KR102377316B1 - Substrate processing apparatus and method for inspecting parts of substrate processing apparatus - Google Patents

Substrate processing apparatus and method for inspecting parts of substrate processing apparatus Download PDF

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Publication number
KR102377316B1
KR102377316B1 KR1020197038603A KR20197038603A KR102377316B1 KR 102377316 B1 KR102377316 B1 KR 102377316B1 KR 1020197038603 A KR1020197038603 A KR 1020197038603A KR 20197038603 A KR20197038603 A KR 20197038603A KR 102377316 B1 KR102377316 B1 KR 102377316B1
Authority
KR
South Korea
Prior art keywords
processing apparatus
substrate processing
inspecting parts
inspecting
parts
Prior art date
Application number
KR1020197038603A
Other languages
Korean (ko)
Other versions
KR20200013717A (en
Inventor
아키오 하시즈메
Original Assignee
가부시키가이샤 스크린 홀딩스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 스크린 홀딩스 filed Critical 가부시키가이샤 스크린 홀딩스
Publication of KR20200013717A publication Critical patent/KR20200013717A/en
Application granted granted Critical
Publication of KR102377316B1 publication Critical patent/KR102377316B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/041—Cleaning travelling work
    • B08B3/042—Cleaning travelling work the loose articles or bulk material travelling gradually through a drum or other container, e.g. by helix or gravity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/06—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Coating Apparatus (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020197038603A 2017-07-28 2018-05-15 Substrate processing apparatus and method for inspecting parts of substrate processing apparatus KR102377316B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017146461A JP7040871B2 (en) 2017-07-28 2017-07-28 Board processing equipment and parts inspection method for substrate processing equipment
JPJP-P-2017-146461 2017-07-28
PCT/JP2018/018814 WO2019021586A1 (en) 2017-07-28 2018-05-15 Substrate processing device and component inspection method for substrate processing device

Publications (2)

Publication Number Publication Date
KR20200013717A KR20200013717A (en) 2020-02-07
KR102377316B1 true KR102377316B1 (en) 2022-03-22

Family

ID=65040076

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197038603A KR102377316B1 (en) 2017-07-28 2018-05-15 Substrate processing apparatus and method for inspecting parts of substrate processing apparatus

Country Status (5)

Country Link
JP (1) JP7040871B2 (en)
KR (1) KR102377316B1 (en)
CN (1) CN110809814B (en)
TW (1) TWI696499B (en)
WO (1) WO2019021586A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6857682B2 (en) * 2019-03-29 2021-04-14 芝浦メカトロニクス株式会社 Board processing equipment
JP2022134835A (en) 2021-03-04 2022-09-15 東京エレクトロン株式会社 Substrate processing device, abrasive pad inspection device and abrasive pad inspection method
WO2024069933A1 (en) * 2022-09-30 2024-04-04 株式会社Subaru Method for diagnosing degradation of resin-made component

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2777509B2 (en) * 1992-09-30 1998-07-16 出光石油化学株式会社 Color inspection method
JP3183098B2 (en) * 1994-05-31 2001-07-03 大日本スクリーン製造株式会社 Substrate holder for substrate processing equipment
JP3177729B2 (en) * 1995-05-12 2001-06-18 東京エレクトロン株式会社 Processing equipment
JPH10217109A (en) * 1997-02-04 1998-08-18 Nippon Steel Corp Work holding device of polishing device
JP3254520B2 (en) * 1997-11-27 2002-02-12 東京エレクトロン株式会社 Cleaning treatment method and cleaning treatment system
JP3440329B2 (en) * 1999-08-05 2003-08-25 住友イートンノバ株式会社 Method for detecting coating film and ion implantation apparatus using the same
JP2002096012A (en) 2000-09-26 2002-04-02 Dainippon Screen Mfg Co Ltd Device for treating substrate
JP2003092343A (en) 2001-09-17 2003-03-28 Dainippon Screen Mfg Co Ltd Substrate holding mechanism, substrate processing apparatus using the same and substrate processing method
JP4511591B2 (en) * 2004-09-28 2010-07-28 株式会社荏原製作所 Substrate cleaning apparatus and cleaning member replacement time determination method
JP2010267856A (en) * 2009-05-15 2010-11-25 Panasonic Corp Cleaning treatment apparatus and cleaning treatment method
JP2010267181A (en) * 2009-05-18 2010-11-25 Sumitomo Chem Eng Kk Device for diluting chemical agent
JP2013056388A (en) * 2011-09-08 2013-03-28 Disco Corp Processing device
JP6109545B2 (en) 2012-11-28 2017-04-05 三菱重工業株式会社 Air conditioner
JP6203098B2 (en) * 2013-03-29 2017-09-27 芝浦メカトロニクス株式会社 Substrate processing apparatus and substrate processing method
US20160336149A1 (en) * 2015-05-15 2016-11-17 Applied Materials, Inc. Chamber component with wear indicator
JP2017073338A (en) * 2015-10-09 2017-04-13 東京エレクトロン株式会社 Inspection device, reduced-pressure drying device, and method for controlling reduced-pressure drying device

Also Published As

Publication number Publication date
TWI696499B (en) 2020-06-21
CN110809814A (en) 2020-02-18
WO2019021586A1 (en) 2019-01-31
JP2019029472A (en) 2019-02-21
CN110809814B (en) 2023-10-03
JP7040871B2 (en) 2022-03-23
KR20200013717A (en) 2020-02-07
TW201910009A (en) 2019-03-16

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