Ltd レーザ加工方法及び装置
JP2006136923A (ja) * 2004-11-12 2006-06-01 Hitachi Via Mechanics Ltd レーザ加工機及びレーザ加工方法
JP4795886B2 (ja) * 2006-07-27 2011-10-19 株式会社キーエンス レーザ加工装置、レーザ加工条件設定装置、レーザ加工条件設定方法、レーザ加工条件設定プログラム
JP5336054B2 (ja) * 2007-07-18 2013-11-06 浜松ホトニクス株式会社 加工情報供給装置を備える加工情報供給システム
US8173931B2 (en) * 2008-06-13 2012-05-08 Electro Scientific Industries, Inc. Automatic recipe management for laser processing a work piece
JP4778031B2 (ja) * 2008-09-26 2011-09-21 日立ビアメカニクス株式会社 レーザ加工機
US8440933B2 (en) * 2009-04-17 2013-05-14 University Of Connecticut Systems and methods for enhanced control of laser drilling processes
CN103042310B (zh) * 2011-10-12 2015-05-27 大族激光科技产业集团股份有限公司 一种磨砂玻璃的制造方法
CN103737178B (zh) * 2013-12-19 2014-12-10 武汉法利莱切割系统工程有限责任公司 一种用于商务车顶盖的在线多层搭接激光填丝熔焊方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002137074A (ja) * 2000-10-31 2002-05-14 Hitachi Via Mechanics Ltd レーザ加工方法およびレーザ加工機
JP2012148308A (ja) * 2011-01-19 2012-08-09 Keyence Corp 印字品質評価システム、レーザマーキング装置、印字条件設定装置、印字品質評価装置、印字条件設定プログラム、印字品質評価プログラム、コンピュータで読み取り可能な記録媒体

Also Published As

Publication number Publication date
JP2016172282A (ja) 2016-09-29
CN105983788B (zh) 2020-03-17
CN105983788A (zh) 2016-10-05
JP6570921B2 (ja) 2019-09-04
TW201634166A (zh) 2016-10-01
KR20160111321A (ko) 2016-09-26
TWI689366B (zh) 2020-04-01

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