JP6570921B2 - レーザ穴あけ加工条件の設定方法及びレーザ加工機 - Google Patents

レーザ穴あけ加工条件の設定方法及びレーザ加工機 Download PDF

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Publication number
JP6570921B2
JP6570921B2 JP2015164599A JP2015164599A JP6570921B2 JP 6570921 B2 JP6570921 B2 JP 6570921B2 JP 2015164599 A JP2015164599 A JP 2015164599A JP 2015164599 A JP2015164599 A JP 2015164599A JP 6570921 B2 JP6570921 B2 JP 6570921B2
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Prior art keywords
hole
laser
image
conditions
scanner
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JP2015164599A
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Japanese (ja)
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JP2016172282A5 (enExample
JP2016172282A (ja
Inventor
勇輝 佐伯
勇輝 佐伯
泰彦 北
泰彦 北
悠 簑島
悠 簑島
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Via Mechanics Ltd
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Via Mechanics Ltd
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Priority to KR1020150187406A priority Critical patent/KR102381358B1/ko
Priority to TW105100376A priority patent/TWI689366B/zh
Priority to CN201610148662.2A priority patent/CN105983788B/zh
Publication of JP2016172282A publication Critical patent/JP2016172282A/ja
Publication of JP2016172282A5 publication Critical patent/JP2016172282A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
JP2015164599A 2015-03-16 2015-08-24 レーザ穴あけ加工条件の設定方法及びレーザ加工機 Active JP6570921B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020150187406A KR102381358B1 (ko) 2015-03-16 2015-12-28 레이저 구멍내기 가공 조건의 설정 방법 및 레이저 가공기
TW105100376A TWI689366B (zh) 2015-03-16 2016-01-07 雷射開孔加工條件之設定方法及雷射加工機
CN201610148662.2A CN105983788B (zh) 2015-03-16 2016-03-16 激光开孔加工条件的设定方法以及激光加工机

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015052041 2015-03-16
JP2015052041 2015-03-16

Publications (3)

Publication Number Publication Date
JP2016172282A JP2016172282A (ja) 2016-09-29
JP2016172282A5 JP2016172282A5 (enExample) 2018-05-10
JP6570921B2 true JP6570921B2 (ja) 2019-09-04

Family

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Family Applications (1)

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JP2015164599A Active JP6570921B2 (ja) 2015-03-16 2015-08-24 レーザ穴あけ加工条件の設定方法及びレーザ加工機

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JP (1) JP6570921B2 (enExample)
KR (1) KR102381358B1 (enExample)
CN (1) CN105983788B (enExample)
TW (1) TWI689366B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7066368B2 (ja) * 2017-10-24 2022-05-13 住友重機械工業株式会社 レーザ加工機の制御装置、レーザ加工方法、及びレーザ加工機
CN110455233B (zh) * 2019-08-08 2024-06-04 广州广合科技股份有限公司 一种pcb激光钻孔精度测试装置及方法
JP7305273B2 (ja) * 2019-09-19 2023-07-10 株式会社ディスコ レーザー加工方法及びレーザー加工装置
US20230201958A1 (en) * 2020-05-29 2023-06-29 Mitsubishi Electric Corporation Laser processing apparatus and laser processing method
CN115704678A (zh) * 2021-08-13 2023-02-17 深圳市大族数控科技股份有限公司 钻孔均匀性的检测方法、检测装置及存储介质

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10258375A (ja) * 1997-03-14 1998-09-29 Amada Co Ltd レーザ加工機およびその加工機を用いた真円度測定方法並びに駆動系検査方法
JP3614680B2 (ja) 1998-09-01 2005-01-26 松下電器産業株式会社 レーザ加工方法及び装置
JP2002137074A (ja) * 2000-10-31 2002-05-14 Hitachi Via Mechanics Ltd レーザ加工方法およびレーザ加工機
JP2004223561A (ja) * 2003-01-22 2004-08-12 Sumitomo Heavy Ind Ltd レーザ加工方法及び装置
JP2006136923A (ja) * 2004-11-12 2006-06-01 Hitachi Via Mechanics Ltd レーザ加工機及びレーザ加工方法
JP4795886B2 (ja) * 2006-07-27 2011-10-19 株式会社キーエンス レーザ加工装置、レーザ加工条件設定装置、レーザ加工条件設定方法、レーザ加工条件設定プログラム
JP5336054B2 (ja) * 2007-07-18 2013-11-06 浜松ホトニクス株式会社 加工情報供給装置を備える加工情報供給システム
US8173931B2 (en) * 2008-06-13 2012-05-08 Electro Scientific Industries, Inc. Automatic recipe management for laser processing a work piece
JP4778031B2 (ja) * 2008-09-26 2011-09-21 日立ビアメカニクス株式会社 レーザ加工機
US8440933B2 (en) * 2009-04-17 2013-05-14 University Of Connecticut Systems and methods for enhanced control of laser drilling processes
JP2012148308A (ja) * 2011-01-19 2012-08-09 Keyence Corp 印字品質評価システム、レーザマーキング装置、印字条件設定装置、印字品質評価装置、印字条件設定プログラム、印字品質評価プログラム、コンピュータで読み取り可能な記録媒体
CN103042310B (zh) * 2011-10-12 2015-05-27 大族激光科技产业集团股份有限公司 一种磨砂玻璃的制造方法
CN103737178B (zh) * 2013-12-19 2014-12-10 武汉法利莱切割系统工程有限责任公司 一种用于商务车顶盖的在线多层搭接激光填丝熔焊方法

Also Published As

Publication number Publication date
KR102381358B1 (ko) 2022-03-30
TW201634166A (zh) 2016-10-01
CN105983788A (zh) 2016-10-05
CN105983788B (zh) 2020-03-17
KR20160111321A (ko) 2016-09-26
TWI689366B (zh) 2020-04-01
JP2016172282A (ja) 2016-09-29

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