SG10201603136QA - Substrate processing apparatus and method for detecting abnormality of substrate - Google Patents

Substrate processing apparatus and method for detecting abnormality of substrate

Info

Publication number
SG10201603136QA
SG10201603136QA SG10201603136QA SG10201603136QA SG10201603136QA SG 10201603136Q A SG10201603136Q A SG 10201603136QA SG 10201603136Q A SG10201603136Q A SG 10201603136QA SG 10201603136Q A SG10201603136Q A SG 10201603136QA SG 10201603136Q A SG10201603136Q A SG 10201603136QA
Authority
SG
Singapore
Prior art keywords
substrate
processing apparatus
detecting abnormality
substrate processing
abnormality
Prior art date
Application number
SG10201603136QA
Inventor
Mitsunori Komatsu
Toru Maruyama
Yoshinori Isono
Hiroaki Yanagi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201603136QA publication Critical patent/SG10201603136QA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/0053—Control means for lapping machines or devices detecting loss or breakage of a workpiece during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
SG10201603136QA 2015-04-23 2016-04-20 Substrate processing apparatus and method for detecting abnormality of substrate SG10201603136QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015088696A JP6486757B2 (en) 2015-04-23 2015-04-23 Substrate processing equipment

Publications (1)

Publication Number Publication Date
SG10201603136QA true SG10201603136QA (en) 2016-11-29

Family

ID=57148391

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201603136QA SG10201603136QA (en) 2015-04-23 2016-04-20 Substrate processing apparatus and method for detecting abnormality of substrate

Country Status (6)

Country Link
US (1) US10903101B2 (en)
JP (1) JP6486757B2 (en)
KR (1) KR102036403B1 (en)
CN (1) CN106067435B (en)
SG (1) SG10201603136QA (en)
TW (1) TWI671837B (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6313196B2 (en) * 2014-11-20 2018-04-18 株式会社荏原製作所 Polishing surface cleaning apparatus, polishing apparatus, and manufacturing method of polishing surface cleaning apparatus
JP6486757B2 (en) * 2015-04-23 2019-03-20 株式会社荏原製作所 Substrate processing equipment
CN107167936B (en) * 2017-05-22 2020-05-01 京东方科技集团股份有限公司 Substrate conveying system, substrate detection device and detection method
KR101943213B1 (en) 2017-07-26 2019-01-28 에스케이실트론 주식회사 Wafer mounting apparatus
KR102492053B1 (en) * 2017-08-23 2023-01-25 삼성전자주식회사 Semiconductor manufacturing device and method of manufacturing semiconductor device using the same
KR102145848B1 (en) * 2018-11-02 2020-08-19 세메스 주식회사 Die transfer module and die bonding apparatus having the same
JP7003945B2 (en) * 2019-02-22 2022-02-10 村田機械株式会社 Transfer device and stacker crane
JP7406980B2 (en) * 2019-12-24 2023-12-28 株式会社荏原製作所 Polishing unit, substrate processing equipment, and polishing method
CN111554601B (en) * 2020-04-27 2021-12-28 上海果纳半导体技术有限公司 Wafer front end transfer system
US11600504B2 (en) 2020-06-29 2023-03-07 Taiwan Semiconductor Manufacturing Company, Ltd. Detecting damaged semiconductor wafers utilizing a semiconductor wafer sorter tool of an automated materials handling system
US11699595B2 (en) * 2021-02-25 2023-07-11 Applied Materials, Inc. Imaging for monitoring thickness in a substrate cleaning system
CN113416946B (en) * 2021-06-22 2023-01-03 江苏微导纳米科技股份有限公司 PECVD double-boat system and fragment detection method thereof
JP2023032491A (en) * 2021-08-27 2023-03-09 キオクシア株式会社 Substrate processing device and method for manufacturing semiconductor device
JP2023054483A (en) * 2021-10-04 2023-04-14 株式会社荏原製作所 Information processing device, inference device, machine learning device, information processing method, inference method, and machine learning method

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3442480B2 (en) 1994-06-08 2003-09-02 不二越機械工業株式会社 Wafer peeling device
KR100253085B1 (en) 1997-07-10 2000-04-15 윤종용 Wafer polishing apparatus having measuring device and polishing method thereof
JP2002212786A (en) * 2001-01-17 2002-07-31 Ebara Corp Substrate processor
JP2002261146A (en) 2001-03-02 2002-09-13 Hitachi Ltd Manufacturing method of semiconductor integrated circuit device and semiconductor manufacturing device
US20070258085A1 (en) * 2006-05-02 2007-11-08 Robbins Michael D Substrate illumination and inspection system
US7068363B2 (en) * 2003-06-06 2006-06-27 Kla-Tencor Technologies Corp. Systems for inspection of patterned or unpatterned wafers and other specimen
KR20050050189A (en) 2003-11-25 2005-05-31 동부아남반도체 주식회사 Cmp apparatus for detecting scratch of the wafer and control method thereof
JP2005294378A (en) 2004-03-31 2005-10-20 Shin Etsu Handotai Co Ltd Apparatus and method for polishing double-surface of semiconductor wafer
TWI352645B (en) * 2004-05-28 2011-11-21 Ebara Corp Apparatus for inspecting and polishing substrate r
JP4703141B2 (en) * 2004-07-22 2011-06-15 株式会社荏原製作所 Polishing apparatus, substrate processing apparatus, and substrate jumping detection method
JP4916890B2 (en) * 2005-04-19 2012-04-18 株式会社荏原製作所 Substrate processing apparatus and substrate processing method
JP2008091698A (en) * 2006-10-03 2008-04-17 Matsushita Electric Ind Co Ltd Substrate treating device, and substrate treating method
JP2008155292A (en) 2006-12-21 2008-07-10 Disco Abrasive Syst Ltd Method and apparatus for machining substrate
JP5007979B2 (en) * 2008-05-22 2012-08-22 独立行政法人産業技術総合研究所 Defect inspection method and defect inspection apparatus
JP5744382B2 (en) 2008-07-24 2015-07-08 株式会社荏原製作所 Substrate processing apparatus and substrate processing method
TWI450792B (en) 2008-08-05 2014-09-01 Ebara Corp Polishing method and apparatus
DE102010026351B4 (en) * 2010-07-07 2012-04-26 Siltronic Ag Method and apparatus for inspecting a semiconductor wafer
JP2013082055A (en) * 2011-09-30 2013-05-09 Asahi Glass Co Ltd Method and system for monitoring glass plate polishing device
KR20130035943A (en) 2011-09-30 2013-04-09 아사히 가라스 가부시키가이샤 Monitoring method and monitoring system for glass plate polishing apparatus
US9317912B2 (en) * 2011-12-28 2016-04-19 Sunedison Semiconductor Limited Symmetry based air pocket detection methods and systems
KR101302588B1 (en) * 2012-01-03 2013-09-03 주식회사 엘지실트론 Method for processing wafer
JP5948262B2 (en) 2013-01-30 2016-07-06 株式会社日立ハイテクノロジーズ Defect observation method and defect observation apparatus
CN106206353B (en) * 2013-03-01 2021-04-16 日月光半导体制造股份有限公司 Detection device and method
JP2014172161A (en) 2013-03-13 2014-09-22 Ebara Corp Substrate crack detection apparatus, polishing apparatus including the same, and substrate crack detection method
US20150017745A1 (en) * 2013-07-08 2015-01-15 Ebara Corporation Polishing method and polishing apparatus
KR101575895B1 (en) * 2014-10-28 2015-12-08 한국교통대학교산학협력단 Apparatus and method for inspecting wafer using light
JP6486757B2 (en) * 2015-04-23 2019-03-20 株式会社荏原製作所 Substrate processing equipment

Also Published As

Publication number Publication date
KR102036403B1 (en) 2019-10-24
US10903101B2 (en) 2021-01-26
US20160315002A1 (en) 2016-10-27
KR20160126883A (en) 2016-11-02
TW201639055A (en) 2016-11-01
CN106067435B (en) 2022-03-18
TWI671837B (en) 2019-09-11
JP6486757B2 (en) 2019-03-20
CN106067435A (en) 2016-11-02
JP2016207868A (en) 2016-12-08

Similar Documents

Publication Publication Date Title
SG10201603136QA (en) Substrate processing apparatus and method for detecting abnormality of substrate
SG10201604456TA (en) Substrate processing apparatus and substrate processing method
SG10201704180PA (en) Method and apparatus for processing wafer-shaped articles
HK1245417B (en) Substrate processing method and substrate-processing apparatus
SG10201508119XA (en) Substrate processing apparatus and processing method
HK1215322A1 (en) Method and apparatus for processing araoke song
SG11201606935VA (en) System and method for bi-facial processing of substrates
IL259578B (en) Inspection apparatus and method
ZA201800665B (en) Method and apparatus for stain treatment
GB2551689B (en) Method and Apparatus for processing graphics
ZA201700522B (en) Method and apparatus for automated processing of pooled samples
GB2539509B (en) Method of and apparatus for processing graphics
SG11201609143TA (en) Plasma processing method and plasma processing apparatus
GB201509387D0 (en) Method and apparatus for image processing (distance detection)
SG11201710329TA (en) Substrate processing system and substrate processing method
IL258474B (en) Method and apparatus for inspection and metrology
SG11201702404XA (en) Plasma processing method and plasma processing apparatus
ZA201802343B (en) An apparatus and method for processing doses
GB2550077B (en) Apparatus and method for detection of corrosion
EP3400092C0 (en) Apparatus and method for processing solutions of biomolecules
SG10201705359WA (en) Inspecting method for inspecting influence of installation environment upon processing apparatus
GB201519353D0 (en) Method of and apparatus for graphics processing
SG11201705305TA (en) Method and apparatus for processing transactions
EP3764320C0 (en) Substrate inspection method and system
SG11201605673VA (en) Workpiece processing apparatus and workpiece processing method