CN105983788B - 激光开孔加工条件的设定方法以及激光加工机 - Google Patents

激光开孔加工条件的设定方法以及激光加工机 Download PDF

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CN105983788B
CN105983788B CN201610148662.2A CN201610148662A CN105983788B CN 105983788 B CN105983788 B CN 105983788B CN 201610148662 A CN201610148662 A CN 201610148662A CN 105983788 B CN105983788 B CN 105983788B
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hole
conditions
laser
aforementioned
scanner
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CN105983788A (zh
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佐伯勇辉
北泰彦
簔岛悠
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Via Mechanics Ltd
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Via Mechanics Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
CN201610148662.2A 2015-03-16 2016-03-16 激光开孔加工条件的设定方法以及激光加工机 Active CN105983788B (zh)

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JP2015-052041 2015-03-16
JP2015052041 2015-03-16
JP2015164599A JP6570921B2 (ja) 2015-03-16 2015-08-24 レーザ穴あけ加工条件の設定方法及びレーザ加工機
JP2015-164599 2015-08-24

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CN105983788A CN105983788A (zh) 2016-10-05
CN105983788B true CN105983788B (zh) 2020-03-17

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JP (1) JP6570921B2 (enExample)
KR (1) KR102381358B1 (enExample)
CN (1) CN105983788B (enExample)
TW (1) TWI689366B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7066368B2 (ja) * 2017-10-24 2022-05-13 住友重機械工業株式会社 レーザ加工機の制御装置、レーザ加工方法、及びレーザ加工機
CN110455233B (zh) * 2019-08-08 2024-06-04 广州广合科技股份有限公司 一种pcb激光钻孔精度测试装置及方法
JP7305273B2 (ja) * 2019-09-19 2023-07-10 株式会社ディスコ レーザー加工方法及びレーザー加工装置
US20230201958A1 (en) * 2020-05-29 2023-06-29 Mitsubishi Electric Corporation Laser processing apparatus and laser processing method
CN115704678A (zh) * 2021-08-13 2023-02-17 深圳市大族数控科技股份有限公司 钻孔均匀性的检测方法、检测装置及存储介质

Citations (6)

* Cited by examiner, † Cited by third party
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CN1772428A (zh) * 2004-11-12 2006-05-17 日立比亚机械股份有限公司 激光加工机和激光加工方法
CN101112735A (zh) * 2006-07-27 2008-01-30 株式会社其恩斯 激光加工装置、激光加工条件设定装置、方法、及程序
CN101683703A (zh) * 2008-09-26 2010-03-31 日立比亚机械股份有限公司 激光加工机
CN102056705A (zh) * 2008-06-13 2011-05-11 伊雷克托科学工业股份有限公司 用于激光加工工件的自动参数管理
CN103042310A (zh) * 2011-10-12 2013-04-17 深圳市大族激光科技股份有限公司 一种磨砂玻璃的制造方法
CN103737178A (zh) * 2013-12-19 2014-04-23 武汉法利莱切割系统工程有限责任公司 一种用于商务车顶盖的在线多层搭接激光填丝熔焊方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10258375A (ja) * 1997-03-14 1998-09-29 Amada Co Ltd レーザ加工機およびその加工機を用いた真円度測定方法並びに駆動系検査方法
JP3614680B2 (ja) 1998-09-01 2005-01-26 松下電器産業株式会社 レーザ加工方法及び装置
JP2002137074A (ja) * 2000-10-31 2002-05-14 Hitachi Via Mechanics Ltd レーザ加工方法およびレーザ加工機
JP2004223561A (ja) * 2003-01-22 2004-08-12 Sumitomo Heavy Ind Ltd レーザ加工方法及び装置
JP5336054B2 (ja) * 2007-07-18 2013-11-06 浜松ホトニクス株式会社 加工情報供給装置を備える加工情報供給システム
US8440933B2 (en) * 2009-04-17 2013-05-14 University Of Connecticut Systems and methods for enhanced control of laser drilling processes
JP2012148308A (ja) * 2011-01-19 2012-08-09 Keyence Corp 印字品質評価システム、レーザマーキング装置、印字条件設定装置、印字品質評価装置、印字条件設定プログラム、印字品質評価プログラム、コンピュータで読み取り可能な記録媒体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1772428A (zh) * 2004-11-12 2006-05-17 日立比亚机械股份有限公司 激光加工机和激光加工方法
CN101112735A (zh) * 2006-07-27 2008-01-30 株式会社其恩斯 激光加工装置、激光加工条件设定装置、方法、及程序
CN102056705A (zh) * 2008-06-13 2011-05-11 伊雷克托科学工业股份有限公司 用于激光加工工件的自动参数管理
CN101683703A (zh) * 2008-09-26 2010-03-31 日立比亚机械股份有限公司 激光加工机
CN103042310A (zh) * 2011-10-12 2013-04-17 深圳市大族激光科技股份有限公司 一种磨砂玻璃的制造方法
CN103737178A (zh) * 2013-12-19 2014-04-23 武汉法利莱切割系统工程有限责任公司 一种用于商务车顶盖的在线多层搭接激光填丝熔焊方法

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KR102381358B1 (ko) 2022-03-30
TW201634166A (zh) 2016-10-01
CN105983788A (zh) 2016-10-05
KR20160111321A (ko) 2016-09-26
JP6570921B2 (ja) 2019-09-04
TWI689366B (zh) 2020-04-01
JP2016172282A (ja) 2016-09-29

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