KR102377316B1 - 기판 처리 장치, 및 기판 처리 장치의 부품 검사 방법 - Google Patents

기판 처리 장치, 및 기판 처리 장치의 부품 검사 방법 Download PDF

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Publication number
KR102377316B1
KR102377316B1 KR1020197038603A KR20197038603A KR102377316B1 KR 102377316 B1 KR102377316 B1 KR 102377316B1 KR 1020197038603 A KR1020197038603 A KR 1020197038603A KR 20197038603 A KR20197038603 A KR 20197038603A KR 102377316 B1 KR102377316 B1 KR 102377316B1
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KR
South Korea
Prior art keywords
deterioration
substrate processing
early
resin coating
processing apparatus
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KR1020197038603A
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English (en)
Korean (ko)
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KR20200013717A (ko
Inventor
아키오 하시즈메
Original Assignee
가부시키가이샤 스크린 홀딩스
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Publication of KR20200013717A publication Critical patent/KR20200013717A/ko
Application granted granted Critical
Publication of KR102377316B1 publication Critical patent/KR102377316B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/041—Cleaning travelling work
    • B08B3/042—Cleaning travelling work the loose articles or bulk material travelling gradually through a drum or other container, e.g. by helix or gravity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/06—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Coating Apparatus (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020197038603A 2017-07-28 2018-05-15 기판 처리 장치, 및 기판 처리 장치의 부품 검사 방법 KR102377316B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2017-146461 2017-07-28
JP2017146461A JP7040871B2 (ja) 2017-07-28 2017-07-28 基板処理装置、及び基板処理装置の部品検査方法
PCT/JP2018/018814 WO2019021586A1 (ja) 2017-07-28 2018-05-15 基板処理装置、及び基板処理装置の部品検査方法

Publications (2)

Publication Number Publication Date
KR20200013717A KR20200013717A (ko) 2020-02-07
KR102377316B1 true KR102377316B1 (ko) 2022-03-22

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ID=65040076

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KR1020197038603A KR102377316B1 (ko) 2017-07-28 2018-05-15 기판 처리 장치, 및 기판 처리 장치의 부품 검사 방법

Country Status (5)

Country Link
JP (1) JP7040871B2 (ja)
KR (1) KR102377316B1 (ja)
CN (1) CN110809814B (ja)
TW (1) TWI696499B (ja)
WO (1) WO2019021586A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6857682B2 (ja) * 2019-03-29 2021-04-14 芝浦メカトロニクス株式会社 基板処理装置
JP2022134835A (ja) 2021-03-04 2022-09-15 東京エレクトロン株式会社 基板処理装置、研磨パッド検査装置、及び研磨パッド検査方法
JPWO2024069933A1 (ja) * 2022-09-30 2024-04-04

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001053018A (ja) * 1999-08-05 2001-02-23 Sumitomo Eaton Noba Kk コーティング膜の検出方法及びこれを用いるイオン注入装置
JP2014209605A (ja) * 2013-03-29 2014-11-06 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2777509B2 (ja) * 1992-09-30 1998-07-16 出光石油化学株式会社 色調検査方法
JP3183098B2 (ja) * 1994-05-31 2001-07-03 大日本スクリーン製造株式会社 基板処理装置の基板保持具
JP3177729B2 (ja) * 1995-05-12 2001-06-18 東京エレクトロン株式会社 処理装置
JPH10217109A (ja) * 1997-02-04 1998-08-18 Nippon Steel Corp 研磨装置の被研磨材保持装置
JP3254520B2 (ja) * 1997-11-27 2002-02-12 東京エレクトロン株式会社 洗浄処理方法及び洗浄処理システム
JP2002096012A (ja) 2000-09-26 2002-04-02 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2003092343A (ja) 2001-09-17 2003-03-28 Dainippon Screen Mfg Co Ltd 基板保持機構、ならびにそれを用いた基板処理装置および基板処理方法
US8608858B2 (en) * 2004-09-28 2013-12-17 Ebara Corporation Substrate cleaning apparatus and method for determining timing of replacement of cleaning member
JP2010267856A (ja) 2009-05-15 2010-11-25 Panasonic Corp 洗浄処理装置および洗浄処理方法
JP2010267181A (ja) 2009-05-18 2010-11-25 Sumitomo Chem Eng Kk 薬剤の希釈装置
JP2013056388A (ja) 2011-09-08 2013-03-28 Disco Corp 加工装置
JP6109545B2 (ja) 2012-11-28 2017-04-05 三菱重工業株式会社 空気調和機
US20160336149A1 (en) * 2015-05-15 2016-11-17 Applied Materials, Inc. Chamber component with wear indicator
JP2017073338A (ja) * 2015-10-09 2017-04-13 東京エレクトロン株式会社 検査装置、減圧乾燥装置および減圧乾燥装置の制御方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001053018A (ja) * 1999-08-05 2001-02-23 Sumitomo Eaton Noba Kk コーティング膜の検出方法及びこれを用いるイオン注入装置
JP2014209605A (ja) * 2013-03-29 2014-11-06 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法

Also Published As

Publication number Publication date
KR20200013717A (ko) 2020-02-07
TW201910009A (zh) 2019-03-16
JP7040871B2 (ja) 2022-03-23
TWI696499B (zh) 2020-06-21
JP2019029472A (ja) 2019-02-21
WO2019021586A1 (ja) 2019-01-31
CN110809814A (zh) 2020-02-18
CN110809814B (zh) 2023-10-03

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