KR102378443B1 - 반도체 장치 및 그 구동 방법, 및 전자 기기 - Google Patents

반도체 장치 및 그 구동 방법, 및 전자 기기 Download PDF

Info

Publication number
KR102378443B1
KR102378443B1 KR1020150034851A KR20150034851A KR102378443B1 KR 102378443 B1 KR102378443 B1 KR 102378443B1 KR 1020150034851 A KR1020150034851 A KR 1020150034851A KR 20150034851 A KR20150034851 A KR 20150034851A KR 102378443 B1 KR102378443 B1 KR 102378443B1
Authority
KR
South Korea
Prior art keywords
transistor
potential
film
oxide semiconductor
node
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020150034851A
Other languages
English (en)
Korean (ko)
Other versions
KR20150107672A (ko
Inventor
도모아키 아츠미
슈헤이 나가츠카
Original Assignee
가부시키가이샤 한도오따이 에네루기 켄큐쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 한도오따이 에네루기 켄큐쇼 filed Critical 가부시키가이샤 한도오따이 에네루기 켄큐쇼
Publication of KR20150107672A publication Critical patent/KR20150107672A/ko
Priority to KR1020220034734A priority Critical patent/KR102530582B1/ko
Application granted granted Critical
Publication of KR102378443B1 publication Critical patent/KR102378443B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B41/00Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/70Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates the floating gate being an electrode shared by two or more components
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/403Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh
    • G11C11/405Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh with three charge-transfer gates, e.g. MOS transistors, per cell
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/406Management or control of the refreshing or charge-regeneration cycles
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/408Address circuits
    • G11C11/4085Word line control circuits, e.g. word line drivers, - boosters, - pull-up, - pull-down, - precharge
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/409Read-write [R-W] circuits 
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/409Read-write [R-W] circuits 
    • G11C11/4096Input/output [I/O] data management or control circuits, e.g. reading or writing circuits, I/O drivers or bit-line switches 
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1006Data managing, e.g. manipulating data before writing or reading out, data bus switches or control circuits therefor
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1006Data managing, e.g. manipulating data before writing or reading out, data bus switches or control circuits therefor
    • G11C7/1012Data reordering during input/output, e.g. crossbars, layers of multiplexers, shifting or rotating
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/16Storage of analogue signals in digital stores using an arrangement comprising analogue/digital [A/D] converters, digital memories and digital/analogue [D/A] converters 
    • H01L27/11551
    • H01L27/1156
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B41/00Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/20Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/421Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
    • H10D86/423Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Databases & Information Systems (AREA)
  • Semiconductor Memories (AREA)
  • Dram (AREA)
  • Thin Film Transistor (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Non-Volatile Memory (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1020150034851A 2014-03-14 2015-03-13 반도체 장치 및 그 구동 방법, 및 전자 기기 Active KR102378443B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020220034734A KR102530582B1 (ko) 2014-03-14 2022-03-21 반도체 장치 및 그 구동 방법, 및 전자 기기

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2014-051497 2014-03-14
JP2014051497 2014-03-14
JP2014069626 2014-03-28
JPJP-P-2014-069626 2014-03-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020220034734A Division KR102530582B1 (ko) 2014-03-14 2022-03-21 반도체 장치 및 그 구동 방법, 및 전자 기기

Publications (2)

Publication Number Publication Date
KR20150107672A KR20150107672A (ko) 2015-09-23
KR102378443B1 true KR102378443B1 (ko) 2022-03-25

Family

ID=54069744

Family Applications (4)

Application Number Title Priority Date Filing Date
KR1020150034851A Active KR102378443B1 (ko) 2014-03-14 2015-03-13 반도체 장치 및 그 구동 방법, 및 전자 기기
KR1020220034734A Active KR102530582B1 (ko) 2014-03-14 2022-03-21 반도체 장치 및 그 구동 방법, 및 전자 기기
KR1020230057845A Ceased KR20230065967A (ko) 2014-03-14 2023-05-03 반도체 장치 및 그 구동 방법, 및 전자 기기
KR1020250036529A Pending KR20250043378A (ko) 2014-03-14 2025-03-21 반도체 장치 및 그 구동 방법, 및 전자 기기

Family Applications After (3)

Application Number Title Priority Date Filing Date
KR1020220034734A Active KR102530582B1 (ko) 2014-03-14 2022-03-21 반도체 장치 및 그 구동 방법, 및 전자 기기
KR1020230057845A Ceased KR20230065967A (ko) 2014-03-14 2023-05-03 반도체 장치 및 그 구동 방법, 및 전자 기기
KR1020250036529A Pending KR20250043378A (ko) 2014-03-14 2025-03-21 반도체 장치 및 그 구동 방법, 및 전자 기기

Country Status (3)

Country Link
US (1) US9716100B2 (enExample)
JP (6) JP6599622B2 (enExample)
KR (4) KR102378443B1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9716100B2 (en) * 2014-03-14 2017-07-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, method for driving semiconductor device, and electronic device
JP6616102B2 (ja) 2014-05-23 2019-12-04 株式会社半導体エネルギー研究所 記憶装置及び電子機器
US9489988B2 (en) 2015-02-20 2016-11-08 Semiconductor Energy Laboratory Co., Ltd. Memory device
JP6917700B2 (ja) * 2015-12-02 2021-08-11 株式会社半導体エネルギー研究所 半導体装置
JP6811084B2 (ja) * 2015-12-18 2021-01-13 株式会社半導体エネルギー研究所 半導体装置
JPWO2017158465A1 (ja) * 2016-03-18 2019-02-14 株式会社半導体エネルギー研究所 記憶装置
US10008502B2 (en) * 2016-05-04 2018-06-26 Semiconductor Energy Laboratory Co., Ltd. Memory device
TWI602306B (zh) * 2016-07-05 2017-10-11 群創光電股份有限公司 陣列基板結構與顯示裝置
JP6963463B2 (ja) 2016-11-10 2021-11-10 株式会社半導体エネルギー研究所 半導体装置、電子部品、及び電子機器
JP2018206456A (ja) * 2017-06-07 2018-12-27 株式会社半導体エネルギー研究所 記憶装置
WO2019130144A1 (ja) * 2017-12-27 2019-07-04 株式会社半導体エネルギー研究所 記憶装置
US10950545B2 (en) 2019-03-08 2021-03-16 International Business Machines Corporation Circuit wiring techniques for stacked transistor structures
CN115443505A (zh) * 2020-04-17 2022-12-06 株式会社半导体能源研究所 半导体装置
KR20240149947A (ko) * 2022-02-18 2024-10-15 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
WO2025100106A1 (ja) * 2023-11-08 2025-05-15 ソニーグループ株式会社 信号処理装置、表示システム、及び、電子機器
WO2025159078A1 (ja) * 2024-01-24 2025-07-31 ソニーセミコンダクタソリューションズ株式会社 半導体素子、表示装置および電子機器

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011249782A (ja) 2010-04-27 2011-12-08 Semiconductor Energy Lab Co Ltd 半導体メモリ装置
US20120063208A1 (en) 2010-09-13 2012-03-15 Semiconductor Energy Laboratory Co., Ltd. Memory device

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11265995A (ja) * 1998-03-17 1999-09-28 Mitsubishi Electric Corp 半導体記憶装置
JP2003281883A (ja) * 2002-03-26 2003-10-03 Matsushita Electric Ind Co Ltd 半導体記憶装置及びその駆動方法
US7315466B2 (en) * 2004-08-04 2008-01-01 Samsung Electronics Co., Ltd. Semiconductor memory device and method for arranging and manufacturing the same
CN102612749B (zh) 2009-11-06 2015-04-01 株式会社半导体能源研究所 半导体器件
KR101928723B1 (ko) 2009-11-20 2018-12-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
WO2011114868A1 (en) * 2010-03-19 2011-09-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2011145468A1 (en) * 2010-05-21 2011-11-24 Semiconductor Energy Laboratory Co., Ltd. Memory device and semiconductor device
WO2012014790A1 (en) 2010-07-27 2012-02-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8537600B2 (en) * 2010-08-04 2013-09-17 Semiconductor Energy Laboratory Co., Ltd. Low off-state leakage current semiconductor memory device
TWI555128B (zh) 2010-08-06 2016-10-21 半導體能源研究所股份有限公司 半導體裝置及半導體裝置的驅動方法
US8792284B2 (en) 2010-08-06 2014-07-29 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor memory device
TWI545587B (zh) 2010-08-06 2016-08-11 半導體能源研究所股份有限公司 半導體裝置及驅動半導體裝置的方法
DE112011102837B4 (de) * 2010-08-27 2021-03-11 Semiconductor Energy Laboratory Co., Ltd. Speichereinrichtung und Halbleitereinrichtung mit Doppelgate und Oxidhalbleiter
US8634228B2 (en) * 2010-09-02 2014-01-21 Semiconductor Energy Laboratory Co., Ltd. Driving method of semiconductor device
US8520426B2 (en) 2010-09-08 2013-08-27 Semiconductor Energy Laboratory Co., Ltd. Method for driving semiconductor device
TWI543166B (zh) * 2010-09-13 2016-07-21 半導體能源研究所股份有限公司 半導體裝置
TWI574259B (zh) * 2010-09-29 2017-03-11 半導體能源研究所股份有限公司 半導體記憶體裝置和其驅動方法
KR101924231B1 (ko) 2010-10-29 2018-11-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 기억 장치
US8686415B2 (en) 2010-12-17 2014-04-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2012142562A (ja) 2010-12-17 2012-07-26 Semiconductor Energy Lab Co Ltd 半導体記憶装置
JP2012151453A (ja) * 2010-12-28 2012-08-09 Semiconductor Energy Lab Co Ltd 半導体装置および半導体装置の駆動方法
US8659957B2 (en) * 2011-03-07 2014-02-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of driving semiconductor device
US8779488B2 (en) * 2011-04-15 2014-07-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device
US8848464B2 (en) * 2011-04-29 2014-09-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of driving semiconductor device
TWI559683B (zh) * 2011-05-20 2016-11-21 半導體能源研究所股份有限公司 半導體積體電路
CN103022012B (zh) * 2011-09-21 2017-03-01 株式会社半导体能源研究所 半导体存储装置
US9099560B2 (en) 2012-01-20 2015-08-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP5981157B2 (ja) * 2012-02-09 2016-08-31 株式会社半導体エネルギー研究所 半導体装置
US9219164B2 (en) 2012-04-20 2015-12-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device with oxide semiconductor channel
US9006024B2 (en) * 2012-04-25 2015-04-14 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2014027263A (ja) * 2012-06-15 2014-02-06 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
JP6224931B2 (ja) * 2012-07-27 2017-11-01 株式会社半導体エネルギー研究所 半導体装置
JP6298662B2 (ja) * 2013-03-14 2018-03-20 株式会社半導体エネルギー研究所 半導体装置
US9349418B2 (en) * 2013-12-27 2016-05-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for driving the same
JP6545976B2 (ja) * 2014-03-07 2019-07-17 株式会社半導体エネルギー研究所 半導体装置
JP6333580B2 (ja) * 2014-03-07 2018-05-30 株式会社半導体エネルギー研究所 半導体装置
KR102367921B1 (ko) * 2014-03-14 2022-02-25 가부시키가이샤 한도오따이 에네루기 켄큐쇼 회로 시스템
US9887212B2 (en) 2014-03-14 2018-02-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
US9716100B2 (en) * 2014-03-14 2017-07-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, method for driving semiconductor device, and electronic device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011249782A (ja) 2010-04-27 2011-12-08 Semiconductor Energy Lab Co Ltd 半導体メモリ装置
US20120063208A1 (en) 2010-09-13 2012-03-15 Semiconductor Energy Laboratory Co., Ltd. Memory device

Also Published As

Publication number Publication date
KR20150107672A (ko) 2015-09-23
JP2025106380A (ja) 2025-07-15
JP2021051823A (ja) 2021-04-01
JP2023015201A (ja) 2023-01-31
KR20230065967A (ko) 2023-05-12
JP6599622B2 (ja) 2019-10-30
KR102530582B1 (ko) 2023-05-10
JP7662853B2 (ja) 2025-04-15
JP7483830B2 (ja) 2024-05-15
JP2020005002A (ja) 2020-01-09
JP2024032795A (ja) 2024-03-12
JP7173710B2 (ja) 2022-11-16
US9716100B2 (en) 2017-07-25
KR20250043378A (ko) 2025-03-28
US20150263008A1 (en) 2015-09-17
KR20220038654A (ko) 2022-03-29
JP2015195074A (ja) 2015-11-05

Similar Documents

Publication Publication Date Title
KR102530582B1 (ko) 반도체 장치 및 그 구동 방법, 및 전자 기기
KR102252213B1 (ko) 회로 시스템
JP6644523B2 (ja) トランジスタ、メモリ、及び電子機器
KR102389009B1 (ko) 반도체 장치
JP6689062B2 (ja) 半導体装置
JP2017168809A (ja) 半導体装置、又は該半導体装置を有する記憶装置
KR102241671B1 (ko) 반도체 장치 및 그 구동 방법 및 전자 기기
TW201510997A (zh) 半導體裝置及其驅動方法
KR102329066B1 (ko) 반도체 장치 및 그 구동 방법, 및 전자 기기
US9633709B2 (en) Storage device including transistor comprising oxide semiconductor
JP2016127117A (ja) 記憶装置及びその駆動方法

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20150313

PG1501 Laying open of application
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20200313

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 20150313

Comment text: Patent Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20201218

Patent event code: PE09021S01D

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

Comment text: Final Notice of Reason for Refusal

Patent event date: 20210728

Patent event code: PE09021S02D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20220110

A107 Divisional application of patent
GRNT Written decision to grant
PA0107 Divisional application

Comment text: Divisional Application of Patent

Patent event date: 20220321

Patent event code: PA01071R01D

PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20220321

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20220322

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20250106

Start annual number: 4

End annual number: 4