JP4906102B2 - 保持治具 - Google Patents
保持治具 Download PDFInfo
- Publication number
- JP4906102B2 JP4906102B2 JP2007173994A JP2007173994A JP4906102B2 JP 4906102 B2 JP4906102 B2 JP 4906102B2 JP 2007173994 A JP2007173994 A JP 2007173994A JP 2007173994 A JP2007173994 A JP 2007173994A JP 4906102 B2 JP4906102 B2 JP 4906102B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- holding jig
- adhesive
- thin plate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
請求項1は、薄板状物を粘着保持することのできる粘着部を頂面に有する突出部材と、前記突出部材が貫通する貫通孔が穿設され、前記貫通孔の開口部以外の表面に非粘着部を有する板状部材とを備え、前記板状部材は前記突出部材の軸線方向長さよりも小さい厚さを有して前記表面から前記突出部材を突出させると共に前記突出部材に対して相対的に前後進可能に配置されて成ることを特徴とする保持治具であり、
請求項2は、前記貫通孔は前記突出部材の断面積と同じ開口面積を有している請求項1に記載の保持治具である。
5 シリコンウェハ
10、11 基板
12、13 突出部材
14、15、16 粘着部
20 補強部材
30、31 板状部材
32、33 非粘着部
34、35 貫通孔
Claims (2)
- 薄板状物を粘着保持することのできる粘着部を頂面に有する突出部材と、
前記突出部材が貫通する貫通孔が穿設され、前記貫通孔の開口部以外の表面に非粘着部を有する板状部材とを備え、
前記板状部材は、前記突出部材の軸線方向長さよりも小さい厚さを有して前記表面から前記突出部材を突出させると共に前記突出部材に対して相対的に前後進可能に配置されて成ることを特徴とする保持治具。 - 前記貫通孔は、前記突出部材の断面積と同じ開口面積を有している請求項1に記載の保持治具。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007173994A JP4906102B2 (ja) | 2007-07-02 | 2007-07-02 | 保持治具 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007173994A JP4906102B2 (ja) | 2007-07-02 | 2007-07-02 | 保持治具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009016430A JP2009016430A (ja) | 2009-01-22 |
JP4906102B2 true JP4906102B2 (ja) | 2012-03-28 |
Family
ID=40357016
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007173994A Expired - Fee Related JP4906102B2 (ja) | 2007-07-02 | 2007-07-02 | 保持治具 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4906102B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5535011B2 (ja) * | 2010-09-06 | 2014-07-02 | 信越ポリマー株式会社 | 基板用の保持治具 |
JP6246671B2 (ja) * | 2014-07-15 | 2017-12-13 | 信越ポリマー株式会社 | 半導体ウェーハ用サポート治具の製造方法 |
WO2019049588A1 (en) | 2017-09-07 | 2019-03-14 | Mapper Lithography Ip B.V. | METHODS AND SYSTEMS FOR COATING A SUBSTRATE |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3059187B2 (ja) * | 1989-05-27 | 2000-07-04 | ティーディーケイ株式会社 | 軟磁性合金、その製造方法および磁心 |
JP2003142565A (ja) * | 2001-10-31 | 2003-05-16 | Japan Aviation Electronics Industry Ltd | 基板ホルダ |
JP2006276669A (ja) * | 2005-03-30 | 2006-10-12 | Shin-Etsu Engineering Co Ltd | 粘着チャック装置及びそれを備えた基板貼り合わせ機 |
-
2007
- 2007-07-02 JP JP2007173994A patent/JP4906102B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP2009016430A (ja) | 2009-01-22 |
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