KR102374288B1 - 접착제 조성물 필름상의 접착제 접착층, 접착 시트, 수지 부착 동박, 동장 적층판, 플렉서블 동장 적층판, 프린트 배선판, 플렉서블 프린트 배선판, 다층 배선판, 인쇄 회로 기판 및 플렉서블 인쇄 회로 기판 - Google Patents
접착제 조성물 필름상의 접착제 접착층, 접착 시트, 수지 부착 동박, 동장 적층판, 플렉서블 동장 적층판, 프린트 배선판, 플렉서블 프린트 배선판, 다층 배선판, 인쇄 회로 기판 및 플렉서블 인쇄 회로 기판 Download PDFInfo
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- KR102374288B1 KR102374288B1 KR1020160039556A KR20160039556A KR102374288B1 KR 102374288 B1 KR102374288 B1 KR 102374288B1 KR 1020160039556 A KR1020160039556 A KR 1020160039556A KR 20160039556 A KR20160039556 A KR 20160039556A KR 102374288 B1 KR102374288 B1 KR 102374288B1
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- Prior art keywords
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- wiring board
- adhesive composition
- adhesive
- clad laminate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
- C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/24—Aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2015-074194 | 2015-03-31 | ||
JP2015074194 | 2015-03-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20160117368A KR20160117368A (ko) | 2016-10-10 |
KR102374288B1 true KR102374288B1 (ko) | 2022-03-14 |
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Family Applications (1)
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KR1020160039556A KR102374288B1 (ko) | 2015-03-31 | 2016-03-31 | 접착제 조성물 필름상의 접착제 접착층, 접착 시트, 수지 부착 동박, 동장 적층판, 플렉서블 동장 적층판, 프린트 배선판, 플렉서블 프린트 배선판, 다층 배선판, 인쇄 회로 기판 및 플렉서블 인쇄 회로 기판 |
Country Status (4)
Country | Link |
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JP (1) | JP6593649B2 (zh) |
KR (1) | KR102374288B1 (zh) |
CN (1) | CN106010421B (zh) |
TW (1) | TWI690578B (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11873398B2 (en) * | 2016-09-29 | 2024-01-16 | Sekisui Chemical Co., Ltd. | Interlayer insulating material and multilayer printed wiring board |
JP6930784B2 (ja) * | 2017-01-05 | 2021-09-01 | 住友電工プリントサーキット株式会社 | プリント配線用原板及びプリント配線板 |
JP2018140544A (ja) * | 2017-02-28 | 2018-09-13 | 新日鉄住金化学株式会社 | 金属張積層板、接着シート、接着性ポリイミド樹脂組成物及び回路基板 |
JP2018154738A (ja) * | 2017-03-17 | 2018-10-04 | 株式会社タムラ製作所 | 感光性樹脂及び感光性樹脂組成物 |
JP7114983B2 (ja) * | 2017-03-29 | 2022-08-09 | 荒川化学工業株式会社 | 接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法 |
JP7003795B2 (ja) * | 2017-03-29 | 2022-01-21 | 荒川化学工業株式会社 | ポリイミド、接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法 |
TWI773745B (zh) * | 2017-04-24 | 2022-08-11 | 日商味之素股份有限公司 | 樹脂組成物 |
JP2019065181A (ja) * | 2017-09-29 | 2019-04-25 | 日鉄ケミカル&マテリアル株式会社 | ポリイミドの製造方法 |
TWI695053B (zh) * | 2018-06-28 | 2020-06-01 | 亞洲電材股份有限公司 | 一種高頻高速黏結片及其製法 |
KR102220141B1 (ko) * | 2018-07-27 | 2021-02-25 | 도레이첨단소재 주식회사 | 열경화성 접착제 조성물, 그의 경화물을 포함하는 적층필름, 및 상기 적층필름을 채용한 프린트 배선판 |
JP2020056011A (ja) * | 2018-09-28 | 2020-04-09 | 日鉄ケミカル&マテリアル株式会社 | 樹脂フィルム、カバーレイフィルム、回路基板、樹脂付銅箔、金属張積層板、多層回路基板、ポリイミド及び接着剤樹脂組成物 |
JP7203409B2 (ja) * | 2018-10-25 | 2023-01-13 | ユニチカ株式会社 | ビスマレイミド |
CN112980385A (zh) * | 2019-12-16 | 2021-06-18 | 荒川化学工业株式会社 | 粘接剂组合物、粘接剂组合物的相关制品及其制备方法 |
KR102473679B1 (ko) * | 2021-10-08 | 2022-12-02 | 주식회사 엡솔 | 연성회로기판용 저유전 폴리이미드 복합필름 |
KR102433132B1 (ko) * | 2021-10-26 | 2022-08-18 | 주식회사 엡솔 | 폴리이미드 복합필름 |
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JP2012255107A (ja) | 2011-06-09 | 2012-12-27 | Mitsui Chemicals Inc | 熱可塑性ポリイミド組成物、それを含む接着剤、積層体、及びデバイス |
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JP3031322B2 (ja) * | 1997-12-19 | 2000-04-10 | 宇部興産株式会社 | 耐熱性樹脂接着剤シ−トおよび基板 |
JP3950560B2 (ja) * | 1998-08-14 | 2007-08-01 | 株式会社巴川製紙所 | 電子部品用接着剤および電子部品用接着テープ |
JP2003027014A (ja) * | 2001-07-17 | 2003-01-29 | Kanegafuchi Chem Ind Co Ltd | 接着性フィルム |
JP5100894B2 (ja) * | 2009-12-22 | 2012-12-19 | 新日鉄住金化学株式会社 | ポリイミド樹脂、その製造方法、接着剤樹脂組成物、カバーレイフィルム及び回路基板 |
JP5545817B2 (ja) * | 2010-01-29 | 2014-07-09 | 新日鉄住金化学株式会社 | 接着剤樹脂組成物、カバーレイフィルム及び回路基板 |
SG190423A1 (en) * | 2010-12-01 | 2013-06-28 | Toray Industries | Adhesive composition, adhesive sheet, and semiconductor device using the adhesive composition or the adhesive sheet |
KR20130140798A (ko) * | 2011-02-01 | 2013-12-24 | 디아이씨 가부시끼가이샤 | 열경화형 수지 조성물, 그 경화물 및 프린트 배선판용 층간 접착 필름 |
JP5534378B2 (ja) * | 2012-02-24 | 2014-06-25 | 荒川化学工業株式会社 | ポリイミド系接着剤組成物、硬化物、接着シート、積層体、フレキシブルプリント基板 |
TWI493007B (zh) * | 2012-02-24 | 2015-07-21 | Arakawa Chem Ind | A polyimide-based adhesive composition, a hardened product, an adhesive sheet, a laminate, and a flexible printed substrate |
CN103865471A (zh) * | 2012-12-18 | 2014-06-18 | 上海市合成树脂研究所 | 聚酰亚胺胶粘剂及其制备方法 |
WO2014208644A1 (ja) * | 2013-06-28 | 2014-12-31 | 新日鉄住金化学株式会社 | ポリイミド、樹脂フィルム及び金属張積層体 |
EP3046402B1 (en) * | 2013-09-12 | 2018-11-07 | Sumitomo Electric Industries, Ltd. | Adhesive composition for printed wiring boards, bonding film, coverlay, copper-clad laminate and printed wiring board |
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2016
- 2016-03-29 JP JP2016064974A patent/JP6593649B2/ja active Active
- 2016-03-30 TW TW105110048A patent/TWI690578B/zh active
- 2016-03-31 KR KR1020160039556A patent/KR102374288B1/ko active IP Right Grant
- 2016-03-31 CN CN201610196303.4A patent/CN106010421B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2012255107A (ja) | 2011-06-09 | 2012-12-27 | Mitsui Chemicals Inc | 熱可塑性ポリイミド組成物、それを含む接着剤、積層体、及びデバイス |
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Publication number | Publication date |
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JP2016194055A (ja) | 2016-11-17 |
TW201710454A (zh) | 2017-03-16 |
KR20160117368A (ko) | 2016-10-10 |
TWI690578B (zh) | 2020-04-11 |
CN106010421A (zh) | 2016-10-12 |
JP6593649B2 (ja) | 2019-10-23 |
CN106010421B (zh) | 2020-04-21 |
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