KR102370447B1 - 편면 연마 장치로의 웨이퍼 접착 장치 및, 편면 연마 장치로의 웨이퍼 접착 방법 - Google Patents

편면 연마 장치로의 웨이퍼 접착 장치 및, 편면 연마 장치로의 웨이퍼 접착 방법 Download PDF

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Publication number
KR102370447B1
KR102370447B1 KR1020207013615A KR20207013615A KR102370447B1 KR 102370447 B1 KR102370447 B1 KR 102370447B1 KR 1020207013615 A KR1020207013615 A KR 1020207013615A KR 20207013615 A KR20207013615 A KR 20207013615A KR 102370447 B1 KR102370447 B1 KR 102370447B1
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KR
South Korea
Prior art keywords
wafer
water
polishing apparatus
bonding
side polishing
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KR1020207013615A
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English (en)
Korean (ko)
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KR20200067875A (ko
Inventor
카츠토시 야마모토
Original Assignee
가부시키가이샤 사무코
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Publication date
Application filed by 가부시키가이샤 사무코 filed Critical 가부시키가이샤 사무코
Publication of KR20200067875A publication Critical patent/KR20200067875A/ko
Application granted granted Critical
Publication of KR102370447B1 publication Critical patent/KR102370447B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020207013615A 2017-10-16 2018-10-03 편면 연마 장치로의 웨이퍼 접착 장치 및, 편면 연마 장치로의 웨이퍼 접착 방법 KR102370447B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2017-200286 2017-10-16
JP2017200286A JP6863220B2 (ja) 2017-10-16 2017-10-16 片面研磨装置へのウェーハ貼付装置、および片面研磨装置へのウェーハ貼付方法
PCT/JP2018/037125 WO2019078009A1 (ja) 2017-10-16 2018-10-03 片面研磨装置へのウェーハ貼付装置、および片面研磨装置へのウェーハ貼付方法

Publications (2)

Publication Number Publication Date
KR20200067875A KR20200067875A (ko) 2020-06-12
KR102370447B1 true KR102370447B1 (ko) 2022-03-03

Family

ID=66174496

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207013615A KR102370447B1 (ko) 2017-10-16 2018-10-03 편면 연마 장치로의 웨이퍼 접착 장치 및, 편면 연마 장치로의 웨이퍼 접착 방법

Country Status (6)

Country Link
JP (1) JP6863220B2 (zh)
KR (1) KR102370447B1 (zh)
CN (1) CN111295267B (zh)
DE (1) DE112018004568T5 (zh)
TW (1) TWI711508B (zh)
WO (1) WO2019078009A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI741866B (zh) * 2020-11-06 2021-10-01 環球晶圓股份有限公司 晶圓載具的貼覆裝置及其操作方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003109926A (ja) 2001-09-26 2003-04-11 Applied Materials Inc 基板の受け渡し方法および機械化学的研磨装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05102114A (ja) * 1991-10-03 1993-04-23 Shibayama Kikai Kk 半導体ウエハの仮置台
JP4062552B2 (ja) * 1995-10-23 2008-03-19 日本政策投資銀行 半導体ウエハの位置合わせ及び水張り方法
JPH10337656A (ja) * 1997-06-05 1998-12-22 Mitsubishi Materials Corp ウェーハ研磨装置およびウェーハ保持用インサートの洗浄方法
US6354922B1 (en) * 1999-08-20 2002-03-12 Ebara Corporation Polishing apparatus
JP2005019439A (ja) * 2003-06-23 2005-01-20 Tokyo Seimitsu Co Ltd ウェーハ受渡し方法、ウェーハ受渡し装置及びそれを用いたウェーハ加工装置
JP2007103707A (ja) 2005-10-05 2007-04-19 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェハの研磨装置および研磨方法
JP2008080443A (ja) 2006-09-27 2008-04-10 Covalent Materials Corp 片面研磨装置
JP2011121218A (ja) * 2009-12-09 2011-06-23 Seiko Epson Corp ノズルプレート、吐出ヘッド及びそれらの製造方法並びに吐出装置
CN106206280B (zh) * 2016-08-17 2019-03-01 苏州聚晶科技有限公司 一种硅晶片的单面去psg层及抛光的制备方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003109926A (ja) 2001-09-26 2003-04-11 Applied Materials Inc 基板の受け渡し方法および機械化学的研磨装置

Also Published As

Publication number Publication date
DE112018004568T5 (de) 2020-06-04
JP2019072796A (ja) 2019-05-16
JP6863220B2 (ja) 2021-04-21
CN111295267B (zh) 2022-07-08
WO2019078009A1 (ja) 2019-04-25
TWI711508B (zh) 2020-12-01
TW201922418A (zh) 2019-06-16
KR20200067875A (ko) 2020-06-12
CN111295267A (zh) 2020-06-16

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